Method of grinding rear side of semiconductor wafer

Abstract

Disclosed is a method of grinding the rear side of a semiconductor wafer, the front side of which has bumps formed thereon. It comprises the steps of: preparing semiconductor wafers whose front surfaces have a plurality of circuits formed in their lattice patterns; coating the front side of a selected semiconductor wafer with a resist material to form a resist layer thereon; forming a plurality of holes in each section of the resist layer to be formed bumps corresponding to the circuits by removing the resist; plating at the holes with a metal to form bumps; putting the semiconductor wafer on a selected chuck table with its front side formed resist layer laid on the chuck table in a grinding machine; and grinding the rear side of the semiconductor wafer. The bumps are lower than the thickness of the resist layer, and therefore, they reach short of the front surface of the semiconductor wafer, and therefore, the semiconductor wafer can be protected from cracking, which otherwise would be caused by concentration of the stress to the bumps on the front side of the semiconductor wafer while grinding the rear side thereof.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a method of grinding the rear side of a semiconductor wafer, on the front side of which bumps are formed.

[0003] 2. Related Arts

[0004] Referring to FIG. 11, a semiconductor wafer W1 has ICs, LSIs or other circuits formed on its front side, and a protection tape T1 is applied to the front side of the semiconductor wafer W1. The semiconductor wafer W1 is put on a chuck table 50 with its front side down, and the semiconductor wafer W1 is ground to a predetermined thickness by applying the grindstone 51 to its rear side and by rotating the grindstone 51.

[0005] Referring to FIG. 12, a semiconductor wafer W2 has terminals 52 (called “bumps”) formed on its front side. A protection tape T2 whose adhesive layer is thick enough to bury the bumps 52, is applied to the front side. Alternatively a protection tape coated with ultraviolet-sensitive glue may be attached to the front side of the semiconductor wafer W2, and the tape is exposed to ultraviolet rays prior to the grinding so that the glue may be set. Thus, the stress applied to each bump is reduced in grinding so that the semiconductor wafer W2 may be prevented from cracking.

[0006] In either case the stress applied to the bumps 52 cannot be removed completely, and therefore, the cracking of semiconductor wafers cannot be prevented completely. Also, the necessity of using extra tapes as described above is economically disadvantageous.

[0007] It is, therefore, required that the cracking of semiconductor wafers having bumps formed on their front sides be completely prevented in grinding their rear sides without involving extra costs.

SUMMARY OF THE INVENTION

[0008] To meet such requirement a method of grinding the rear side of a semiconductor wafer according to the present invention comprises the steps of: preparing semiconductor wafers whose front surfaces have a plurality of circuits formed in their lattice patterns; coating the front side of a selected semiconductor wafer with a resist material to form a resist layer thereon; forming a plurality of holes in each section of the resist layer to be formed bumps corresponding to the circuits by removing the resist; plating at the holes with a metal to form bumps; putting the semiconductor wafer on a selected chuck table with its front side formed resist layer laid on the chuck table in a grinding machine; and grinding the rear side of the semiconductor wafer.

[0009] The method may further comprise the step of applying a protection tape to the resist layer of the front side of the semiconductor wafer, thus the rear side of the semiconductor wafer being ground with the tape-applied, front side of the semiconductor wafer laid on the chuck table.

[0010] The bumps are lower than the thickness of the resist layer, and the bumps may be formed by plating at the holes with gold or a soldering metal, each bump being 50 to 200 μm in diameter, and 50 to 200 μm in height.

[0011] Other objects and advantages of the present invention will be understood from the following description of one preferred embodiment of the present invention, which is shown in accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWING

[0012] FIG. 1 is a perspective view of a semiconductor wafer, on which bumps are to be formed;

[0013] FIG. 2 is a front view of the semiconductor wafer, one surface of which a resist layer is formed;

[0014] FIG. 3 illustrates, in section, how small holes are made in the resist layer of the semiconductor wafer;

[0015] FIG. 4 illustrates, in section, how bumps are made in the small holes;

[0016] FIG. 5 is a perspective view of the semiconductor wafer having the bumps formed thereon;

[0017] FIG. 6 shows the semiconductor wafer which has a protection tape applied to its resist layer to cover the bumps;

