Claims
- 1. A method of fabricating plain bearings comprising:preparing a metallic backing layer; forming a lead-free bearing material by casting a lead-free copper alloy onto the metallic backing layer having a copper content ranging from about 50 to 95 wt. %; forming a diffusion barrier layer on the bearing metal layer; and electroplating a lead-free overlay onto the diffusion barrier layer comprising a Sn-Cu alloy having a copper content ranging from about 3 to 20 wt. % and a tin content ranging from about 70 to 97 wt. %.
- 2. The method of claim 1 further characterized by electroplating of the overlay in a fluoroborate-free electroplating bath that is free of brighteners and which includes at least one non-ionic wetting agent, free alkylsulphonic acid, a fatty acid polyglycol ester, and a grain-refining agent comprising carboxylic acid.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 28 777 |
Jul 1997 |
DE |
|
Parent Case Info
This application is a division of application Ser. No. 09/108,785, filed Jul. 2, 1998.
US Referenced Citations (7)
Foreign Referenced Citations (7)
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Oct 1950 |
DE |
2261789 |
Jun 1974 |
DE |
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Nov 1978 |
DE |
196 22 166 A1 |
Dec 1997 |
DE |
566360 |
Dec 1944 |
GB |
9-125176 |
May 1997 |
JP |
WO 9823444 |
Jun 1998 |
WO |