BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objectives and features of the present invention will become more apparent from the following description of preferred embodiments thereof with reference to the accompanying drawings, throughout which like parts are designated by like reference numerals, and wherein:
FIG. 1 is an exploded perspective view of a reclining device to which the present invention is applied;
FIG. 2 is a perspective view of a semiconductor laser beam machine, depicting the condition in which heat treatment is being conducted with respect to an internal gear constituting the reclining device of FIG. 1;
FIG. 3 is a photograph of a cross-section of internal teeth of the internal gear that underwent the heat treatment;
FIG. 4 is a graph indicating the surface hardness of the internal gear; and
FIG. 5 is a perspective view of the semiconductor laser beam machine, depicting the condition in which heat treatment is being conducted with respect to a guide bracket constituting the reclining device of FIG. 1.