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Yonekura, "Oriented Wire Through Connectors for High Density Contacts", Proceedings of the National Electronics Packaging and Production Conference (Nepcon) West 1990, pp. 57-71. |
Zifcak et al., "Pinless Grid Array Connector", 6th Annual International Electronics Packaging Conference (IEPS), Nov. 17-19, 1986, San Diego, Calif., pp. 453-464. |
"Reliable Connections Under Pressure", advertisement by Shinetsu, Electronics Packaging and Production (EP&P), date and page unknown). |
Buchoff, "Elastometric Connectors for Land Grid Array Packages", reprinted from Connection Technology, Apr., 1989, pp. 15-18. |
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Smolley, "Button Board a New Technology", Fourth Annual International Electronics Packaging Society Conference, Oct. 29-31, 1984, Baltimore, Md., pp. 75-91. |
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