Claims
- 1. A method for making an inkjet printhead nozzle member comprising the steps of:
- providing a composite structure containing a polymeric nozzle layer and an adhesive layer,
- coating the adhesive layer with a polymeric sacrificial layer,
- laser ablating the coated composite structure to form one or more nozzles therein, and
- removing the polymeric sacrificial layer from the composite structure.
- 2. The method of claim 1 wherein the nozzle layer is selected from the group consisting of polyimide, polyester, fluorocarbon polymer, and polycarbonate materials.
- 3. The method of claim 1 wherein the nozzle layer is from about 15 microns to about 200 microns thick.
- 4. The method of claim 1 wherein the adhesive layer is selected from the group consisting of phenolics, resorcinols, ureas, epoxies, ethylene-ureas, furanes, polyurethanes, silicones, ethylene-vinyl acetate, ethylene ethylacrylate, polypropylene, polystyrene, polyamides, polyesters, polyurethanes, and acrylics.
- 5. The method of claim 4 wherein the adhesive layer is phenolic butyral.
- 6. The method of claim 1 wherein the sacrificial layer is soluble by a solvent that does not react with and dissolve the adhesive layer and the nozzle layer.
- 7. The method of claim 6 wherein the sacrificial layer is a water soluble polymer.
- 8. The method of claim 7 wherein the sacrificial layer is polyvinyl alcohol.
- 9. The method of claim 7 wherein the sacrificial layer is polyethylene oxide.
- 10. The method of claim 9 wherein the polyethylene oxide is used in conjunction with a surfactant.
- 11. The method of claim 7 further comprising removing the sacrificial layer from the composite by soaking the composite in water for a period of time sufficient to dissolve the sacrificial layer.
- 12. The method of claim 7 further comprising removing the sacrificial layer from the composite by directing jets of water at the sacrificial layer until the sacrificial layer is substantially removed from the adhesive layer.
- 13. The method of claim 1 wherein the polymeric sacrificial layer is from about one micron to about five microns thick.
- 14. The method of claim 1 wherein the laser ablation is accomplished with a laser selected from the group consisting of eximer and frequency multiplied YAG lasers.
- 15. The method of claim 1 wherein the laser ablation is accomplished at a power of from about 100 millijoules per centimeter squared to about 5,000 millijoules per centimeter squared.
- 16. The method of claim 1 wherein the laser ablation is accomplished at a wavelength of from about 150 nanometers to about 400 nanometers.
- 17. The method of claim 1 wherein the laser ablation is accomplished by applying the laser energy in pulses lasting from about one nanosecond to about 200 nanoseconds.
- 18. The method of claim 1 wherein the nozzle layer comprises nozzles and flow features.
- 19. The method of claim 1 further comprising applying an adhesion promoter to the adhesive layer prior to coating the adhesive layer with the sacrificial layer.
- 20. The method of claim 19 wherein the adhesion promoter is a reactive silane composition.
- 21. A method of attaching the nozzle member formed by the method of claim 1 to a silicon substrate comprising the steps of:
- applying an adhesion promoter to the silicon substrate, and
- attaching the nozzle member to the silicon substrate by placing the adhesive layer against the silicon substrate, and pressing the nozzle member against the silicon substrate with a heated platen.
- 22. The method of claim 21 wherein the adhesion promoter is a reactive silane composition.
- 23. A method for forming one or more inkjet nozzles in a polymeric material comprising the steps of:
- coating one surface of the polymeric material with an adhesive layer,
- coating the adhesive layer with a polymeric sacrificial layer, thereby forming a three layer composite, and
- laser ablating one or more apertures in the composite.
- 24. The method of claim 23 wherein the polymeric material is selected from the group consisting of polyimide, polyester, fluorocarbon polymer, and polycarbonate.
- 25. The method of claim 23 wherein the adhesive layer is selected from the group consisting of phenolics, resorcinols, ureas, epoxies, ethylene-ureas, furanes, polyurethanes, silicones, ethylene-vinyl acetate, ethylene ethylacrylate, polypropylene, polystyrene, polyamides, polyesters, polyurethanes, and acrylics.
- 26. The method of claim 23 wherein the sacrificial layer is polyvinyl alcohol.
- 27. The method of claim 23 wherein the sacrificial layer is polyethylene oxide.
- 28. The method of claim 27 wherein the polyethylene oxide is used in conjunction with a surfactant.
- 29. The method of claim 27 further comprising removing the sacrificial layer from the adhesive layer by directing jets of water at the sacrificial layer until the sacrificial layer is substantially removed from the adhesive layer.
- 30. The method of claim 23 wherein the laser ablation is accomplished with a laser selected from the group consisting of eximer and frequency multiplied YAG lasers.
- 31. The method of claim 23 further comprising applying an adhesion promoter to the adhesive layer prior to coating the adhesive layer with the sacrificial layer.
- 32. The method of claim 23 wherein the adhesion promoter is a reactive silane composition.
- 33. A method of attaching the polymeric material formed by the method of claim 23 to a silicon substrate comprising the steps of:
- applying an adhesion promoter to the silicon substrate, and
- attaching the polymeric material to the silicon substrate by placing the adhesive layer against he silicon substrate, and pressing the polymeric material against the silicon substrate with a heated platen.
- 34. The method of claim 23 wherein the adhesion promoter is a reactive silane composition.
Parent Case Info
This application is a continuation-in-part application of U.S. patent application Ser. No. 08/519,906, filed Aug. 28, 1995, the disclosure of which is incorporated herein by reference.
US Referenced Citations (12)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0 178 596 A2 |
Oct 1985 |
EPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
519906 |
Aug 1995 |
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