The present invention relates to a method of making a current collecting grid for solar cells, in particular making front and back contacts for the solar cells. In a further aspect the present invention relates to a thin film polymer or organic solar cell.
Yulia Galagan et al., “ITO-free flexible organic solar cells with printed current collecting grids”, Solar Energy Materials and Solar Cells 95 (5), 1339-1343, (2011), discloses a printed current collecting grid comprising silver, wherein the current collecting grid is buried within a barrier layer underneath a conductive layer made of PEDOT:PSS.
The present invention seeks to provide an improved method of making a current collecting grid for solar cells, wherein the current collecting grid can be manufactured in one single manufacturing step as a last step of the manufacturing process. The method is suitable for large area, high yield, solution based roll-to-roll (R2R) production techniques, such as for manufacturing thin film organic solar cells. Further advantages of the method are that alignment requirements are less critical and solar cell geometry can be chosen freely.
According to the present invention, the method of making a current collecting grid comprises the steps of
a) providing a continuous layer stack on a substrate, the layer stack comprising an upper and a lower conductive layer having a photoactive layer interposed there between;
b) selectively removing the upper conductive layer and the photoactive layer for obtaining a first contact hole extending through the upper conductive layer and photoactive layer exposing the lower conductive layer;
c) printing a front contact body on the upper conductive layer and a back contact body in the first contact hole on the lower conductive layer and forming an electrically insulating first gap surrounding the back contact body between the upper conductive layer and the back contact body.
The method of the present invention has the advantage to allow deposition of a current collecting grid once a layer stack has been manufactured, so that manufacturing a layer stack and a current collecting grid are non-overlapping, separated manufacturing phases. This greatly simplifies the overall production process of solar cells as production requirements of the current collecting grid do not interfere with various processing requirements of the layer stack.
Another advantage of the method is that depositing the current collecting grid can be performed from one side of the layer stack, thereby simplifying an automated depositing step for the current collecting grid. Furthermore, external electrical connections to the solar cells, such as external wiring, can be obtained by immediately providing the current collecting grid with electrical contact pads once the current collecting grid has been deposited.
In an embodiment, the method step of c) comprises printing the front and back contact from one side of the layer stack, thereby facilitating an automated manufacturing process as only one side of the layer stack needs to be accessible.
In another embodiment, which greatly increases manufacturing speed, the step of c) may comprise printing the front and back contact body simultaneously.
According to the invention, various embodiments exist that are configured to allow for misalignment or an alignment offset of the back contact body with respect to the first contact hole. To that end, the method step of b) may comprises further selectively removing the upper conductive layer for widening, e.g. locally widening, the first contact hole therein. By widening the first contact hole locally in e.g. the upper conductive layer, a larger alignment offset of the back contact body can be accepted without risking direct contact between the back contact body and the upper conductive layer.
In an embodiment, the method step of b) may further comprise selectively removing the lower conductive layer for extending the first contact hole there through, which allows for improved adhesion of the back contact body to the layer stack, in particular to the substrate and the lower conductive layer.
In a further embodiment, a main part of the first contact hole extending through the upper conductive layer and the photoactive layer is wider than a secondary part of the first contact hole extending through the lower conductive layer. This is an embodiment wherein the first contact hole extends through the lower conductive layer but with a reduced width, diameter etc., so that adhesion of the back contact body to the layer stack is improved and electrical conductivity between the back contact body and lower conductive layer is maintained.
Further alignment offset issues of the back contact body may be addressed by the method of the present invention, wherein the method step of b) may further comprise selectively removing the upper conductive layer and the photoactive layer for obtaining a second contact hole adjacent to the first contact hole. This alternative embodiment further prevents direct contact between the back contact body and the upper conductive layer for larger alignment offsets of the back contact body.
In an embodiment, the method step of b) may further comprises selectively removing the upper conductive layer for obtaining an electrically insulating second gap surrounding the second contact hole, wherein the electrically insulating second gap extends through the upper conductive layer exposing the photoactive layer. This embodiment also provides a further electrical insulating barrier between the back contact body and the upper conductive layer should the alignment offset be relatively large.
From a manufacturing point of view, in particular with respect to manufacturing speed, the step of c) may further comprise forming the front and back contact body to equal height and/or equal width, which facilitates simultaneously depositing the front and back contact body.