[0018] FIG. 7 is a perspective view of a grinding machine, which is used in grinding the rear sides of semiconductor wafers with bumps formed on their front sides;

[0019] FIG. 8 illustrates, in section, a semiconductor wafer laid on a selected chuck table in the grinding machine;

[0020] FIG. 9 is a perspective view of a grinding wheel having pieces of coarse or fine grindstone fixed to its lower side;

[0021] FIG. 10 illustrates, in section, a semiconductor wafer from which the resist layer is removed to expose the bumps;

[0022] FIG. 11 illustrates how the rear side of a bump-less semiconductor wafer is ground; and

[0023] FIG. 12 illustrates how the rear side of a semiconductor wafer having bumps formed on its front side is ground.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

[0024] Referring to FIG. 1, a semiconductor wafer W has a plurality of crossing streets S formed on its front side, and each square section C has a circuit pattern formed therein.

[0025] As seen from FIG. 2, a resist material is coated over the whole surface of a semiconductor wafer W by a resist coater such as a spinning coater to form a resist layer 1 thereon. The resist thickness is formed larger than the height of bumps which are formed later.

[0026] With use of an aligner such as stepping projection alignor, minute holes 2 as many as bumps to be formed later are made, as seen from FIG. 3, removing the resist at the corresponding positions to be formed bumps by exposure and developing. The diameter of the minute hole 2 is equal to that of the bump, which is to be made later.

[0027] Bumps 3 are made by plating at the minute holes 2 with a metal as shown in FIG. 4. Specifically bumps 3 are made with gold or soldering metal, and each bump 3 is 50 to 200 μm in diameter, and 50 to 200 μm in height. In FIG. 5 all minute holes 2 are filled with bumps 3.

[0028] Then, the rear side of the semiconductor wafer W is ground without removing the resist layer 1. The bumps 3 reach short of the upper surface of the resist layer 1, allowing the rear side 4 of the semiconductor wafer W to be ground without applying a protection tape T to the front side of the semiconductor wafer on which the bumps 3 are formed. Thus, the semiconductor wafer of FIGS. 4 and 5 can be ground as it is.

[0029] In a case that a protection tape T is applied to the front side of a semiconductor wafer W, the protection tape T used need not be a special type having thick adhesive layer, and an ordinary protection tape can be used as is the case with the grinding of a bump-less semiconductor wafer. The manner in which a semiconductor wafer having no protection tape applied to its front side is ground is described below.

[0030] In grinding the rear side of a semiconductor wafer W, a grinding machine 10 as shown in FIG. 7 can be used, and a plurality of semiconductor wafers W as shown in FIGS. 4 and 5 are put in a cassette 11.

[0031] A putting in-and-taking out means 12 takes semiconductor wafers one by one to turn the semiconductor wafer W upside down and put it on a positioning means 13. After the semiconductor wafer W is oriented there, a first transferring means 14 transfers the semiconductor wafer W to a selected chuck table 15 where the semiconductor wafer W is laid with its rear side 4 up, as seen from FIG. 8.

[0032] The chuck tables 15, 16 and 17 are rotatably supported by a turntable 18. Every time the turntable 18 is rotated a predetermined angle counterclockwise (120 degrees in the example of FIG. 7) to put semiconductor wafers W one after another under a coarse grinding means 20.

[0033] The coarse grinding means 20 is carried by a carrier 24, which rides on a pair of vertical, parallel guide rails 22 laid on an upright wall 21. The carrier 24 can be raised or lowered by a drive motor 23, and accordingly the coarse grinding means 20 can be raised or lowered. The coarse grinding means 20 has a grinding wheel 27 attached to its spindle 25 via an associated mount 26. The grinding wheel 27 comprises an annular body 28 and pieces of grindstone 29 attached to the bottom of the annular body 28, as shown in FIG. 9.

[0034] While rotating the spindle 25, the grindstone 29 of the coarse grinding means 20 is lowered to be pushed against the rear side of the semiconductor wafer W, thereby effecting the coarse grinding on the semiconductor wafer W.

[0035] After finishing the coarse grinding, the turntable 18 is made to turn 120 degrees counterclockwise, and then, the coarse-ground wafer W is put under a fine grinding means 30.

