This invention relates to a method of and apparatus for manufacture, for example manufacturing components such as electrical components, for instance flat panel displays (FPDs).
Components such as FPDs are often manufactured in batches, for example a plurality of individual FPDs being made on the same sheet of glass. For example,
Position measurement encoders are provided on the machine 110 for determining the relative position of the various movable parts of the machine 110. For example, a metrological scale 124 that extends along the y-dimension is mounted on the side of the platform 112 and a readhead 126 for reading the scale 124 is mounted on the pillar 116 closest to the scale 124. A similar scale and readhead arrangement is provided (but not shown in
Before processing it is necessary to establish the position of the FPD sheet 150 on the machine 110. For this reason a plurality of fiducial marks 154 are provided. As shown, these may be in the form of an X in each corner of the FPD sheet 150. A camera mounted on the tool holder 120 (either in place of or as well as the tool 122, for instance provided as part of the tool) is driven around so as to find the fiducial marks 154 and take a photo of them. The control system 130 uses these fiducial marks to establish the position of the FPD sheet 150 on the machine and to adjust offsets to its program to correct for misalignment. Once the initial position has been found the position of the tool 122 relative to the FPD sheet 150 is tracked using the information from the readheads 126.
US2008/0094593 discloses a wafer processing apparatus, which like that shown in
As will be understood, the above process and machine is suitable for making all sorts of flat panel displays such as liquid crystal displays (LCD), light emitting diode (LED) displays, organic light-emitting diode (OLED) displays, plasma displays, and/or electronic paper (including e-paper and electronic ink display devices). Furthermore, similar processes are used during the manufacture of other types of electronic and non-electronic components.
Demands for higher quality, more reliable and cheaper FPDs in turn creates demand for increased accuracy and repeatability in the apparatus and methods used to manufacture FPDs. This is also true for other types of electronic and non-electrical components.
The present invention provides an improved method and apparatus for manufacturing components.
Accordingly, this application describes a method of manufacture, comprising taking a substrate on which at least one component is to be made, in which the relative position of the substrate and at least one substrate processing part is determined via at least a first metrological scale provided by the substrate.
According to a first embodiment of the invention there is provided a method of manufacturing at least one component in at least one component area on a substrate using a machine that has a substrate processing part that is relatively moveable with respect to the substrate, the method comprising: measuring the position of the substrate processing part relative to the substrate at least when the substrate processing part and substrate are in a positional relationship in which the substrate processing part can process the at least one component area on said substrate, by reading at least a first metrological scale provided by the substrate.
It has been found that providing a scale on the substrate itself and using that scale to measure the relative position of the substrate processing part and the substrate whilst they are in a positional relationship in which the substrate processing part can process the at least one component area enables components to be made with greater accuracy. In particular, doing so removes sources of error in the measurement of the relative position of the substrate processing part of the machine and the substrate. This is because, for instance, any lateral movement or offset of the substrate and also any thermal expansion/contraction of the substrate is automatically detected and compensated for by virtue of the machine reading scales that are provided on the substrate itself. Furthermore, in cases in which the substrate is transferred from one apparatus to another for subsequent processing, the scale is transferred with the substrate meaning that for each machine the same scale is used to determine the relative position of the substrate processing part of the apparatus. This helps to ensure consistency and repeatability of processing of the substrate across a plurality of different processing apparatus. This can be especially useful when different machines have different thermal effects on the substrate.
As will be understood, the method can comprise the substrate processing part processing the at least one component area. Processing can comprise inspecting or operating on the at least one component area. Such processing can also comprise relatively moving the substrate and the substrate processing part. This can be at the same time at which the substrate is inspected or operated on, or prior/subsequent to such inspection/operation. Accordingly, such processing can involve relative movement between the substrate processing part and the substrate. The relative position of the substrate processing part and the substrate during such processing can be determined by reading the at least first metrological scale. As will be understood, such processing is distinct from an initial substrate registration process such as those above described prior art methods which establish the position of the substrate on the platform by inspecting fiducials on the substrate. Indeed, such an initial registration process is not necessary when using the method of the invention because the relative position of the substrate and substrate processing part is measured by reading the at least first metrological scale provided by the substrate, thereby giving a direct measurement of their relative position.