In an embodiment, the method step of c) may further comprise printing the back contact body such that it extends above the upper conductive layer, thereby improving accessibility of the back contact body for further electrical connections.
In an embodiment, the method step of b) selectively removing the upper conductive layer and the photoactive layer may comprise selective laser ablation, whereby various shapes can be readily provided with relatively high scribing speeds.
In another embodiment, the method step of c) may comprise screen printing or inkjet printing the front and/or back contact body. Screen printing and inkjet printing are readily scalable printing techniques suitable for roll-to-roll manufacturing.
In yet another embodiment, the method step of c) may comprise printing the front and back contact using a printing compound comprising at least one of silver, carbon and carbon nanotubes. The printing compound may also comprise copper and aluminium.
Each of the upper and lower conductive layer may comprise a conductive polymer, and wherein the photoactive layer may comprise organic material and/or perovskite.
In light of the present invention, the substrate may comprise a flexible substrate comprising a plastic foil for facilitating roll-to-roll manufacturing.
In a further aspect the present invention relates to a thin film polymer or organic solar cell having good performance and efficiency. The solar cell according to the invention comprises a layer stack disposed on a flexible substrate, the layer stack comprising an upper and a lower conductive layer having a photoactive layer interposed there between;
a first contact hole in the layer stack extending through the upper conductive layer and photoactive layer; and a current collecting grid comprising
a front contact body disposed on the upper conductive layer and a back contact body disposed on the lower conductive layer in the first contact hole, wherein an electrically insulating gap surrounds the first contact hole between the upper conductive layer and the contact hole.
In an embodiment, the front contact body and the back contact body are of equal width and/or height, which improves the efficiency and performance of the current collecting grid and ultimately the solar cell.
In another embodiment, the solar cell may comprise a second contact hole adjacent to the first contact hole, wherein the second contact hole extends through the upper conductive layer and the photoactive layer. This embodiment provides a further electrically insulating gap between the back contact body and the upper conductive layer for preventing direct contact there between. Generally speaking, the thin film organic solar cell may comprise an electrically insulating second gap surrounding the back contact body between the upper conductive layer and the back contact body, wherein the electrically insulating gap need not extend through the photoactive layer. An important aspect of the above embodiments is that a non-contacting arrangement exists of the back contact body and the upper conductive layer.
In some embodiments the first contact hole may extend through the lower conductive layer and the back contact body may be disposed on the substrate in adhesive engagement therewith. In these embodiments electrically conductive engagement of the back contact body and the lower conductive layer is maintained while adhesion of the back contact body to the layer stack is improved.
The present invention will be discussed in more detail hereinafter based on a number of exemplary embodiments with reference to the drawings, in which
According to the method of the present invention the layer stack 1 may be completed first before a current conductive grid is applied thereto. This is advantageous as various depositing steps for manufacturing the layer stack 1 need not be combined or interrupted with steps relating to depositing particular parts of the current collecting grid, such as one or more contacts thereof. As a result, the manufacturing process of the invention comprises distinct phases that may be optimized separately.
The method of the invention thus begins by a) providing a continuous layer stack 1 on a substrate 8, wherein the layer stack 1 comprises an upper 2 and a lower 3 conductive layer having a photoactive layer 4 interposed there between. In an embodiment the layer stack 1 is obtained through a wet layer structuring process, which is often used for thin film organic and/or perovskite solar cells.
In order to access the upper and lower conductive layer 2, 3 from one side of layer stack 1 for collecting current, the present invention utilizes a contact hole that extends through the upper conductive layer 2 and the photoactive layer 4, wherein the contact hole exposes the lower conductive layer 3.
The method of the present invention thus further comprises the step of b) selectively removing the upper conductive layer 2 and the photoactive layer 4 for obtaining a first contact hole 10 extending through the upper conductive layer 2 and photoactive layer 4 exposing the lower conductive layer 3.
