| Number | Name | Date | Kind |
|---|---|---|---|
| 2980984 | Shrader et al. | Apr 1961 | |
| 3042550 | Allen et al. | Jul 1962 | |
| 3251641 | Gaylord | May 1966 | |
| 3297902 | Beggs | Jan 1967 | |
| 3297906 | Schumacher | Jan 1967 | |
| 3525897 | Du Pre | Aug 1970 | |
| 3676569 | Thompson | Jul 1972 | |
| 3686727 | Say et al. | Aug 1972 | |
| 3795041 | Hennicke | Mar 1974 |
| Entry |
|---|
| J. J. Cuomo, "A Molybdenum To Copper Bond Utilizing Thermal Compression Gold Bonding," IBM Technical Disclosure Bulletin, vol. 7, No. 3, 8-1964, pp. 178, 179. |