At least one position sensor, and in particular at least one position sensor that is fixed relative to the substrate processing part can read the at least first metrological scale.
As will be understood, relative movement between the substrate processing part and the substrate can be effected by moving the substrate, or the substrate processing part or both of them.
Preferably, the method comprises monitoring the relative position, and for example monitoring relative movement, of the substrate processing part and substrate using the at least first metrological scale.
As will be understood, the method can also comprise measuring the position of the substrate processing part relative to the substrate by reading the at least first metrological scale, even when they are not in a positional relationship in which the substrate processing part can process the at least one component area. The method can comprise measuring the position of the substrate processing part relative to the substrate by reading the at least first metrological scale, in a plurality of different relative positions. Optionally, at least one of the relative positions is when the substrate processing part and substrate are in a positional relationship in which the substrate processing part can process the at least one component area, and at least one of the relative positions is when they are not in such a positional relationship.
The method can comprise using the first metrological scale to control the relative movement of the substrate processing part of the machine and the substrate. For instance a control system can use information from the first metrological scale to control the relative movement. In particular, the method can comprise a control system receiving position information from a position sensor reading the at least first metrological scale, e.g. as the substrate processing part and substrate move relative to each other. The control system can then control the relative movement of the substrate processing part of the machine and the substrate based on said position information. In particular, the control system can be configured to issue instructions to the machine so as to effect relative movement of the substrate processing part of the machine and the substrate based on said position information. Accordingly, the at least first metrological scale can be used in the machine's feedback, e.g. servo, loop for controlling the relative movement of the substrate processing part and the substrate.
The at least first metrological scale could extend in at least a first dimension. Accordingly, the method could comprise at least when the substrate processing part and substrate are in a positional relationship in which the substrate processing part can process the at least one component area on said substrate, measuring in at least a first dimension the position of the substrate processing part relative to the substrate, by reading at least a first metrological scale provided by and that extends along the substrate in the first dimension
Accordingly, the at least first metrological scale can be used to measure the relative position of the substrate processing part of the machine and the substrate in said first dimension. Preferably, the at least first metrological scale can be used to measure the relative position of the substrate processing part of the machine and the substrate in said first dimension, across the entire extent of the at least one component area in the first dimension. The length of the at least first metrological scale in said first dimension can be at least the length between the outermost boundaries of said at least one component area in the said first dimension. Of course, as will be understood, the at least first metrological scale in the first dimension could be provided by a single continuous scale or by a plurality of sub-scales extending along the first dimension (e.g. in-line with each other or staggered with respect to each other).
Accordingly, preferably for at least all relative positions in which the substrate processing part of the machine can process the at least one component area, the at least first metrological scale can be read so as to measure the relative position of the substrate processing part and substrate in said first dimension.
The substrate could comprise only a single component area. Optionally, the substrate can comprise a plurality of component areas.
For at least the area defined by the plurality of component areas, the at least first metrological scale can be used to measure the relative position of the substrate processing part of the machine and the substrate in said first dimension.
Preferably, the at least first metrological scale can be used to measure the relative position of the substrate processing part of the machine and the substrate in said first dimension, across the entire extent of the area defined by the plurality of component areas in the first dimension. The length of the at least first metrological scale in said first dimension can be at least the length between the outermost boundaries of said plurality of component areas in the said first dimension.
The plurality of component areas could be described as an array of component areas. The component areas could be arranged regularly or irregularly within the array. The array could be one dimensional or two dimensional. For at least the area defined by the array of component areas, the at least first metrological scale can be used to measure the relative position of the substrate processing part of the machine and the substrate in said first dimension. The length of the at least first metrological scale in said first dimension can be at least the length between the outermost boundaries of said array of component areas in the said first dimension.
Accordingly, preferably for at least all relative positions in which the substrate processing part of the machine can process the at least plurality of (e.g. the array of) component areas, the at least first metrological scale can be read so as to measure the relative position of the substrate processing part and substrate in said first dimension.
