Claims
- 1. A method of manufacturing corrugated paperboard comprising;
- providing a liner ply and a corrugated medium ply;
- preparing an adhesive by heating a starch bearing composition under pressure to at least the melting point of the composition and then cooling the composition to a temperature below about 100.degree. C. but not below about 40.degree. C.;
- maintaining the adhesive composition at a temperature of at least about 40.degree. C.;
- applying the adhesive to at least one of the plies; and
- combining the plies to form a corrugated paperboard product.
- 2. The method of claim 1 in which the adhesive is cooled to and maintained at a temperature not below about 55.degree. C.
- 3. A method of manufacturing corrugated paperboard comprising;
- providing a liner ply and a corrugated medium ply;
- preparing an adhesive by heating a starch bearing composition under pressure to at least the melting point of the composition and then cooling the composition to a temperature below about 75.degree. C. but not below about 40.degree. C.;
- mixing the composition with a suspension of essentially ungelatinized starch without cooling the original starch composition below about 40.degree. C. to form an adhesive mixture;
- maintaining the adhesive mixture at a temperature between about 40.degree. C. and 75.degree. C.;
- applying the adhesive mixture to at least one of the plies; and
- combining the plies to form a corrugated paperboard product.
- 4. The method of claim 3 further comprising; cooling the starch bearing composition, after heating at least to the melting point, to a temperature between about 75.degree. C. and 55.degree. C.;
- mixing the composition with a suspension of essentially ungelatinized starch without cooling the original starch composition below about 55.degree. C. to form an adhesive mixture;
- maintaining the adhesive mixture at a temperature between about 55.degree. C. and 75.degree. C.;
- applying the adhesive mixture to at least one of the plies; and
- combining the plies to form a corrugated paperboard product.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 5,574,270, filed Dec. 18, 1995, now U.S. Pat. No. 5,609,711, which is a continuation-in-part of application Ser. No. 444,936, filed May 19, 1995 and now abandoned, which was a continuation-in-part of application Ser. No. 263,360, filed Jun. 21, 1994 and now abandoned.
US Referenced Citations (11)
Non-Patent Literature Citations (1)
Entry |
Cold Set Adhesives. Report by St. Lawrence Reactors, Tiverton, Ontario, Date unknown. |
Continuation in Parts (3)
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Number |
Date |
Country |
Parent |
574270 |
Dec 1995 |
|
Parent |
444936 |
May 1995 |
|
Parent |
263360 |
Jun 1994 |
|