Claims
- 1. A method of forming an epidermal abrasion device mold, comprising:depositing in succession a first metal and a second metal on an epidermal abrasion device; and separating said epidermal abrasion device from said mold material to yield a mold.
- 2. A method of forming an epidermal abrasion device mold, comprising:depositing a first metal in the form of tungsten on an epidermal abrasion device and a second metal in the form of nickel on said tungsten; and separating said epidermal abrasion device from said mold material to yield a mold.
- 3. A method of forming an epidermal abrasion device mold, comprising:depositing mold material on an epidermal abrasion device; and separating said epidermal abrasion device from said mold material to yield a mold, wherein said separating includes dissolving said epidermal abrasion device.
- 4. A method of forming an injection molded epidermal abrasion device, comprising:depositing mold material on an epidermal abrasion device; separating said epidermal abrasion device from said mold material to yield a mold; and forming an epidermal abrasion device within said mold, wherein the epidermal abrasion device formed within said mold is suitable for abrading a person's epidermis to facilitate transdermal drug delivery.
- 5. The method of claim 4 wherein said depositing includes depositing a metal on said epidermal abrasion device.
- 6. The method of claim 4 wherein said forming includes injecting a molding material into said mold.
- 7. The method of claim 6 wherein said forming includes injecting plastic into said mold.
- 8. A method of forming an injection molded epidermal abrasion device, comprising:depositing in succession a first metal and a second metal on said epidermal abrasion device; separating said epidermal abrasion device from said mold material to yield a mold; and forming an epidermal abrasion device within said mold.
- 9. A method of forming an injection molded epidermal abrasion device, comprising:depositing a first metal in the form of tungsten on said epidermal abrasion device and a second metal in the form of nickel on said tungsten; separating said epidermal abrasion device from said mold material to yield a mold; and forming an epidermal abrasion device within said mold.
- 10. The method of claim 9 wherein said forming includes injecting a molding material into said mold.
- 11. The method of claim 10 wherein said forming includes injecting plastic into said mold.
- 12. A method of forming an injection molded epidermal abrasion device, comprising:depositing mold material on an epidermal abrasion device; separating said epidermal abrasion device from said mold material to yield a mold, wherein said separating includes dissolving said epidermal abrasion device; and forming an epidermal abrasion device within said mold.
- 13. The method of claim 12 wherein said forming includes injecting a molding material into said mold.
- 14. The method of claim 13 wherein said forming includes injecting plastic into said mold.
Parent Case Info
This application is a continuation-in-part of Ser. No. 09/106,991, filed Jun. 29, 1998, now issued as U.S. Pat. No. 6,187,210, which is a continuation-in-part of Ser. No. 08/884,867, filed Jun. 30, 1997, now issued as U.S. Pat. No. 5,928,207.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0 698 375 |
Feb 1996 |
EP |
PCTUS0150349 |
Nov 2001 |
WO |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09/106991 |
Jun 1998 |
US |
Child |
09/715349 |
|
US |
Parent |
08/884867 |
Jun 1997 |
US |
Child |
09/106991 |
|
US |