The method can comprise for at least first and second positional relationships in which the substrate processing part can respectively process first and second component areas on said substrate, measuring the position of the substrate processing part relative to the substrate by reading at least a first metrological scale provided by the substrate. Accordingly, preferably the at least first metrological scale can be used to measure the relative position of the substrate processing part and the substrate for at least the area defined by the array of component areas in at least a first dimension. Accordingly, the length of the at least first metrological scale in said first dimension can be at least the length between the outermost boundaries of said array in the said first dimension.
The method can comprise forming said first metrological scale on said substrate. This can be performed before said substrate is loaded onto the machine. Optionally, this can be performed whilst the substrate is on the machine. Forming said first metrological scale can comprise putting said metrological scale onto the substrate. Optionally, this can comprise securing a pre-made scale onto the substrate.
Preferably, the at least first metrological scale is provided by marks directly on and/or in the substrate (i.e. as opposed to marks on or in another intermediate material which is then secured onto the substrate). Accordingly, optionally, forming said first metrological scale can comprise forming a series of marks in the substrate. For example, this can comprise using a laser to form marks in the substrate, e.g. so as to ablate parts of the substrate thereby marking the substrate. Optionally, for example, this can comprise printing the metrological scale onto the substrate. Optionally, photolithographic techniques, chemical blacking, chemical etching, laser etching or other techniques can be used to form the metrological scale.
The at least first metrological scale can be formed on the substrate in a temporary state. Accordingly, the method can further comprise removing the at least first metrological scale from the substrate. Optionally, the at least first metrological scale can be formed on the substrate in a permanent state. For instance, the metrological scale can be formed so as to be an integral part of the substrate.
The at least first metrological scale could be provided on the upper face of the substrate; that is the same side of the substrate that faces and is processed by the substrate processing part of the machine. Optionally, the at least first metrological scale is provided on the lower face of the substrate; that is the side of the substrate that faces away from the substrate processing part of the face. Further optionally, the at least first metrological scale is provided on the rim of the substrate that extends between the upper and lower faces of the substrate.
The position sensor for reading the at least first metrological scale could be configured to read the at least first metrological scale from the same side of the substrate on which the first metrological scale is provided. Optionally the position sensor could be configured to read the at least first metrological scale from the opposite side of the substrate on which the at least first metrological scale is provided. For instance, the position sensor could be configured to read the at least first metrological scale through the substrate.
The machine can comprise at least one support on which the substrate can be loaded. The at least one support could comprise a platform on which the substrate can be supported. Optionally, the at least one support could comprise at least two reels between which the substrate is supported and passed. The machine can further comprise an arm, for example a gantry, moveable relative to the at least one support. The arm can carry the substrate processing part of the machine. The arm can be moveable relative to the at least one support in a linear dimension. Preferably, the method comprises the arm and hence the substrate processing tool moving relative to the substrate loaded on the at least one support in a dimension substantially parallel to the first dimension along which the at least first metrological scale extends. Optionally, the position sensor for reading the at least first metrological scale is provided on the arm of the machine. In particular, the position sensor could be provided on a vertical pillar of the arm. Optionally, the position sensor is provided in or on the at least one support of the machine. Optionally, the position sensor is mounted on the machine such that it can move between a reading position at which the position sensor can read a first metrological scale on a substrate loaded onto the at least one support and a retracted position at which the position sensor is retracted so as to facilitate loading and unloading of the substrate onto the at least one support. The position sensor could be provided on a position sensor supporting arm attached to the machine. The position sensor supporting arm could be configured such that it can pivot the position sensor between the reading and retracted positions.
The at least first metrological scale can comprise a series of position markings that, for example, define an incremental scale. The series of markings could comprise at least one reference mark defining a reference position along the length of the at least first metrological scale. The series of position markings can define an absolute scale. That is the series of position markings could comprise a series of absolute position markings. As will be understood, a series of absolute position markings define a plurality of unique positions along the length of the scale. In other words, such a scale typically has a plurality of features which encode unique position data along the measurement direction of the scale. Accordingly, this enables the relative position between the scale and the position sensor reading the scale to be determined without requiring relative movement between the two (unlike the case with an incremental scale). Often, absolute position markings are provided in the form of code-words, such as a series of unique code-words, extending along the length of the scale. Optionally, an absolute scale can comprise a series of position markings that define unique position information at each point along the entire extent of the scale. Accordingly, the position of a device reading the absolute series of position markings relative to the series of position markings can be determined from a single reading only at any point along the length of the series of position markings.
