Claims
- 1. A method of making a combination electrode comprising the steps of depositing a first metallic layer on a first surface area of an insulating substrate, depositing a first solid electrolyte layer on said metallic layer and depositing a pH glass layer on said electrolyte layer, depositing a second metallic layer on a second electrically isolated surface area of said insulating substrate, depositing a second solid electrolyte layer on said second metallic layer, depositing a second glass layer on said second electrolyte layer, said second glass layer having a coefficient of thermal expansion mismatched with respect to a coefficient of thermal expansion of said second electrolyte layer to produce differential expansion therebetween causing cracking of said second glass layer during a predetermined temperature cycle and exposing said electrode to said temperature cycle, said second metallic layer, said second electrolyte layer and said second glass layer being electrically isolated from said first metallic layer, said first electrolyte layer and said pH glass layer.
- 2. A method of making a combination electrode as set forth in claim 1 wherein said pH glass layer and said second glass layer are deposited by RF sputtering.
- 3. A method of making a combination electrode as set forth in claim 1 and including the further steps of providing separate electrical connections for said first second metallic layers and encapsulating said substrate, said first and second metallic layers, and a portion of each of said pH glass and said second glass layers while exposing said electrical connections.
- 4. A method of making a combination electrode as set forth in claim 1 and including the further step of supporting a thermal compensating means on a third electrically isolated surface area of said substrate.
- 5. A method of making a combination electrode as set forth in claim 4 and including the further steps of providing an electrical connection for said thermal compensating means and encapsulating said thermal compensating means while exposing said electrical connection for said thermal compensating means.
- 6. A method of making a combination electrode comprising the steps of depositing a first metallic layer on a first surface area of an insulating substrate, depositing a first solid electrolyte layer on said metallic layer and depositing an ion responsive layer on said electrolyte layer, depositing a second metallic layer on a second electrically isolated surface area of said insulating substrate, depositing a second solid electrolyte layer on said second metallic layer and depositing an ion conducting path layer on said second electrolyte layer, said second metallic layer, said second electrolyte layer and said ion conducting path layer being electrically isolated from said first metallic layer, said first electrolyte layer and said ion responsive layer.
- 7. A method of making a combination electrode as set forth in claim 6 wherein said ion responsive layer is deposited by RF sputtering.
- 8. A method of making a combination electrode as set forth in claim 6 and including the further steps of providing separate electrical connections for said first and second metallic layers and encapsulating said substrate, said first and second metallic layers, and a portion of each of said ion responsive layer and said ion conducting path layer while exposing said electrical connections.
CROSS REFERENCE TO COPENDING APPLICATION
The present application is a division of application Ser. No. 552,284 filed on Feb. 24, 1975, now abandoned upon the filing of continuation application Ser. No. 666,166 on Mar. 11, 1976 and assigned to the same assignee as the present application.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
552284 |
Feb 1975 |
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