Claims
- 1. A process for producing a smooth-surfaced microsphere filled polyolefin tape or sheet having an average roughness of less than 20.mu. and/or a maximum peak-valley distance of less than 100.mu. as measured on a surface measuring apparatus comprising: extruding a composite material of a polyolefin and hollow microsphere filler through a die, wherein the die has a cross sectional area of about 250 mm.sup.2 and a land length to thickness (l:t) ratio less than 7:1, and the temperature of extrusion is greater than 200.degree. C. and less than 230.degree. C.
- 2. The process of claim 1 wherein the die ratio l:t is at most 5:1.
- 3. The process of claim 2 wherein the extrusion temperature is about 215.degree. C.
- 4. The process of claim 1 wherein the die thickness is from 1 mm to 10 mm and the die width is from 10 mm to 100 mm.
- 5. The process of claim 4 wherein the polyolefin is polypropylene and the microspheres are of an inorganic glass.
Priority Claims (1)
Number |
Date |
Country |
Kind |
92305671 |
Jun 1992 |
EPX |
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Parent Case Info
This is a continuation-in-part of U.S. patent application Ser. No. 08/075,449, filed Jun. 11, 1993, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4692480 |
Takahashi et al. |
Sep 1987 |
|
5032627 |
Wilson et al. |
Jul 1991 |
|
5158727 |
Coleman-Kammula et al. |
Oct 1992 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
2359060 |
May 1975 |
DEX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
75449 |
Jun 1993 |
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