Preferably the series of position markings are provided in a single track. However, as will be understood this need not necessarily be the case and can be provided in more than one track. Furthermore, one track can comprise absolute position markings and the other incremental position markings.
Preferably, there is provided a substantially continuous series of position markings.
The method can further comprise creating an error map and/or error function for said first metrological scale. This can be performed before said substrate is loaded onto the machine. Optionally, this can be performed whilst the substrate is on the machine. As will be understood, an error map and/or error function can be used to correct any errors in the position information provided by the scale, e.g. due to irregular spacing of at least some of the features on the scale. The method can then further comprise using said error map and/or error function to correct measurements of the relative position of the substrate processing part of the machine and the substrate. The error map and/or error function could be used with and/or combined with any pre-determined error map and/or error function for the machine which could be used to correct all sorts of different types of sources of error in the machine such as orthogonality of the different movement axes, straightness of a movement axis and/or for example errors due to any non-flatness of the machine's platform on which the substrate is supported.
Creating an error map and/or error function for the at least first metrological scale can comprise comparing position readings taken from the at least first metrological scale with position readings taken from a calibration position measuring system. The calibration position measuring system can be a pre-calibrated position measuring system. The calibration position measuring system can be a laser interferometer. The position readings taken from the at least first metrological scale and the position readings taken from a calibration position measuring system can both relate to the position of the same part of a machine (e.g. the part on which a position sensor for reading the at least first metrological scale is located). The machine can be the aforementioned machine on which the substrate is loaded for processing. Optionally, the machine can be a different machine. For instance the machine could be a testing machine.
The method can comprise at least when a second substrate processing part and the substrate are in a positional relationship in which the second substrate processing part can process the at least one component area on said substrate, measuring the position of the second substrate processing part relative to the substrate, by reading at least a first metrological scale provided by the substrate. The metrological scale read to determine the relative position of the second substrate processing part can be same as that read to determine the relative position of the aforementioned substrate processing part. As will be understood, the second substrate processing part could be the next substrate processing part in line in a series of substrate processing parts for processing the at least one substrate. Optionally, there are other substrate processing parts. These could be used to process substrate, before, after or between the aforementioned substrate processing part and the second substrate processing part. Accordingly, the method can comprise a plurality of substrate processing parts processing the at least one component area, in which for at least some of the substrate processing parts, their relative position to the substrate at least when they are in a positional relationship in which they can process the at least one component area is measured by reading the at least first metrological scale.
The method can comprise the second substrate processing part processing the at least one component area (e.g. so as to inspect or operate on the at least one component area). As will be understood, features described above are equally applicable to the second substrate processing part.
The second substrate processing part can be provided by a second machine. Accordingly, the method can comprise subsequently loading said substrate onto a second machine.
The error map and/or error function for the at least first metrological scale can be used to correct measurements of the relative position of the substrate and the substrate processing parts of by each of the aforementioned and second substrate processing parts (and/or machines), and any further substrate processing parts (and/or machines). The error map and/or error function could be stored in memory associated with each machine. Optionally, the error map and/or error function could be stored in at least one server remote from said machine(s) and the method can comprise retrieving the error map and/or error function from the at least one remote server. Optionally, the error map and/or error function could be stored on the machine which was used in the generation of the error map and/or error function. Accordingly, the method could comprise the second machine retrieving the error map and/or error function for the at least first metrological scale from the at least one remote server
The substrate can comprise at least a second metrological scale. The second metrological scale can extend substantially parallel to the first metrological scale. For example, they can both extend along the substrate in a first dimension. The at least second metrological scale can be spaced apart from the at least first metrological scale. Accordingly, in line with the above the at least second metrological scale can also or instead be read to measure the relative position of the substrate processing part and the substrate at least when they are in a positional relationship in which the substrate processing part can process the at least one component area. Accordingly, the method can comprise a control system receiving position information from a position sensor on the machine reading the at least second metrological scale. Accordingly, there can be provided at least a second position sensor on the machine for reading the at least second metrological scale. As will be understood, the above mentioned features in connection with the at least first metrological scale are also appropriate and equally applicable to the at least second metrological scale.
