Claims
- 1. A method of making a packaging material, comprising the steps of:
providing a substrate comprising at least one sheet of plastic material; applying an energy-curable coating to one side of the substrate; curing the energy-curable coating by exposing it to a suitable energy; and applying a cold-seal cohesive coating to the other side of the substrate.
- 2. A method according to claim 1, further comprising the step of printing in ink on said at least one sheet of plastic material before applying said energy-curable coating.
- 3. A method according to claim 2, which comprises applying the energy-curable coating over the ink printing.
- 4. A method according to claim 1, comprising the steps of:
printing in ink on a sheet of plastic; and laminating the printed sheet of plastic and another sheet of plastic together with the printing between them to form said substrate; wherein one of said sheets of plastic forming said substrate is clear; and applying said energy-curable coating to the exposed side of said clear sheet of plastic.
- 5. A method according to claim 1, wherein said step of curing comprises exposing said energy-curable coating to an electron beam.
- 6. A method of making packaging material comprising the steps of:
printing an image on a first side of a substrate; applying an energy curable coating on the first side of the substrate over the printed image, the coating being formulated to act as a release layer for a cold-seal cohesive material once cured; curing the energy curable coating with an energy source to form a substantially transparent release layer on the first side of the substrate; and applying a cold-seal cohesive material to a second side of the substrate.
- 7. The method of claim 6 wherein the step of applying the cold-seal cohesive material comprises pattern applying the cold-seal cohesive material on areas of the second side of the substrate where seals are to be formed.
- 8. The method of claim 7 wherein the step of pattern applying comprises applying the cold-seal cohesive material at a thickness of from about 5 microns to about 7 microns.
- 9. The method of claim 6 further comprising the step of fixing slip additives in the energy curable coating during the curing process, wherein the slip additives do not poison the cold-seal coating material when the substrate is stored in a roll with the cold seal cohesive material in contact with the energy cured release layer.
- 10. A method of making a package comprising the steps of:
printing an image on a first side of a substrate; applying an energy curable release coating over the printed image; curing the energy curable release coating with an energy source to form a cured release layer on the substrate, processing additives within the coating becoming fixed during the curing process; pattern-applying a cold-seal material to a second side of the substrate to form a sealable packaging material; storing the packaging material in a roll with the cold-seal material in contact with the release layer, wherein the fixed processing additives in the release layer do not poison the cold seal; unrolling the packaging material such that the pattern-applied cold-seal material remains attached to the second side of the substrate and does not offset onto the release layer; forming the packaging material into the shape of a package; and pressing cold-seal coated portions of the second side of the packaging material together to form a seal.
- 11. The method of claim 10 wherein the step of pattern applying comprises applying the cold-seal cohesive material at a thickness of from about 5 microns to about 7 microns.
- 12. The method of claim 10 wherein the curing step comprises the step of exposing the coated substrate to electron beam energy such that the coating absorbs a dosage of from about 2.5 megarads to about 5 megarads.
- 13. The method of claim 12 wherein the coating absorbs a dosage of from about 3 megarads to about 4 megarads during the curing process.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application is a divisional of copending U.S. patent application Ser. No. 09/778,334 filed on Feb. 7, 2001, which is incorporated herein by reference in its entirety.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09778334 |
Feb 2001 |
US |
Child |
10702980 |
Nov 2003 |
US |