Claims
- 1. A method of forming electrical connections to a piezo film, said film having a conductively coated outer surface and a conductively coated inner surface, said method comprising the steps of:
- positioning the film of a selected width and length so that the coating on the inner surface of end areas of the film face each other,
- placing a relatively rigid conductor bar between said end areas, said bar having a length substantially equal to the width of said film,
- providing a pair of elastomeric conductive pads having lengths substantially equal to the width of said film,
- pressing said pads against said end areas on the side opposite the film from the conductive bar at a selected pressure to make electrical contact between said outer conductive surface and said pads across the width of said film, and to force said inner conductive surface of said film into electrical contact with said rigid conductor bar across the width of said film, and
- connecting the conductive bar and the conductive pads to electrical conductors so that electrical signals may be applied to the coated film.
- 2. The method of claim 1 further including the step of providing a supporting means for positioning the film so that the coating on the end areas on one side face each other.
- 3. The method of claim 2 further including the step of providing clamping means to press the conductive pads against said coated film.
- 4. The method of claim 2 wherein the supporting means is cylindrical and further includes the step of adhering the film to said supporting means.
Parent Case Info
This application is a division of application Ser. No. 316,176, filed Oct. 29, 1981, U.S. Pat. No. 4,425,526.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4216403 |
Krempl et al. |
Aug 1980 |
|
4304126 |
Yelke |
Dec 1981 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
316176 |
Oct 1981 |
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