METHOD OF FABRICATING ORGANIC ELECTRONIC DEVICE

Abstract

A fabricating method of organic electronic device is provided. The method comprises: providing a flexible substrate; fabricating a plurality of organic elements on the flexible substrate; fabricating a patterned spacing layer on the flexible substrate; and arranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIGS. 1A-1F are sectional views of the flow of the method of fabricating the organic electronic device according to the first embodiment of the present invention.

FIGS. 2A-2D are sectional views of the flow of the method of fabricating the organic electronic device according to the second embodiment of the present invention.

FIGS. 3A-3F are sectional views of the flow of the method of fabricating the organic electronic device according to the third embodiment of the present invention.

Claims

1. A method of fabricating an organic electronic device, comprising: providing a flexible substrate;fabricating a plurality of organic elements on the flexible substrate;fabricating a patterned spacing layer on the flexible substrate; andarranging a cover substrate on the patterned spacing layer, and sealing the edges of the flexible substrate and the cover substrate with a sealant, wherein the patterned spacing layer is used to maintain a space between the flexible substrate and the cover substrate.

2. The method of fabricating an organic electronic device as claimed in claim 1, wherein the step for fabricating the organic elements is performed before fabricating the patterned spacing layer, and the organic elements include thin film transistors (TFTs).

3. The method of fabricating an organic electronic device as claimed in claim 2, wherein the step for fabricating the patterned spacing layer includes covering the organic elements with the patterned spacing layer.

4. The method of fabricating an organic electronic device as claimed in claim 2, wherein after fabricating the patterned spacing layer and before arranging the cover substrate, further comprises fabricating a plurality of organic electro luminescent devices (OELDs) on the flexible substrate in an area without covered by the patterned spacing layer.

5. The method of fabricating an organic electronic device as claimed in claim 1, wherein the step for fabricating the organic elements is performed after fabricating the patterned spacing layer, the organic elements are formed on the flexible substrate in an area without covered by the patterned spacing layer, and the organic elements include organic electro luminescent devices.

6. The method of fabricating an organic electronic device as claimed in claim 1, wherein the process of fabricating the patterned spacing layer comprises: coating a spacing material layer on the flexible substrate; andpatterning the spacing material layer to form the patterned spacing layer.

7. The method of fabricating an organic electronic device as claimed in claim 5, wherein after coating the spacing material layer and before patterning the spacing material layer, further comprises pre-baking the spacing material layer.

8. The method of fabricating the organic electronic device as claimed in claim 5, wherein the process of coating the spacing material layer includes spin coating.

9. The method of fabricating an organic electronic device as claimed in claim 5, wherein the spacing material layer is photosensitive, and the process of patterning the spacing material layer includes photolithography and etching.

10. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes polymers.

11. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes photo-patterned polymers.

12. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes polymers mixed with microcolumns.

13. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes photo-patterned polymers and polymers mixed with microcolumns.

14. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes dichromated polyvinyl alcohol (DCPVA).

15. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes polyvinyl pyrrolidone (PVP).

16. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes polyimide (PI).

17. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes DCPVA and PVP.

18. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes DCPVA and PI.

19. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes PVP and PI.

20. The method of fabricating an organic electronic device as claimed in claim 5, wherein the material of the patterned spacing layer includes DCPVA, PVP, and PI.

21. The method of fabricating an organic electronic device as claimed in claim 1, wherein the process of fabricating the patterned spacing layer comprises: depositing the patterned spacing layer on the flexible substrate with a spacing material deposition source and a mask.

22. The method of fabricating an organic electronic device as claimed in claim 21, wherein the spacing material deposition source deposits the patterned spacing layer with a process comprising at least one of plasma enhanced chemical vapor deposition (PECVD), vacuum thermal evaporation (VTE), E-beam evaporation, sputtering or any combination thereof.

23. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes polymers.

24. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes organic oligomer.

25. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes polymers mixed with micro columns.

26. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes organic oligomer and polymers mixed with microcolumns.

27. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes parylene.

28. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes oxides.

29. The method of fabricating an organic electronic device as claimed in claim 21, wherein the material of the patterned spacing layer includes metal oxide derivatives.

30. The method of fabricating an organic electronic device as claimed in claim 1, wherein the process of fabricating the patterned spacing layer comprises: depositing a spacing material layer on the flexible substrate; andpatterning the spacing material layer to form the patterned spacing layer.

31. The method of fabricating an organic electronic device as claimed in claim 30, wherein the process of depositing the spacing material layer comprises at least one of PECVD, VTE, E-beam evaporation, sputtering or any combination thereof.

32. The method of fabricating an organic electronic device as claimed in claim 30, wherein the process of patterning the spacing material layer includes performing photo cracking or thermal cracking for the spacing material layer with a laser.

33. The method of fabricating an organic electronic device as claimed in claim 30, wherein the material of the patterned spacing layer includes polymers.

34. The method of fabricating an organic electronic device as claimed in claim 30, wherein the material of the patterned spacing layer includes polymers mixed with micro columns.

35. The method of fabricating an organic electronic device as claimed in claim 30, wherein the material of the patterned spacing layer includes polymers and polymers mixed with microcolumns.

36. The method of fabricating an organic electronic device as claimed in claim 30, wherein the material of the patterned spacing layer includes parylene.