Selective removal of layer stack material may be accomplished in various ways. For example, in an advantageous embodiment the method step of b) for selectively removing the upper conductive layer 2 and the photoactive layer 4 may comprise selective laser ablation. Using selective laser ablation allows for various shapes of the first contact hole 10. In particular, the first contact hole 10 may be a generally round or circular hole, but it may also be envisaged as a channel traversing through the laser stack 1. Another advantage of selective laser ablation is the speed at which a contact hole can be provided. Selective laser scribing is generally accurate and allows for high scribing speeds, which is advantageous for a fast roll-to-roll process.
The electrically insulating first gap 9 surrounding the back contact body 5 prevents a direct electrical connection between the lower conductive layer 3 and the upper conductive layer 2, thus essentially preventing a short-circuit there between.
In general terms, the method step of c) for printing a front contact body 6 on the upper conductive layer 2 and a back contact body 5 in the first contact hole 10 on the lower conductive layer 3 provides a non-contacting arrangement between the back contact body 5 and the upper conductive layer 2. The surrounding electrically insulating gap, such as an air gap, is a typical example of such a non-contacting arrangement between the back contact body 5 and the upper conductive layer 2.
The method step of c) yields a front contact body 6 having a width w1 and height h1, and a back contact body 5 having width w2 and height h2. In a typical example the front and back contact body 6, 5 have a substantially square or rectangular cross section as depicted.
In many embodiments the front and back contact 6, 5 may each be envisaged as a narrow, rectangular shaped ridge extending over the upper and lower conductive layer 2, 3.
According to the present invention the front and back contact body 6, 5 may be formed freely across the layer stack 1 and need not be deposited in a regular pattern comprising, for example, parallel disposed straight line front and back contact bodies 6,5. In light of the invention, the front and back contact body 6, 5 may be deposited (e.g. printed) as free-form contours, so as to provide solar cells with a complex, high performance yet aesthetically pleasing current collecting grid.
As mentioned earlier, the first contact hole 10 allows for a one-sided manufacturing process with respect to the layer stack 1 to access the upper and lower conducting layer 2, 3. The method step of c) may thus comprise printing the front and back contact 6, 5 from one side of the layer stack 1, thereby facilitating high speed mechanical automation and improving alignment accuracy of the front and back contact 6, 5 with respect to the layer stack 1.
In a practical embodiment, to increase manufacturing speed and improve alignment of the front and back contact 6,5 with respect to the layer stack 1 even further, the method step of c) may comprise simultaneous printing of the front and back contact body (6, 5). This may be accomplished, for example, through a single printer head or two coupled printer heads disposed adjacent to the layer stack 1, wherein the front and back contact body 6, 5 are printed at substantially the same time. In a further embodiment, the step of c) further comprises forming the front and back contact body 6, 5, to equal height and/or equal width. This may be accomplished by printing the front and back contact body 6, 5 over an equal time interval, so that the height h1 and h2, and/or width w1 and w2, of the front and back contact bodies 6, 5, respectively, have substantially the same value, i.e. h1≈h2, w1≈w2.
By varying the width and height ratio (w1/h1, w2/h2) of each of the front and back contact body 6,5, the efficiency and performance of the current collecting grid can be improved. So by increasing the height (h1, h2) and/or width (w1, w2) of the front and back contact 6,5, solar cell performance may be improved.
In
According to the invention the front and back contact body 6, 5 may be printed onto the layer stack 1. To that end, in an advantageous embodiment, the step of c) may comprise screen printing or inkjet printing the front and/or back contact body 6,5. These printing techniques are reliable, accurate and easily scalable for a roll-to-roll process. In a further embodiment, the step of c) may comprise printing the front and back contact 6,5 using a printing compound comprising at least one of silver (Ag), carbon and carbon nanotubes, which have good electrical conductive properties.
Printing e.g. a silver (Ag) contact body, such as a silver (Ag) front or back contact body 6,5 on a PEDOT upper or lower conductive layer 6,5 may yield a lower performance of the current collecting grid compared to embedded contact bodies within the layer stack 1, e.g. embedded in a PEDOT conductive layer. According to the invention, however, by increasing the width (w1, w2) and/or height (h1, h2) of the front and back contact body 6, 5 respectively, the performance of the current collecting grid need not be an issue and comparable performance to an embedded current collecting grid may be achieved.