[0036] The fine grinding means 30 is carried by a carrier 33, which rides on a pair of vertical, parallel guide rails 31 laid on the upright wall 21. The carrier 33 can be raised or lowered by a drive motor 32, and accordingly the fine grinding means 30 can be raised or lowered. The fine grinding means 30 has a grinding wheel 36 attached to its spindle 34 via an associated mount 35. The grinding wheel 36 comprises an annular body 37 and pieces of fine grindstone 38 attached to the bottom of the annular body 37, as shown in FIG. 9.

[0037] While rotating the spindle 34, the grindstone 38 of the fine grinding means 30 is lowered to be pushed against the rear side 4 of the semiconductor wafer W, thereby effecting the fine grinding on the semiconductor wafer W.

[0038] After finishing the fine grinding, the semiconductor wafer W is transferred to a washing means 41 by a second transporting means 40 to remove the debris from the semiconductor wafer W. The semiconductor wafer W thus cleaned is put in a cassette 42 by a putting in-and-taking out means 12.

[0039] As described above, all semiconductor wafers are taken out of the cassette 11 to be coarse- and fine-ground sequentially, and the finished semiconductor wafers are put in the cassette 42.

[0040] The rear side of each semiconductor wafer is ground while the bumps 3 are buried in the resist layer, thus preventing concentration of the stress to each bump, and permitting even distribution of the stress over the semiconductor wafer with the result that no cracking is caused in the semiconductor wafer.

[0041] Extra protection tapes having thick protection adhesive layers or ultraviolet-settable protection layers need not be used. This is advantageous to economy and productivity. The resist layer functions like a protection tape, and therefore the semiconductor wafer can be put on a chuck table with its resist layer facing on the chuck table without the necessity of applying a protection tape to the semiconductor wafer. This will improve significantly the productivity.

[0042] All semiconductor wafers are taken out one by one from the cassette 42 to be transferred to a resist removing station where the resist layer 1 is removed from each semiconductor wafer, thus providing the semiconductor wafer W having its bumps 3 protruding from its front surface.

[0043] As may be understood from the above, the method of grinding the rear side of a semiconductor wafer according to the present invention provides the following advantages:

[0044] The grinding method permits the grinding of the rear side of the semiconductor wafer without removing the resist layer from its front surface, not allowing the stress to be concentrated to the bumps of the semiconductor wafer. Thus, the semiconductor wafer is guaranteed to be free of any cracking. Extra protection tapes need not be used, and accordingly the certainty, productivity and economy can be improved.

[0045] The resist layer functions like an extra type of protection tape, and therefore the semiconductor wafer can be put on a chuck table with its resist layer facing on the chuck table without the necessity of applying an extra type of protection tape to the semiconductor wafer. This will improve significantly the economy and productivity.

[0046] In a case that a protection tape is applied to the resist layer, the resist layer can be removed along with the protection tape from the semiconductor wafer.

Claims

1. A method of grinding the rear side of a semiconductor wafer comprising the steps of: preparing semiconductor wafers whose front surfaces have a plurality of circuits formed in their lattice patterns; coating the front side of a selected semiconductor wafer with a resist material to form a resist layer thereon; forming a plurality of holes in each section of the resist layer to be formed bumps corresponding to the circuits by removing the resist; plating at the holes with a metal to form bumps; putting the semiconductor wafer on a selected chuck table with its front side formed resist layer laid on the chuck table in a grinding machine; and grinding the rear side of the semiconductor wafer.

2. A method of grinding the rear side of a semiconductor wafer according to claim 1, wherein it further comprises the step of: applying a protection tape to the resist layer of the front side of the semiconductor wafer, thus the rear side of the semiconductor wafer being ground with the tape-applied, front side of the semiconductor wafer laid on the chuck table.

3. A method of grinding the rear side of a semiconductor wafer according to claim 1, wherein the bumps are lower than the thickness of the resist layer.

4. A method of grinding the rear side of a semiconductor wafer according to claim 2, wherein the bumps are lower than the thickness of the resist layer.

5. A method of grinding the rear side of a semiconductor wafer according to claim 1, 2, 3 or 4, wherein the bumps are formed by plating with gold or a soldering metal, each bump being 50 to 200 μm in diameter, and 50 to 200 μm in height.