The substrate can comprise at least a first auxiliary metrological scale. The at least first auxiliary metrological scale can extend in a different dimension to the at least first metrological scale. The at least first auxiliary metrological scale can extend orthogonally to the at least first metrological scale. For example, the at least first auxiliary scale can extend along the substrate in a second dimension. The second dimension can be orthogonal to the first dimension. As will be understood, even if the at least first auxiliary metrological scale doesn't extend orthogonal to the first metrological scale, then position information in a dimension orthogonal to the at least first metrological scale can be resolved from the at least first auxiliary metrological scale. The method could comprise establishing the location of the substrate using the at least first auxiliary scale. The method could comprise establishing the relative position of the substrate processing part of the machine and the substrate in the second dimension using the at least first auxiliary scale. Optionally, the at least first auxiliary scale is used to determine, and for example monitor, the relative position of the substrate processing part of the machine and the substrate in the second dimension. Accordingly, the method can comprise using the first auxiliary scale to control the relative movement of the substrate processing part of the machine and the substrate. For instance a control system can use information from the first auxiliary scale to control the relative movement. Accordingly, the method can comprise a control system receiving position information from a position sensor on the machine reading the at least first auxiliary metrological scale, and controlling the relative movement of the substrate processing part of the machine and the substrate based said position information. The at least first auxiliary metrological scale could extend only part way across the substrate in the second dimension. The length of the at least first auxiliary metrological scale in said second dimension could be at least the width defined by outermost boundaries of the at least one component area taken in the second dimension. The at least first auxiliary metrological scale could extend across the entire width of the substrate in the second dimension. In particular, in embodiments in which there are a plurality of component areas, the first auxiliary metrological scale can be used to monitor the relative position of the substrate processing part of the machine and the substrate in said second dimension during said processing of at least one of the at least one component areas. The length of the at least first auxiliary metrological scale in said second dimension can be at least the length between the outermost boundaries of said plurality of component areas in the said second dimension. As will be understood, the features described above in connection with the at least first metrological scale are also equally relevant and applicable to the at least first auxiliary metrological scale.
Accordingly, as is clear from the above, the at least first metrological scale (and optionally at least second metrological scale and/or at least first auxiliary scale) can be used to determine, and for example monitor, the relative position of the substrate and a substrate processing part of the machine during processing of at least one of the at least one flat panel display areas. Processing the substrate, or more particularly at least one component area, can comprise at least one of inspecting at least one of the at least one component areas; and interacting with so as to alter at least one of the at least one component areas. Inspecting could comprise obtaining at least one image of at least one of the at least one component areas, e.g. so as to identify the location of features/defects for measurement or other purposes, e.g. in the case of flat panel displays for measuring the quality of pixels and/or parameters of a component being made. Interacting with so as to alter at least one of the at least one component areas could comprise performing an additive, subtractive or manipulative process on the at least one component area, e.g. in the case of flat panel displays this could comprise injecting liquid crystal into a pixel, and/or laser processing so as to alter or remove a pixel.
The at least first metrological scale can extend in first and second dimensions, in particular first and second orthogonal dimensions. Accordingly, the at least first metrological scale could be a two-dimensional scale.
Optionally, the machine can comprise a secondary position measuring system for determining the position of the substrate processing part and the substrate (for example in the at least first dimension). In particular, the secondary position measuring system can be configured to determine, for example monitor, the relative position of the substrate processing part and/or another part of the machine, for instance the at least one support on which the substrate is loaded. The secondary position measuring system can provide such position information to a coarser degree of accuracy than that provided by using the at least first metrological scale.
The substrate can comprise a sheet on which at least one component can be made. The substrate could comprise a panel or board of material onto which a component is to be made. For example, the substrate can be a flat panel display sheet comprising at least one flat panel display area which is to be made into a flat panel display. The panel or board, could be substantially rigid.