Returning to the first contact hole 10, a width wc thereof may be chosen to allow for alignment errors of the back contact body 5 while depositing (e.g. printing) said contact body 5 in the first contact hole 10. In particular, by increasing the width wc with respect to the width w2 of the back contact body 5, various alignment offsets and errors while depositing the back contact body 5 in the first contact hole 10 may be absorbed as the surrounding electrically insulating first gap 9 becomes larger there between, thereby lessening the probability of a short circuit between the upper and lower conductive layer 2, 3 in a high speed manufacturing process. In the embodiment shown in
Since the present invention seeks to provide a method of manufacturing a current collecting grid for solar cells in a high speed fabrication process, such as roll-to-roll, alignment issues regarding depositing contact bodies on conductive layers cannot be ignored and may even be decisive for the overall quality and performance of the solar cells.
In this particular embodiment a second contact hole 11 is formed surrounding the first contact hole 10, thereby providing a further electrically insulating gap 9a surrounding the back contact body 5 between the upper conductive layer 2 and said back contact body 5. The second contact hole 11 adjacent to the first contact hole 10 thus provides a decoupled proximal portion 2a of the upper conductive layer 2, so that the back contact body 5 is in a non-contacting arrangement with the upper conductive layer 2.
From a manufacturing point of view, the first contact hole 10 may be used to guide alignment of e.g. a printer head for printing (depositing) the back contact body 5 on the lower conductive layer 3 in the first contact hole 10. When subjected to high manufacturing speeds, alignment offsets may occur due to timing and positioning lag when executing the method step c).
An added advantage of the embodiment of
This embodiment of the method yields a widened electrically insulating first gap 9 surrounding the back contact body 5, so that a relatively large alignment offset do with respect to the centre line cc of the first contact hole 10 can be absorbed during high speed printing. The non-contacting arrangement of the back contact body 5 and the upper conductive layer 2 is therefore maintained.
This particular embodiment may be obtained by the method step of b) that may further comprise selectively removing the lower conductive layer 3 for extending the first contact hole 10 there through.
This embodiment is advantageous for improving adhesion of the back contact body 5 to the layer stack 1, wherein the back contact body 5 is in part deposited (e.g. printed) on the substrate 8 and in adhesive engagement therewith. As in other embodiments, the electrically insulating first gap 9 surrounding the back contact 5 prevents a direct electrical connection between the back contact body 5 and the upper conductive layer 2, thus providing the non-contacting arrangement thereof. The electrically insulating first gap 9 further improves robustness against possible alignment offset of the back contact body 5 with respect to the first contact hole 10 as explained above.
In
In order to prevent a direct electrical connection between the back contact body 5 and the upper conductive layer 2, an electrically insulating second gap 12 surrounds the back contact body 5 for providing the non-contacting arrangement between the back contact body 5 and the upper conductive layer 2.
According to the invention, the first contact hole 10 is arranged for providing access to the lower conducting layer 2 from one side of the layer stack 1. This is advantageous in light of the fact that the layer stack 1 can then be produced first, wherein manufacturing steps relating to e.g. layer structuring, wet solution based processing etc. need not be combined with manufacturing steps and requirements thereof for providing a current collecting grid, i.e. the front and back contact body 6, 5. Therefore, separating the manufacturing of the layer stack 1 on substrate 8 and subsequently manufacturing the front and back contact bodies 6,5 greatly facilitates a high speed, high yield roll-to-roll (R2R) manufacturing process of solar cells.
As mentioned hereinbefore, the first and/or second contact holes 10, 11 may be provided through selective removal using, for example, selective laser ablation for scribing the first and/or second contact hole 10,11. The depth of said holes 10, 11 is of course dependent on a particular time period over which the layer stack 1 is subjected to the selective removal method step, as well as on a removal intensity of the laser ablation process (e.g. pulsed laser, continuous laser, laser power etc.).
Now, in order to define a solar cell, in particular an outer perimeter thereof, selective removal may also be used to create a hole or channel fully extending through the layer stack 1, so that an electrically insulating perimeter or barrier is obtained between the upper and lower conductive layer 2, 3.
