Claims
- 1. A method of fabricating a microwave/millimeter wave transition device from a plurality of layers of dielectric material, comprising the steps of:
- removing a first portion of dielectric material from each layer of a plurality of planar layers of dielectric material of substantially constant thickness for defining a center conductor region;
- removing at least a second and a third portion of dielectric material from around said center conductor region of each said layer for defining at least one pair of ground plane regions having a mutual separation of dielectric material between the ends thereof;
- filling said center conductor region and said ground plane regions with metallization;
- stacking said layers so that all metallized center conductor regions are aligned and that mutually adjacent layers have respective metallized ground plane regions which overlay each other while the respective ends thereof are offset by a planar rotation of a predetermined angle; and
- bonding said plurality of layers together to form a unitary structure having a continuous center conductor and ground plane.
- 2. The method according to claim 1 wherein said center conductor region is generally circular.
- 3. The method according to claim 2 wherein said ground plane regions are annular in configuration.
- 4. The method according to claim 2 wherein said ground plane regions comprise two annular segments.
- 5. The method according to claim 2 wherein said ground plane regions comprise a pair of substantially identical arcuate regions having predetermined inner and outer radius dimensions.
- 6. The method according to claim 5 wherein said arcuate region of adjacent layers are rotated relative to one another in respective planes by about 90.degree..
- 7. The method according to claim 1 wherein each said layer of dielectric material comprises low temperature co-fired (LTCC) tape.
- 8. The method according to claim 7 wherein said step of filling said regions with metallization comprises the step of filling said regions with a metallic paste.
- 9. The method according to claim 8 and wherein said step of bonding includes firing said layers of LTCC tape together.
Parent Case Info
This is a division of application Ser. No. 08/654,949, filed May 29, 1996, now U.S. Pat. No. 5,644,234.
GOVERNMENT INTEREST
This invention was made by employees of the United States Government and therefore may be made, sold, licensed, imported and used by or for the Government of the United States of America without the payment of any royalties thereon or therefor.
US Referenced Citations (5)
Divisions (1)
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Number |
Date |
Country |
Parent |
654949 |
May 1996 |
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