The substrate could be a flexible substrate. This is especially the case when the substrate is supported by and passed between a plurality of reels, e.g. in a reel-to-reel processing machine. Accordingly, the substrate could be provided on a reel. Accordingly, the substrate can be unrolled from the reel during the manufacture of the at least one component and passed between a plurality of reels. The substrate processing part can process the unrolled substrate.
As mentioned above, the scale could be provided by the substrate in a number of suitable manners. For instance, the pre-made scale could be secured onto the substrate. In this case, the scale is optionally made from the same material as the substrate, but this need not necessarily be the case. In such as case, preferably the scale is mastered to the substrate such that the thermal expansion/contraction of the substrate dominates over any such thermal expansion/contraction of the scale. That is, the scale can be slaved to thermally induced expansion/contraction of the substrate. In other words, preferably the effect of thermal expansion of the substrate on the scale is greater than that of the scale on the substrate, and in particular, preferably at least 50 times greater, especially preferably at least 100 times greater.
Accordingly, this application also describes a method of manufacturing a component comprising: taking a substrate comprising at least one component area, the substrate having at least a first metrological scale comprising a series of position markings extending along the substrate; in which the at least first metrological scale is used to monitor the relative position of the substrate and a substrate processing part of a machine that is used to process at least one of the at least one component areas.
According to a second aspect of the invention there is provided an apparatus for manufacturing at least one component on a substrate, comprising: a machine for receiving a substrate comprising at least one component area in which a component is to be made, the machine comprising a substrate processing part for processing the at least one component area, the substrate processing part and substrate being movable relative to each other such that they can be moved into a positional relationship in which the substrate processing part can process the at least one component area on said substrate; at least one position sensor configured such that when the substrate processing part and substrate are in such a positional relationship, the position sensor can read a scale provided by the substrate; and a control system configured to receive such readings from the at least one position sensor and to measure the relative position of the substrate processing part and the at least one component area.
The control system can also be configured to control relative movement of the substrate processing part and the substrate during said processing.
According to a third aspect of the invention there is provided a substrate comprising at least a first metrological scale provided by the substrate, for use in any of the above described the methods or apparatus.
According to a fourth aspect of the invention there is provided a substrate comprising at least one component area which is to be made into at least one component, the substrate having at least a first metrological scale extending along the substrate in a first dimension by at least the same length as the length of the at least one component area taken in the first dimension such that the at least first metrological scale can be read when a substrate processing part is in a positional relationship relative to the substrate for processing the at least one component area so as to measure their relative position. Accordingly, the metrological scale can be used during the processing of at least one of the at least one component areas to monitor the relative position of a substrate processing part of a machine on which the substrate is loaded and the substrate in said first dimension.
As above, the substrate can be a flat panel display sheet comprising at least one flat panel display area which is to be made into a flat panel display.
According to another aspect of the invention there is provided a method of manufacturing at least one component in at least one component area on a substrate comprising forming at least a first metrological scale (for reading by a readhead) on the substrate. Preferably, the at least a first metrological scale extends along the substrate in a first dimension by at least the same length as the length of the at least one component area taken in the first dimension. As mentioned above, the scale could be formed before the substrate is loaded onto a machine for processing the component. Optionally, this can be performed whilst the substrate is on the machine. Forming said first metrological scale can comprise putting said metrological scale onto the substrate. This can comprise putting marks directly on and/or in the substrate. For example, this can comprise printing the metrological scale onto the substrate. Optionally, forming said first metrological scale can comprise forming a series of marks in the substrate. For example, this can comprise using a laser to form marks in the substrate, e.g. so as to ablate parts of the substrate thereby marking the substrate. Optionally, putting said metrological scale onto the substrate can comprise securing a pre-made scale onto the substrate.
