Claims
- 1. A method for making thin silica flakes, which method comprises the sequential steps of
- a) heating hydrated alkali silicate particles to expand them into bubbles having an average diameter at least twice their original average diameter while reducing their average wall thickness to greater than zero and no more than 3 .mu.m,
- b) breaking the bubbles into fragments,
- c) neutralizing, washing, and drying the fragments to yield hydrated silica flakes having an average thickness greater than zero and no more than 3.0 micrometers.
- 2. The method as defined in claim 1 wherein said hydrated alkali silicate particles are hydrated sodium silicate particles.
- 3. The method as defined in claim 1 wherein said hydrated silica flakes having an average largest dimension in the range of 10 to 150 micrometers.
- 4. The method as defined in claim 1 wherein step c) is followed by a step of
- d) firing the hydrated silica flakes to provide refractory silica flakes.
- 5. The method as defined in claim 4 wherein the firing temperature is in the range of 500.degree. to 1200.degree. C.
- 6. The method as defined in claim 4 wherein step d) is carried out at temperatures gradually rising from ambient to the final firing temperature.
- 7. The process according to claim 1 wherein said hydrated silica flakes have an average wall thickness greater than zero and up to 1.5 micrometers.
- 8. The process according to claim 1 wherein said hydrated silica flakes have an average wall thickness in the range of 0.5 to 1.5 micrometers.
- 9. The process according to claim 1 wherein aid hydrated silica flakes have an average largest dimension in the range of 10 to 150 micrometers.
- 10. The method according to claim 1 wherein step c) is followed by the step of
- impregnating said hydrated silica flakes with 2 to 15 weight percent sodium hydroxide and then fusing the resulting flakes at a temperture in the range of 700.degree. to 900.degree..pi.C. to provide vitreous silica flakes.
- 11. The process according to claim 10 wherein said vitreous silica flakes have an average thickness greater than zero and up to 1.5 micrometers.
- 12. The process according to claim 5 wherein said firing temperature is in the range of 500.degree. to 900.degree. C.
- 13. The process according to claim 5 wherein aid refractory flakes have shrunk up to about 30 percent due to drying and firing compared to the hydrated silica flakes.
Parent Case Info
This is a division of application Ser. No. 07/314,752, filed Feb. 23, 1989 now U.S. Pat. No. 4,971,697.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0240952 |
Mar 1987 |
EPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
314752 |
Feb 1989 |
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