Claims
- 1. A method of making a conductive film magnetic component, comprising:
- providing a primary conductive film having first and second major surfaces, said primary conductive film having a generally serpentine configuration when disposed in a plane;
- folding said primary conductive film in an accordion manner to form a stack of layers having an axis extending at an angle thereto, said primary conductive film thereby comprising a primary winding encircling said axis in a manner to provide a plurality of winding turns with the winding turn connections being integral with said primary conductive film;
- disposing a dielectric material between adjacent layers of said stack, said dielectric material comprising a dielectric membrane having first and second major surfaces, the first major surface of said primary conductive film being in contact with the first major surface of said dielectric membrane;
- providing a plurality of separate secondary conductive films, each of said secondary conductive films being disposed on a secondary dielectric membrane;
- interleaving said secondary conductive films with the layers of said stack so that said secondary conductive films are insulated from said primary winding; and
- electrically connecting said secondary films together to form a secondary winding.
- 2. The method of claim 1 wherein said secondary conductive films are connected in parallel to each other.
- 3. The method of claim 1 wherein said secondary winding comprises a tapped winding.
Parent Case Info
This application is a division of application Ser. No. 07/359,063, filed 05/30/89 now U.S. Pat. No. 5,017,902.
Government Interests
The United States Government has rights in this invention pursuant to Contract No. N66001-87-C-0378 awarded by the Department of the Navy.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
2943966 |
Leno et al. |
Jul 1960 |
|
Non-Patent Literature Citations (1)
Entry |
"Printed Circuit Coil", IBM Tech. Discl. Bull., vol. 15, No. 1, Jun. 1972; B. W. Styles. |
Divisions (1)
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Number |
Date |
Country |
Parent |
359063 |
May 1989 |
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