Claims
- 1. A method of forming electrical fuses, comprising a step of sputtering at least one aluminum conductor on a substrate, the conductor including a link part of reduced cross section, and thereafter a step of adhering a dielectric silicon adhesive to the substrate and the link part of the conductor.
- 2. The method of claim 1 wherein the aluminum conductor is an aluminum alloy.
- 3. The method of claim 1 wherein said step of adhering a dielectric silicone adhesive comprises adhering the silicone adhesive to the entire aluminum conductor.
- 4. The method of claim 3 including a step of etching back a portion of the silicone adhesive to expose a portion of the conductor.
- 5. The method of claim 4 including a step of sputtering a terminal over the exposed portion of the conductor.
- 6. The method of claim 1 wherein the substrate is glass.
- 7. The method of claim 6 wherein the glass substrate has a melting temperature in excess of 700.degree. C.
- 8. A method of forming electrical fuses, comprising a step of sputtering an electrical conductor on a substrate, the conductor including a fusible link part, and thereafter a step of adhering a dielectric synthetic polymer adhesive to the substrate and the link part of the conductor.
- 9. The method of claim 8 wherein the step of sputtering a conductor comprises sputtering a conductor of aluminum or aluminum alloy.
- 10. The method of claim 8 wherein the step of sputtering a conductor comprises forming a link part of reduced cross section in said conductor.
- 11. The method of claim 8 wherein the adhesive is a silicone material.
- 12. The method of claim 8 wherein said step of adhering a dielectric adhesive comprises adhering the adhesive to the entire conductor.
- 13. The method of claim 12 including a step of etching back a portion of the adhesive to expose a portion of the conductor.
- 14. The method of claim 13 including a step of sputtering a terminal over the exposed portion of the conductor.
- 15. The method of claim 8 wherein the substrate is glass.
CROSS REFERENCE TO RELATED APPLICATIONS
this is a division of copending application Ser. No. 504,678, filed on Apr. 4, 1990, now U.S. Pat. No. 3,431,137 which is a continuation-in-part of application Ser. No. 492,631, filed Mar. 13, 1990, now U.S. Pat. No. 5,097,245, which is a continuation-in-part of application Ser. No. 396,561, filed Aug. 21, 1989, now U.S. Pat. No. 4,926,543, which is a division of application Ser. No. 198,762, May 25, 1988, now U.S. Pat. No. 4,860,437, which is a division of application Ser. No. 005,964, Jan. 22, 1987, now U.S. Pat. No. 4,749,980.
US Referenced Citations (44)
Foreign Referenced Citations (2)
Number |
Date |
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948894 |
Oct 1956 |
DEX |
3304263 |
Aug 1984 |
DEX |
Divisions (3)
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Number |
Date |
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Parent |
504678 |
Apr 1990 |
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Parent |
198762 |
May 1988 |
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Parent |
5964 |
Jan 1987 |
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Continuation in Parts (2)
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Number |
Date |
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Parent |
492631 |
Mar 1990 |
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Parent |
396561 |
Aug 1989 |
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