Claims
- 1. A method of etching a surface groove pattern in the homogeneous material surface of a ball comprising the steps of: supporting an undeformable, incompressible and noncorrodible template at a short distance from said ball surface in the area corresponding to where a surface pattern constituting a groove pattern is desired to be formed when the template is provided with canals according to the desired pattern, flowing an etching liquid through said canals in the template along the ball surface in a laminar flow path, wherein the short distance between the template into which said canals are formed and the ball surface simultaneously minimizes the effect of said etching liquid flowing between the template and the ball surface away from said canals, by limiting the length and effective flow velocity of the etching liquid flowing away from said canals.
- 2. A method according to claim 1 wherein the etching liquid is aqueous ferric chloride etching solution of a concentration between 10 and 50 weight percent at a temperature between about 15.degree. C. and 75.degree. C., etching liquid velocity being between about 0.5 and 10 meters per second and etching times between 10 seconds and 5 minutes.
- 3. A method according to claim 2 wherein the groove pattern is a loxodromic pattern, said ball having a diameter between 2 and 8 millimeters.
- 4. A method of etching a surface as claimed in claim 1 wherein said groove pattern is formed along the direction of the laminar flow of said etching fluid.
- 5. A method of etching a surface as claimed in claim 1 wherein the etching rate is from 0.1 to 1 microns per second.
- 6. A method of etching a surface as in claim 2 wherein the surface of the ball being etched is comprised of metal.
- 7. A method of etching a surface as in claim 6 wherein said metal is steel.
- 8. A method of etching a surface as in claim 1 wherein the short distance between the template and the ball surface ranges between about 0.1 mm and about 0.5 mm.
- 9. A method of etching a surface as in claim 1 wherein the etching liquid has a viscosity ranging between about 10.sup.-.sup.3 and about 5.1.sup.-.sup.3 N.s.m.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7205289 |
Apr 1972 |
NL |
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Parent Case Info
This is a continuation-in-part of United States patent application Ser. No. 352,331, filed on Apr. 18, 1973, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3043362 |
Mennesson |
Jul 1962 |
|
5751313 |
DiBenedetto et al. |
Aug 1973 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
352331 |
Apr 1973 |
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