Claims
- 1. In a process of fixing a copper salt on an article of synthetic polymers wherein the said article is subjected to the action of hydrogen sulfide under a positive gage pressure and then to the action of a copper salt, the method of improving the adhesion of the salt to the article which comprises treating the article with the salt in the presence of at least 0.1 percent by weight of a polyphenol.
- 2. Process according to claim 1 wherein the polyphenol is included in the salt solution.
- 3. The process of claim 2 wherein the concentration of polyphenol in the salt solution is between 3 and 6 percent by weight.
- 4. Process according to claim 1 wherein the article is pretreated with polyphenol before treatment with the salt solution.
- 5. Process according to claim 1 wherein the polyphenol is diphenol.
- 6. Process according to claim 1 wherein the polyphenol is 1,3,5-trihydroxy benzene.
- 7. Process according to claim 1 wherein the polyphenol is a natural or synthetic tannin.
- 8. Process according to claim 1 wherein the synthetic polymer is a polyamide.
- 9. Textile articles obtained by the process of claim 1 comprising a uniform, regular, continuous surface deposit of copper salt the thickness of which is between 0.01 and 0.5.mu..
- 10. Textile articles containing at least 0.05 percent by weight of an article obtained in accordance with the process of claim 8.
- 11. A method of improving the antistatic properties of a synthetic polymer which comprises impregnating the polymer with hydrogen sulfide under pressure and thereafter immersing the resulting product in an aqueous solution containing at least about 0.1 percent of a polyphenol and a copper salt which will react with the hydrogen sulfide to form an electrically conductive deposit on the synthetic polymer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
74.09384 |
Mar 1974 |
FR |
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Parent Case Info
The present invention relates to an improvement in the method of fixing copper salts on articles of synthetic polymers, such as described in copending U.S. Pat. application Ser. No. 353,730 filed Apr. 20, 1973, now U.S. Pat. No. 3,940,533, patented Feb. 24, 1976, application is a continuation-in-part.
US Referenced Citations (2)
Foreign Referenced Citations (1)
Number |
Date |
Country |
508,206 |
Sep 1930 |
DD |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
353730 |
Apr 1973 |
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