This application also describes a method of manufacture, comprising: generating an error map and/or error function for a metrological scale located on a substrate; loading the substrate onto at least one machine for processing, the machine using the substrate's scale during processing of the workpiece; and supplying the error map and/or error function for the substrate's scale to the at least one machine for use during said processing. The error map and/or error function can be used to correct measurements obtained from the metrological scale. Optionally, during manufacture of the substrate, the substrate can be loaded onto a plurality of machines which use the substrate's scale during processing of the workpiece. The method can comprise supplying the error map and/or error function to a plurality of those machines for use during processing of said substrate. Each machine could retrieve the error map and/or error function from memory local to the machine when needed, e.g. when the substrate is loaded on the machine. Optionally, the error map and/or error function could be stored on a remote server and the error map and/or error function could be retrieved from the remote server when needed, e.g. when the substrate is loaded on the machine. As will be understood, the substrate can be a flat panel display sheet, in particular a flat panel display sheet such as one described in more detail above and below.
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
Referring now to the figures,
Position measurement encoders are provided for determining the relative position of the various movable parts of the machine 210. For example, although not shown, a readhead and scale arrangement are provided on the tool holder 220 and cross-member 218 to enable their relative position in the x-dimension to be reported back to the control system 230. Unlike the embodiment shown in
Furthermore, as can be seen from
The position of the tool 222 relative to the FPD sheet 250 in the dimension parallel to the length of the first 254 and second 256 scales (i.e. in the y-dimension in the set up shown in
If desired, an additional position measurement encoder for determining the position of the gantry 214 relative to the platform 212 could be provided, e.g. on the gantry 214 and platform 212 so that their position can be determined. For example, an additional readhead and scale configured similar to that shown in
The steps involved in an example process 400 for manufacturing a FPD according to the invention are illustrated in
Once the first 254 and second scale 256 scales have been put onto the FPD sheet 250, the FPD sheet 250 is then passed to a testing machine. (However, as will be understood the machine for forming the scales and the testing machine can be the same machine. Indeed, the same machine could also be used to process the FPD sheet). The testing machine is similar to that shown in
After the error map and/or error function has been generated for the FPD sheet 250, the method proceeds to step 406 at which point the FPD sheet 250 is loaded onto the machine 210. This could be done manually, e.g. via an operator controlling the lifting of the FPD sheet 250 from the testing machine via hand, or with the aid of machinery, and placing the FPD sheet 250 onto the machine 210 which is to process the FPD sheet 250. Optionally, this could be done automatically. For instance, the FPD sheet 250 could be transported from the testing machine to the machine for processing the FPD sheet 250 via a suitable transit mechanism such as a robot arm configured to pickup, move and place down the FPD sheet 250.
At step 408 the machine 210 retrieves the error map and/or error function for the FPD sheet 250 loaded onto it. (As will be understood, the error map and/or error function could be retrieved before, after or whilst the FPD sheet 250 is loaded onto the machine). In the embodiment described the error map and/or error function is retrieved from a central server which stores all error maps and/or error functions for all of the FPD sheets that the machine is to process. Of course other implementations are possible. For instance the machine 210 can itself store the error map and/or error function for the FPD sheet 250 and any other FPD sheets it is to process. Accordingly, the machine 210 can retrieve the error map and/or error function from its local memory on loading of the FPD sheet. The error map and/or error function for the FPD sheet 250 could be combined with any previously generated error map(s) and/or error function(s) for the machine thereby enabling errors caused by the machine configuration and also by the FPD sheet's 250 first 254 and second 256 scales to be compensated for.
The machine 210 then at step 410 processes the FPD sheet 250 in accordance with its predetermined routine. For example, the machine could use the tool 222 to inject liquid crystal into individual cells/pixels in one or more of the regions 252, inspecting one or more of the regions 252 for faults/defects, for instance via obtaining at least one images of at least a part of a region 252, and/or repair at least a part of a region 252, e.g. using a laser to remove a broken pixel. As will be understood, this will involve movement of the tool 222 relative to the FPD sheet 250 in order to locate the tool in the appropriate place. During the processing operation the position of the tool 222 relative to the FPD sheet 250 in the y-axis is monitored using the outputs of the first 226 and second 228 readheads which read the first 254 and second 256 scales printed on the FPD sheet 250. The error map and/or error function is used to correct the measurements obtained via the first 226 and second 228 readheads. As the position is being measured directly off the FPD sheet 250 itself the position of the tool 222 relative to the FPD sheet 250 is accurately known in the y-dimension, even if the FPD sheet 250 moves relative to the platform, and/or undergoes thermal expansion/contraction prior to and/or during the processing operation. Furthermore, it may be that there is a preferred location of the FPD sheet 250 on the platform 212 in the y-dimension. Any offset of the FPD sheet 250 from the preferred location can be determined from the first 254 and second 256 scales on the FPD sheet itself. Depending on the machine setup, this may also require information from encoders/position sensors on the machine itself. Any such longitudinal offset can be reduced or eliminated by moving the FPD sheet 250 back to the preferred location using the first 254 and second 256 scales, and/or the offset can be automatically compensated by the control system 230.
