In some manufacturing techniques, composite components formed of resin and fiber are cured, then attached to another component by adhesive. The other component might be metal or another composite part. When joining the parts, it is important to maintain a desired bond line thickness between the parts. The bond line is a thin uniform clearance between the two parts to provide volume for the adhesive.
In the past, various means have been employed to provide a bond line of uniform thickness. One approach has been to form protuberances or nubs on a side of one of the parts to be joined. The heights of the nubs must be carefully controlled to provide a desired standoff between the two bonding surfaces. In one technique, the nubs are formed by machining dimples or depressions in a forming tool. The substrate layers of the composite part are laid on the forming tool and cured. Each recess creates a nub on the composite part that has the height of the recess. While workable, machining the forming tool is time consuming and expensive. For example, an aircraft may have a large number of forming tools that would have to be machined in that manner.
In this invention, nubs are created on a substrate layer of a composite part using a conventional forming tool without any additional machined recesses. Holes are formed in a peel ply, which is a layer that temporarily attaches to the composite part during curing and is later removed. The peel ply can be a standard resin composite fabric peel ply or a non-standard material as long as the material will conform to the tool surface and withstand the curing process. The thickness of the peel ply determines the heights of the nubs. The holes in the peel ply are placed in a desired pattern and with a desired shape and width.
The peel ply is placed on a standard forming tool, then one or more substrate layers of the composite part are placed on the peel ply. The holes in the peel ply are blocked on one side by the forming tool and on the other side by the composite part substrate layers.
Resin is introduced to the holes. Preferably, the resin source comprises pre-impregnated uncured resin in the substrate layers. The peel ply could also be pre-impregnated with uncured resin. Applying heat and pressure causes the resin to flow into the holes and cure. After curing, a technician pulls the peel ply away from the cured substrate layers, exposing the nubs that are formed where the holes in the peel ply existed. The nubs provide a uniform height standoff for an adhesive bond line.
Referring to
Peel ply 13 comprises a layer of a material that should be sufficiently flexible to conform to the surface of forming tool 15 and also capable of withstanding heat and pressure during a curing process. The peel ply material may be a permeable material, such as woven fiberglass, or it could be non permeable material, such as a solid plastic or acetate layer. Peel ply 13 has a uniform thickness. In one embodiment, peel ply 13 comprises woven fiberglass fabric that is pre-impregnated with a resin. Alternately, the resin could be eliminated.
Referring to
In the method of this operation, peel ply 13 is placed on forming tool 15. As illustrated in
The technician then cures substrate layers 11 and peel ply 13 in a conventional manner. For example, this may be done by enclosing substrate layers 11 and peel ply 13 in a vacuum bag, evacuating the bag to create pressure, then applying heat. Other conventional curing processes could also be utilized.
During the curing process, the heat causes the resin to flow from substrate layers 11 and peel ply 13, if it is pre-impregnated, into holes 17, filling holes 17. The resin is allowed to cure, causing it to become rigid. The resin within holes 17 bonds to substrate layers 11, but not to forming tool 15.
Then, the technician pulls peel ply 13 from substrate layers 11, as illustrated in
After peel ply 13 is removed, adhesive (not shown) is placed between surface 22 of substrate layers 11 and another component (not shown). The adhesive may be a liquid or a film. The components are forced together with pressure and the adhesive allowed to cure. The adhesive flows around nubs 23 into the spaces between surface 22 and the other component, these spaces providing the desired bond line thickness for the particular adhesive in the application.
The invention has significant advantages. The nubs provide an accurate standoff to create an adhesive bond line of uniform thickness. The nubs are readily formed on the component by using a peel ply layer. This method forms nubs less costly than the prior approach of machining recesses on the surface of the forming tool.
While the invention has been shown in only one of its forms, it should be apparent to those skilled in the art that it is not so limited but is susceptible to various changes without departing from the scope of the invention.