In
According to the invention as depicted in
The method of the present invention thus provides a way for fast, large quantity manufacturing of solar cells not just for functionality, i.e. generating usable electricity, but such solar cells may also fulfill a decorative or artistic purpose. So a host of additional placement options and locations are possible. That is, in addition to placing free formed solar cells according to the present invention on rooftops, inner or outer wall surfaces, window surfaces, furniture surfaces, vehicle surfaces, roof tile surfaces etc. can now be provided with such free formed solar cells.
In a further aspect the present invention relates to a thin film organic solar cell that can be manufactured in a fast roll-to-roll process. Reference is made to all
The thin film organic solar cell of the present invention comprises a layer stack 1 disposed on a flexible substrate 8. The layer stack 1 comprises an upper 2 and a lower 3 conductive layer having a photoactive layer 4 interposed there between. A first contact hole 10 is provided in the layer stack 1 extending through the upper conductive layer 2 and photoactive layer 4. The thin film organic solar cell further comprises a current collecting grid comprising a front contact body 6 disposed on the upper conductive layer 2 and a back contact body 5 disposed on the lower conductive layer 3 in the first contact hole 10. An electrically insulating gap 9 surrounds the back contact body 5 between the upper conductive layer 2 and back contact body 5.
The advantage of the thin film organic solar cell 16 according to the invention is that the current collecting grid is disposed on the layer stack 1 from one side thereof instead of being embedded therein. As a result, the solar cell 16 allows a two-phase manufacturing process, whereby in a first phase the layer stack 1 is manufactured first, followed by a second phase comprising depositing the current collecting gird, i.e. the front and back contact body 6, 5.
Furthermore, since there is a non-contacting arrangement of the back contact body 5 and the upper conductive layer 2, a direct electrical connection there between is prevented. The non-contacting arrangement is typically embodied as an electrically insulating gap 9, which allows for alignment offsets of the back contact body 5 with respect to the first contact hole 10 without compromising the non-contacting arrangement. This facilitates a high speed manufacturing process, in particular a roll-to-roll manufacturing process.
In an embodiment, the front contact body 6 and the back contact body 5 may be of equal length, which improves performance of the solar cell and simplifies depositing the front and back contact body 6, 5.
The thin film organic solar cell 16 may further comprise a second contact hole 11 adjacent to the first contact hole 10. The second contact hole 11 extends through the upper conductive layer 2 and the photoactive layer 4. The second contact hole 11 allows for larger alignment offsets of the back contact body 5 in the first contact hole 10.
In an embodiment, the first contact hole 10 may extend through the lower conductive layer 3, wherein the back contact body 5 is disposed on the substrate 8 in adhesive engagement therewith. This embodiment improves adhesion of the back contact body 5 to the layer stack 1.
Instead of having contact holes extending through the upper conductive layer 2 and the photoactive layer 4 for preventing a direct electrical connection between the back contact body 5 and the upper conductive layer 2, the thin film organic solar cell 16 may comprise an electrically insulating second gap 12 extending through the upper conductive layer 2 and surrounding the back contact body 5 between the upper conductive layer 2 and the back contact body 5. This embodiment may be employed to account for the most inaccurate positioning of the back contact body 5 during fast roll-to-roll manufacturing.
The present invention can now be summarized by the following embodiments:
Embodiment 1. Method of making a current collecting grid for solar cells, comprising the steps of
a) providing a continuous layer stack (1) on a substrate (8), the layer stack (1) comprising an upper (2) and a lower (3) conductive layer having a photoactive layer (4) interposed there between;
b) selectively removing the upper conductive layer (2) and the photoactive layer (4) for obtaining a first contact hole (10) extending through the upper conductive layer (2) and photoactive layer (4) exposing the lower conductive layer (3);
c) printing a front contact body (4) on the upper conductive layer (2) and a back contact body (5) in the first contact hole (10) on the lower conductive layer (3) and forming an electrically insulating first gap surrounding the back contact body (5) between the upper conductive layer (2) and the back contact body (2).
Embodiment 2. Method according to embodiment 1, wherein the step of c) comprises printing the front and back contact (6, 5) from one side of the layer stack (1).
Embodiment 3. Method according to embodiment 1 or 2, wherein the step of c) comprises printing the front and back contact body (6, 5) simultaneously.
Embodiment 4. Method according to any one of embodiments 1 to 3, wherein the step of b) comprises further selectively removing the upper conductive layer (2) for widening the first contact hole (10) therein.
