Claims
- 1. A method of forming enclosed nanofluidic channels, said method comprising:
providing a first substrate having a layer of a first material thereon; providing a second substrate; forming a slot along said second substrate, said slot being formed by nanolithography and etching; and bonding said first substrate to said second substrate such that said layer of said first material on said first substrate is adjacent said slot on said second substrate to define an enclosed nanofluidic channel therethrough.
- 2. The method according to claim 1, further comprising:
removing said first substrate from said layer of said first material after said bonding.
- 3. The method according to claim 1, further comprising:
forming a plurality of posts within said slot prior to said bonding of said first substrate to said second substrate.
- 4. The method according to claim 1 wherein said step of forming said slot along said second substrate includes forming a slot having both nanoscale and microscale dimensions.
- 5. The method according to claim 1, further comprising:
applying a metallic coating to at least a portion of one of said first substrate and said second substrate prior to said bonding to define at least one optical slit.
- 6. The method according to claim 1 wherein at least one of said first substrate and said second substrate includes an aperture formed therethrough to permit fluid communication with said enclosed nanofluidic channel.
- 7. A method of forming enclosed nanofluidic channels, said method comprising:
providing a first substrate having a layer of a first material thereon; providing a second substrate; forming a slot having a plurality of fiberous nanostructures extending therein along said second substrate, said slot and said plurality of fiberous nanostructures being formed by etching; and bonding said first substrate to said second substrate such that said layer of said first material on said first substrate is adjacent said slot on said second substrate to define an enclosed nanofluidic channel therethrough.
- 8. The method according to claim 7, further comprising:
removing said first substrate from said layer of said first material after said bonding.
- 9. The method according to claim 7 wherein said step of forming said slot along said second substrate includes forming a slot having both nanoscale dimensions and microscale dimensions.
- 10. The method according to claim 7, further comprising:
applying a metallic coating to at least a portion of one of said first substrate and said second substrate prior to said bonding to define at least one optical slit.
- 11. The method according to claim 7 wherein at least one of said first substrate and said second substrate includes an aperture formed therethrough to permit fluid communication with said enclosed nanofluidic channel.
- 12. A method of forming enclosed nanofluidic channels, said method comprising:
providing a first substrate having a layer of a first material thereon; providing a second substrate having a layer of a second material thereon; forming a slot into said layer of said second material, said slot being formed by stamping; and bonding said first substrate to said second substrate such that said layer of said first material on said first substrate is adjacent said slot on said second substrate to define an enclosed nanofluidic channel therethrough.
- 13. The method according to claim 12, further comprising:
removing said first substrate from said layer of said first material after said bonding.
- 14. The method according to claim 12 wherein said step of forming a slot into said layer of said second material includes forming a slot having both nanoscale dimensions and microscale dimensions.
- 15. The method according to claim 12 wherein at least one of said first substrate and said second substrate includes an aperture formed therethrough to permit fluid communication with said enclosed nanofluidic channel.
- 16. The method according to claim 12, further comprising:
applying a metallic coating to at least a portion of one of said first substrate and said second substrate prior to said bonding to define at least one optical slit.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/379,878, filed on May 13, 2002. The disclosure of which is incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60379878 |
May 2002 |
US |