Claims
- 1. Method of economically producing, with high regularity, a layer on at least one substrate by epitaxial growth, comprising the steps of:
- dispersing a layer-forming material in a liquid and providing a predetermined quantity of said liquid containing the layer-forming material in a supply chamber;
- forcing the liquid containing the layer-forming material, under the influence of forces externally applied to said liquid, from said supply chamber into at least one gap-like channel on a wall of which said substrate is firmly held; and
- causing epitaxial crystal growth to take place on said substrate only while said predetermined quantity of liquid containing the layer-forming material flows continuously and uniformly along said substrate until said supply chamber is empty, said liquid being caused to flow under the influence of said externally applied forces from said supply chamber outward as a substantially unidirectional stream, under pressure from opposition to said forces produced by confinement of said liquid by the gaplike configuration of said channel along and past the surface of said substrate at a rate controllable by said applied forces while under more than atmospheric pressure, and out of said channel to a drain chamber.
- 2. A method as defined in claim 1 in which the liquid is caused to flow under pressure along and past the substrate surface to be coated under the effect of centrifugal forces while both said surface and the liquid are rotated in a rotary device, said substrate being located away from the center of rotation, the said liquid being dispensed from a supply chamber which is nearer the center of rotation of the rotary device than said substrate and drained into said drain chamber at locations farther from the center of rotation than said substrate, so that the liquid flows past the substrate surface to be coated under the influence of centrifugal force.
- 3. A method as defined in claim 1 in which the liquid is caused to flow from the supply chamber cavity along and past the substrate surface and into the drain chamber under gas pressure.
- 4. Method as defined in claim 1, in which the substrate is so positioned in a channel connecting the supply chamber with the drain chamber that the surface of said substrate to be coated is flushed by the liquid flowing through the channel.
- 5. Method as defined in claim 4, in which the substrate surface to be coated is disposed in a radial plane, or oriented with a radial component.
- 6. Method as defined in claim 4, in which two substrates are arranged at oppositely located channel walls in such a way that their surfaces to be coated are parallel or inclined to each other and spaced from each other and so that the liquid may flow under pressure through the space between their respective surfaces.
- 7. A method as defined in claim 1 in which prior to the step of forcing the liquid containing the layer-forming material into at least one gap-like channel, the width of said channel is adjusted.
Priority Claims (1)
Number |
Date |
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Kind |
2445146 |
Sep 1974 |
DEX |
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Parent Case Info
This is a continuation of application Ser. No. 613,929, filed Sept. 16, 1975.
US Referenced Citations (8)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2314109 |
Oct 1973 |
DEX |
49-51180 |
May 1974 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Blum, IBM Tech. Discl. Bull., vol. 15 #7, Dec. '72, p. 2091. |
Continuations (1)
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Number |
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Parent |
613929 |
Sep 1975 |
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