Claims
- 1. A method of fabricating a laminated bus bar, comprising the steps of:
- stacking together in alternate layers a plurality of plate conductors of varied surface areas and a plurality of plates of dielectric material,
- said plates of dielectric material having surface areas smaller than adjacent plate conductors of relatively greater surface areas and larger than adjacent plate conductors of relatively smaller surface areas,
- encapsulating said plate conductors and said plates of dielectric material in a solidifiable dielectric medium,
- drilling apertures through said solidifiable medium and at least said plate conductors of relatively larger surface areas,
- forcefully driving conductive elongated contacts together with quantities of a non-rigidified solidifiable material into corresponding apertures,
- wedgingly engaging said contacts into electrically conductive relationship with said plate conductors having said apertures therethrough, the solidifiable material filling voids, and rigidifying said solidifiable material to secure said contacts in said apertures.
- 2. The method as recited in claim 1 and further including the step of:
- locating said quantities of solidifiable material adjacent said apertures prior to forcefully driving said contacts and said solidifiable material into said apertures.
- 3. The method as recited in claim 1 and further including the step of:
- locating said quantities of solidifiable material on said contacts prior to forcefully driving said contacts and said solidifiable material into said apertures.
Parent Case Info
This application is a division of Ser. No. 290,013 filed Sept. 18, 1972, now U.S. Pat. No. 3,893,233 issued July 8, 1975, which is a continuation-in-part of Ser. No. 152,145 filed June 11, 1971, now abandoned.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
290013 |
Sep 1972 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
152145 |
Jun 1971 |
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