Number | Name | Date | Kind |
---|---|---|---|
3755704 | Spindt et al. | Aug 1973 | |
4091305 | Poley et al. | May 1978 | |
4099082 | Chodil et al. | Jul 1978 | |
4183125 | Meyer et al. | Jan 1980 | |
4422731 | Droguet et al. | Dec 1983 | |
4451759 | Heynisch | May 1984 | |
4857799 | Spindt et al. | Aug 1989 | |
4940916 | Borel et al. | Jul 1990 | |
4955523 | Calomagno et al. | Sep 1990 | |
5063327 | Brodie et al. | Nov 1991 | |
5194780 | Meyer | Mar 1993 | |
5225820 | Clerc | Jul 1993 | |
5232549 | Cathey et al. | Aug 1993 | |
5329207 | Cathey et al. | Jul 1994 | |
5371433 | Horne et al. | Dec 1994 | |
5448131 | Taylor et al. | Sep 1995 | |
5484314 | Farnworth | Jan 1996 | |
5486126 | Cathey et al. | Jan 1996 |
Entry |
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Tummala et al., Microelectronics Packaging Handbook, 1989, pp. 393-395. |