Embodiment 5. Method according to any one of embodiments 1 to 4, wherein the step of b) further comprises selectively removing the lower conductive layer (3) for extending the first contact hole (10) there through.
Embodiment 6. Method according to embodiment 5, wherein a main part of the first contact hole (10) extending through the upper conductive layer (2) and the photoactive layer (4) is wider than a secondary part of the first contact hole (10) extending through the lower conductive layer (3).
Embodiment 7. Method according to any one of embodiments 1 to 6, wherein the method step of b) further comprises selectively removing the upper conductive layer (2) and the photoactive layer (4) for obtaining a second contact hole (11) adjacent to the first contact hole (10).
Embodiment 8. Method according to embodiment 7, wherein the method step of b) further comprises selectively removing the upper conductive layer (2) for obtaining an electrically insulating second gap (12) surrounding the second contact hole (10), wherein the electrically insulating second gap (12) extends through the upper conductive layer (2) exposing the photoactive layer (4).
Embodiment 9. Method according to anyone of embodiments 1 to 8, wherein the step of c) further comprises forming the front and back contact body (6, 5) to equal height and/or equal width.
Embodiment 10. Method according to any one of embodiments 1 to 9, wherein the step of c) further comprises printing the back contact body (5) such that it extends above the upper conductive layer (2).
Embodiment 11. Method according to any one of embodiments 1 to 10, wherein the step of b) selectively removing the upper conductive layer (2) and the photoactive layer|(4) comprises selective laser ablation.
Embodiment 12. Method according to any one of embodiments 1 to 11, wherein the step of c) comprises screen printing or inkjet printing the front and/or back contact body (6,5).
Embodiment 13. Method according to any one of embodiments 1 to 12, wherein the step of c) comprises printing the front and back contact (6,5) using a printing compound comprising at least one of silver, carbon and carbon nanotubes.
Embodiment 14. Method according to any one of embodiments 1-13, wherein each of the upper (2) and lower (3) conductive layer comprises a conductive polymer, and wherein the photoactive layer (4) comprises organic material and/or perovskite.
Embodiment 15. Method according to any one of embodiments 1-14, wherein the substrate (8) is a flexible substrate comprising a plastic foil.
Embodiment 16. Thin film organic solar cell comprising a layer stack (1) disposed on a flexible substrate (8), the layer stack (1) comprising an upper (2) and a lower (3) conductive layer having a photoactive layer (4) interposed there between;
a first contact hole (10) in the layer stack (1) extending through the upper conductive layer (2) and photoactive layer (4); and a current collecting grid comprising
a front contact body (6) disposed on the upper conductive layer (2) and a back contact body (5) disposed on the lower conductive layer (3) in the first contact hole (10), wherein an electrically insulating gap surrounds the first contact hole (10) between the upper conductive layer (2) and the first contact hole (10).
Embodiment 17. Thin film organic solar cell according to embodiment 16, wherein the front contact body (6) and the back contact body (5) are of equal width and/or height.
Embodiment 18. Thin film organic solar cell according to embodiment 16 or 17, wherein the solar cell (16) comprises a second contact hole (11) adjacent to the first contact hole (10), the second contact hole (11) extending through the upper conductive layer (2) and the photoactive layer (4).
Embodiment 19. Thin film organic solar cell according to any one of embodiments 16 to 18, wherein the first contact hole (10) extends through the lower conductive layer (3) and the back contact body (5) is disposed on the substrate (8) in adhesive engagement therewith.
Embodiment 20. Thin film organic solar cell according to any one of embodiments 16 to 19, comprising an electrically insulating second gap (12) surrounding the back contact body (5) between the upper conductive layer (2) and the back contact body (5).
The embodiments of the present invention have been described above with reference to a number of exemplary embodiments as shown in and described with reference to the drawings. Modifications and alternative implementations of some parts or elements are possible, and are included in the scope of protection as defined in the appended claims.
