Claims
- 1. A method of fabricating a light emitting diode, comprising the steps of:
- (a) preparing a semiconductor wafer having a semiconductor layer of a first conductivity type therein:
- (b) forming a matrix array of semiconductor regions of a second conductivity type in a top surface of said semiconductor layer;
- (c) forming a first insulating layer on said top surface of said semiconductor layer;
- (d) selectively removing said first insulating layer to obtain windows on said semiconductor regions;
- (e) providing first conductive layers in said windows;
- (f) cutting said wafer into strips each having a linear array of said semiconductor regions;
- (g) forming a second insulating layer on a side surface of a strip obtained in the step (f), said second insulating layer being connected to said first insulating layer on said strip; and
- (h) providing a second conductive layer having a first portion located on a bottom surface of said strip, a second portion located on said second insulating layer and a third portion located on a part of said first insulating layer of said strip.
- 2. A method of fabricating a light emitting diode, comprising the steps of:
- (a) preparing a semiconductor wafer having a semiconductor layer of a first conductivity type therein:
- (b) forming a matrix array of semiconductor regions of a second conductivity type in a top surface of said semiconductor layer;
- (c) forming a first insulating layer on said top surface of said semiconductor layer;
- (d) selectively removing said first insulating layer to obtain windows on said semiconductor regions;
- (e) cutting said wafer into strips each having a linear array of said semiconductor regions;
- (f) forming a second insulating layer on a side surface of a strip obtained in the step (e), said second insulating layer being connected to said first insulating layer on said strip;
- (g) providing a conductive layer on top and bottom surfaces of said strip and on said first and second insulating layers; and
- (h) selectively removing said conductive layer on said first insulating layer to obtain:
- a first electrode layer which covers said bottom surface of said strip and said second insulating layer and which partially covers said first insulating layer on said strip; and
- second electrode layers filling said windows on said strip, respectively.
Parent Case Info
This is a division of application Ser. No. 07/513,878, filed on Apr. 24, 1990, now U.S. Pat. No. 5,045,895.
US Referenced Citations (11)
Foreign Referenced Citations (2)
Number |
Date |
Country |
6037575 |
Aug 1983 |
JPX |
61-95956 |
May 1986 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
513878 |
Apr 1990 |
|