Once the processing of the FPD sheet 250 on the machine 210 is complete it is determined at step 412 if the FPD sheet 250 requires more processing on a subsequent machine. Indeed, the FPD sheet 250 could be required to be processed by many machines similar to that shown in
If processing is required on a subsequent machine, then the FPD sheet 250 is loaded onto the next machine (either manually or automatically as described above in connection with the loading of the FPD sheet 250 onto the first machine 210) at step 414. This subsequent machine then retrieves the error map and/or error function at step 408 (for example from a central sever or from a local memory device) and processes the FPD sheet 250 in accordance with its dedicated processing operation at step 410. In line with the above this involves the subsequent machine determining position of any such tool on the gantry relative to the FPD sheet in the y-axis via the outputs of the first 226 and second 228 readheads (which are corrected using the error map and/or error function). Steps 408 to 414 continue until all processing of the FPD sheet 250 is complete by the last machine in the manufacturing line.
In the embodiments described above, the first 254 and second 256 scales define a series of absolute positions, and are commonly known as absolute scale, for instance as described in U.S. Pat. No. 7,499,827 and U.S. Pat. No. 5,279,044. However, this need not necessarily be the case. For instance the first 254 and/or second 256 scales could comprise incremental scales (with or without reference mark positions), for instance as described in U.S. Pat. No. 4,974,962 and U.S. Pat. No. 7,659,992.
In the embodiments described above, the first 254 and second 256 scales are provided by a continuous series of features. However, as will be understood, this need not necessarily be the case. For instance, the first 254 and second 256 scales could be provided by a series of distinct groups of scale features spaced along the length of the FPD glass. For instance, there could be gaps in the first 254 and second 256 scales, e.g. at gaps between the different regions 252.
In the embodiments described above the scales have been formed on the topside of the FPD sheet 250, that is the side of the FPD sheet 250 that is processed by the machine on which it is loaded. Nevertheless, the scales could be formed on the underside of the FPD sheet 250. In this case the readheads could be configured to read the scale through the FPD sheet 250 or could be located such that they read the scale from underneath the FPD sheet 250. In a further embodiment, at least one of the scales could be provided on the vertical edges of the FPD sheet 250, i.e. on the rim of the FPD sheet 250.
Furthermore, in the embodiments described above the scales are formed permanently on the FPD sheet 250. They do not interfere with the final product formed in the regions 250 because they are not located in the regions 252. In other embodiments, the scales could be formed temporarily on the FPD sheet 250, e.g. by printing the scales on the FPD sheet 250 using non-permanent ink. After processing, the scale markings could be removed by washing using appropriate chemicals. This can enable the scales to be located anywhere on the FPD sheet 250, including in the regions 252 themselves.
Furthermore, the above described embodiments describe a plurality of regions 252 being provided on an FPD sheet 250. However, as will be understood, there could be as few as one region provided on the FPD sheet 250.
Further still, the above described embodiments comprise first (and optionally second) scales 254, 306 (256) that are used for all of the regions 252, 302 on the substrate 250, 300. However, as will be understood, there could be provided separate scales for different regions 252, 302. For instance, there could be provided one individual scale for each region 252, 302. Optionally, there could be provided at least one scale for at first group of regions and at least one other scale for a second group of regions.
Number | Date | Country | Kind |
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11250638.1 | Jul 2011 | EP | regional |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/GB2012/000569 | 7/5/2012 | WO | 00 | 12/17/2013 |