Claims
- 1. A method for making an imageable seamed intermediate transfer belt having an inner surface and an outer surface having predefined surface properties, comprising:joining together an end portion of a first semiconductive substrate to an end portion of a second semiconductive substrate to form a seam, applying an adhesive material into the seam; burnishing the adhesive material in seam with a material to transfer said material to the adhesive material thereby substantially imitating predefined surface properties of the belt.
- 2. The method of claim 1, further comprising the step of:finishing the adhesive material after curing of the adhesive material, before said burnishing step.
- 3. The method of claim 2, wherein said burnishing step comprises the step of polishing the outer surface of said seam with a material to impart conductivity and release properties of said belt to the adhesive in said seam.
- 4. The method of claim 3, wherein said polishing step includes the step of: applying conductive or semiconductive materials to the seam.
- 5. A method for making a seamed belt having an inner surface and an outer surface having predefined surface properties, comprising:joining together an end portion of a first substrate to an end portion of a second substrate to form a seam, applying an adhesive material into the seam; burnishing the adhesive material in seam with a material to transfer said material to the adhesive material thereby substantially imitating predefined surface properties of the belt.
- 6. The method of claim 5, further comprising the step of:finishing the adhesive material after curing of the adhesive material, before said burnishing step.
- 7. The method of claim 6, wherein said burnishing step comprises the step of polishing the outer surface of said seam with a material to impart conductivity and release properties of said belt to the adhesive in said seam.
- 8. The method of claim 7, wherein said polishing step includes the step of applying conductive or semiconductive materials to the seam.
- 9. A method for making a seamed belt having an inner surface and an outer surface having predefined surface properties, comprising:joining together an end portion of a first semiconductive substrate to an end portion of a second semiconductive substrate to form a seam, applying an adhesive material into the seam; burnishing the adhesive material in seam with a material to transfer said material to the adhesive material thereby substantially imitating predefined surface properties of the belt.
- 10. The method of claim 9, further comprising the step of:finishing the adhesive material after curing of the adhesive material, before said burnishing step.
- 11. The method of claim 10, wherein said burnishing step comprises the step of polishing the outer surface of said seam with a material to impart conductivity and release properties of said belt to the adhesive in said seam.
- 12. The method of claim 11, wherein said polishing step includes the step of: applying conductive or semiconductive materials to the seam.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a divisional of application Ser. No. 09/723,560; now U.S. Pat. No. 6,488,798 B1, filed Nov. 28, 2000.
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