Claims
- 1. In a thin film magnetic film the method of improving its magnetoresistive effect, comprising:
- forming a thin magnetic film upon a suitable substrate, initially said film consisting of separated grains, at a temperature that is in the range of approximately 300.degree. C. to 320.degree. C.;
- increasing the thickness of said thin magnetic film until the thin magnetic film becomes continuous, with the boundary height between grains substantially greater than a pre-determined thin magnetic film thickness;
- rotating said substrate about an axis that is perpendicular to the plane of said substrate;
- directing an ion beam upon said thin magnetic film at an angle with respect to the normal to the plane of said substrate; and
- ion-milling said thin magnetic film to said predetermined thin magnetic film thickness in a manner that modifies the usual grain structure for a film of that thickness.
- 2. The method of claim 1 in which said boundary height is approximately 1000 .ANG..
- 3. The method of claim 1 in which said ion-milling is performed with the direction of ion bombardment being directed approximately 60.degree. to the normal to the plane of said substrate.
- 4. The method of claim 1 in which said predetermined thin magnetic film thickness is approximately 320 .ANG..
- 5. In a thin magnetic film the method of improving the magnetoresistive effect, comprising:
- depositing a magnetic film upon a suitable substrate as a series of separated grains at a temperature in the range of approximately 300.degree. C. to 320.degree. C.;
- continuing the deposition of said magnetic film until said magnetic film becomes continuous with the boundary height between grains being substantially greater than a predetermined thin magnetic film thickness;
- rotating said substrate about an axis that is normal to its surface; and
- directing an ion beam upon the surface of said magnetic film at an angle that is inclined with respect to said axis for ion milling said magnetic film to said predetermined thin magnetic film thickness.
- 6. The method of claim 5 in which said predetermined thin magnetic film thickness is in the range of 250 .ANG. to 400 .ANG..
- 7. The method of claim 5 in which said ion milling is performed with the direction of ion bombardment being directed at a low angle of incidence with respect to the surface of said magnetic film.
- 8. The method of claim 5 in which said deposition temperature is approximately 300.degree. C.;
- said grain boundary height is approximately 980 .ANG.; and
- said predetermined thin magnetic film thickness is approximately 320 .ANG..
Government Interests
The invention described herein was made in the course of, or under, a contract with the Department of the Navy.