Number | Date | Country | Kind |
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2014040 | Dec 2014 | NL | national |
Filing Document | Filing Date | Country | Kind |
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PCT/NL2015/050877 | 12/17/2015 | WO |
Publishing Document | Publishing Date | Country | Kind |
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WO2016/105186 | 6/30/2016 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4243432 | Jordan | Jan 1981 | A |
4315096 | Tyan | Feb 1982 | A |
4667058 | Catalano | May 1987 | A |
4668840 | Kiyama | May 1987 | A |
4697041 | Okaniwa | Sep 1987 | A |
4726849 | Murata | Feb 1988 | A |
4758526 | Thalheimer | Jul 1988 | A |
4872925 | McMaster | Oct 1989 | A |
4948436 | Juergens | Aug 1990 | A |
5131954 | Vogeli | Jul 1992 | A |
5322572 | Wanlass | Jun 1994 | A |
5348589 | Arai | Sep 1994 | A |
5385848 | Grimmer | Jan 1995 | A |
5538902 | Izu | Jul 1996 | A |
5578502 | Albright | Nov 1996 | A |
5637156 | Kubota | Jun 1997 | A |
5716459 | Chang | Feb 1998 | A |
5994642 | Higuchi | Nov 1999 | A |
6040520 | Morooka | Mar 2000 | A |
6184057 | Van Andel | Feb 2001 | B1 |
6265652 | Kurata | Jul 2001 | B1 |
6274804 | Psyk | Aug 2001 | B1 |
6300556 | Yamagishi | Oct 2001 | B1 |
6300593 | Powell | Oct 2001 | B1 |
6323056 | Miyoshi | Nov 2001 | B1 |
6426235 | Matsushita | Jul 2002 | B1 |
6468828 | Glatfelter | Oct 2002 | B1 |
6521823 | Kubota | Feb 2003 | B2 |
6525264 | Ouchida | Feb 2003 | B2 |
6559411 | Borgeson | May 2003 | B2 |
6566159 | Sawada | May 2003 | B2 |
6573445 | Burgers | Jun 2003 | B1 |
6578764 | Hiraishi | Jun 2003 | B1 |
6632993 | Hayashi | Oct 2003 | B2 |
6653550 | Hayashi | Nov 2003 | B2 |
6706963 | Gaudiana | Mar 2004 | B2 |
6870088 | Tachibana | Mar 2005 | B2 |
7052998 | Shinohara | May 2006 | B2 |
7199395 | Terakawa | Apr 2007 | B2 |
7276658 | Dubbeldam | Oct 2007 | B2 |
7276724 | Sheats | Oct 2007 | B2 |
7547569 | Weidman | Jun 2009 | B2 |
7547570 | Borden | Jun 2009 | B2 |
7638707 | Shinohara | Dec 2009 | B2 |
7732229 | Leidholm | Jun 2010 | B2 |
7994418 | Tandon | Aug 2011 | B2 |
8129658 | Manens | Mar 2012 | B2 |
8134067 | Tsai | Mar 2012 | B1 |
8198117 | Leidholm | Jun 2012 | B2 |
8207442 | Woods | Jun 2012 | B2 |
8247243 | Sheats | Aug 2012 | B2 |
8273597 | Wang | Sep 2012 | B2 |
8298852 | Shin | Oct 2012 | B2 |
8309390 | Lerchenberger | Nov 2012 | B2 |
8329494 | Denda | Dec 2012 | B2 |
8362354 | Shinohara | Jan 2013 | B2 |
8445310 | Bi | May 2013 | B2 |
8445315 | Uchida | May 2013 | B2 |
8455753 | Nishi | Jun 2013 | B2 |
8552287 | Lu | Oct 2013 | B2 |
8569094 | Stolt | Oct 2013 | B2 |
8592248 | Cheng | Nov 2013 | B2 |
8686282 | McGlynn | Apr 2014 | B2 |
8716591 | Misra | May 2014 | B2 |
8729383 | Lu | May 2014 | B2 |
8742247 | Kang | Jun 2014 | B2 |
8779282 | Kwon | Jul 2014 | B2 |
8822809 | Kwon | Sep 2014 | B2 |
8846419 | Stein | Sep 2014 | B2 |
8865569 | Brunton | Oct 2014 | B2 |
