Levine, et al., Benefits of the Lateral Resistor in a FED, Texas Instruments, Dallas, Texas, pp. 67-71; International Vacuum Micro Electronics Conference, Portland, Oregon, Jul., 1995. |
Cathey, Jr., Field Emission Displays, Micron Display Technology, Inc.; International Symposium on VLSI Technology Systems and Applications Conference; Taiwan, May, 1995. |
Miki et al., A Totally Wet Etch Fabrication Technology for Amorphous Silicon Thin Film Transistors, Mat. Res. Soc. Symp. Proc. vol. 377, pp. 737-743 (1995). |
Kuo, Thin Films Transistor with Layered a-Si:H Structure, Mat. Res. Soc, Symp. Proc. vol. 377, pp. 701-707 (1995). |
Leuder, Trends of Research in Active Addressing of LCDs, Mat. Res. Soc. Symp. Proc. vol. 377, 847-859 (1995). |
Levine, Field Emissions Form Microtip Test Arrays Using Resistor Stabilization Revue. “LeVide, les Couches Minces”, Supplement au No. 271-Mars-Avril 1994. |
PML 2063 Issue N o. 3, pp. 4,7,8, (Jun. 1992). |
Sung Chul Kim et al., Effects of N2 Plasma Treatment of Si02 Gate Insulator in a-Si:H Thin Film Transistor, Mat. Res. Soc. Symp. Proc. vol. 336, pp. 775-780 (1994). |