8876963 | Cruz | Nov 2014 | B2 |
8884153 | Yamaguchi | Nov 2014 | B2 |
8884154 | Stangl | Nov 2014 | B2 |
8889470 | Kim | Nov 2014 | B2 |
8895845 | Kizilyalli | Nov 2014 | B2 |
8927315 | Sheats | Jan 2015 | B1 |
9029680 | Kizilyalli | May 2015 | B2 |
9029687 | Kizilyalli | May 2015 | B2 |
9059347 | Nishi | Jun 2015 | B2 |
9130102 | Myong | Sep 2015 | B2 |
9166089 | Yoshikawa | Oct 2015 | B2 |
9178086 | Hu | Nov 2015 | B2 |
9269841 | Morimoto | Feb 2016 | B2 |
9306093 | Baird | Apr 2016 | B2 |
9391219 | Kim | Jul 2016 | B2 |
9401440 | Han | Jul 2016 | B2 |
9412894 | Song | Aug 2016 | B2 |
9496513 | Aoki | Nov 2016 | B2 |
9502591 | Cho | Nov 2016 | B2 |
9553213 | Shin | Jan 2017 | B2 |
9595913 | Park | Mar 2017 | B2 |
9711669 | Tokioka | Jul 2017 | B2 |
9741884 | Kim | Aug 2017 | B2 |
9748424 | Lee | Aug 2017 | B2 |
9786800 | Hahn | Oct 2017 | B2 |
9806207 | Kwon | Oct 2017 | B2 |
9812593 | Park | Nov 2017 | B2 |
9818897 | Lee | Nov 2017 | B2 |
9911881 | Pfeiffer | Mar 2018 | B2 |
9954122 | Lim | Apr 2018 | B2 |
10090431 | Cheng | Oct 2018 | B2 |
10134932 | Lee | Nov 2018 | B2 |
10181541 | Moslehi | Jan 2019 | B2 |
20050253142 | Negami | Nov 2005 | A1 |
20060266409 | Takeda | Nov 2006 | A1 |
20070079866 | Borden | Apr 2007 | A1 |
20080115821 | Xu | May 2008 | A1 |
20090032094 | Aoki | Feb 2009 | A1 |
20090084425 | Milshtein | Apr 2009 | A1 |
20090229653 | Lu | Sep 2009 | A1 |
20090320895 | Yagiura | Dec 2009 | A1 |
20100132780 | Kizilyalli | Jun 2010 | A1 |
20110011437 | Denda | Jan 2011 | A1 |
20110041890 | Sheats | Feb 2011 | A1 |
20120138126 | Yata | Jun 2012 | A1 |
20120186634 | Jee | Jul 2012 | A1 |
20120240971 | Telle | Sep 2012 | A1 |
20120325309 | Takahama | Dec 2012 | A1 |
20130000722 | Yamada | Jan 2013 | A1 |
20140230885 | Fyson | Aug 2014 | A1 |
20140318614 | Von Campe | Oct 2014 | A1 |
20150194552 | Ogasahara | Jul 2015 | A1 |
Number | Date | Country |
---|---|---|
102012109777 | Apr 2014 | DE |
2954856 | Jul 2011 | FR |
WO 2014136359 | Sep 2014 | JP |
2013039019 | Mar 2013 | WO |
WO 2013058522 | Apr 2013 | WO |
Entry |
---|
Burgers A R et al: Metallisation patterns for interconnection through holes, S0lar Energy Materials and S0lar Cells, Elsevier Science Publishers, Amsterdam, NL, vol. 65, No. 1-4, Jan. 1, 2001 (Jan. 1, 2001), pp. 347-353, XP004217137, ISSN: 0927-0248, D0I: 10.1016/S0927-0248(00)00112-4 the whole document. |
Takayuki Kuwabara et al: Development of bifacial inverted polymer solar cells using a conductivity-controlled transparent PEDOTiPSS and a striped Au electrode on the hole collection side, Japanese J0urnal 0f Applied Physics, Japan Society of Applied Physics, JP, vol. 53, No. 2S, Feb. 1, 2014 (Feb. 1, 2014), pp. 2BE07-1, XP001588357, ISSN: 0021-4922, DOI: 10.7567/JJAP.53.O2BE07 [retrieved on Jan. 29, 2014] the whole document. |
Number | Date | Country | |
---|---|---|---|
20170373262 A1 | Dec 2017 | US |