Claims
- 1. A method of manufacturing a chip transformer comprising the following steps:
- (a) preparing a first magnetic plate;
- (b) forming an insulating sheet on said first magnetic plate;
- (c) forming a first plurality of ring-shaped patterned electrodes on said insulating sheet;
- (d) forming a second insulating sheet on said patterned electrodes, and further forming a second plurality of ring-shaped patterned electrodes on said second insulating sheet so that said second plurality of patterned electrodes are positioned above said first plurality of patterned electrodes;
- wherein said first and second insulating sheets are formed by exposing and developing light-curable polyimide resin;
- wherein said first and second pluralities of ring-shaped patterned electrodes are formed with approximately equal line lengths, and with respective ones of said first and second pluralities overlapping each other with said second insulating sheet therebetween;
- (e) laminating a third insulating sheet and a second magnetic plate on said second plurality of patterned electrodes to make a laminate body;
- (f) cutting said laminate body to form a plurality of cut laminate bodies;
- (g) forming external electrodes connected to said first plurality and said second plurality of patterned electrodes on the external faces of each of said cut laminate bodies.
- 2. A method of manufacturing a chip transformer in accordance with claim 1, which further comprises the step (h) of repeating said step (d) at least one additional time after said step (d).
- 3. A method of manufacturing a chip transformer in accordance with claim 1, wherein said first and second pluralities of patterned electrodes are formed by photolithography.
- 4. A method of manufacturing a chip transformer in accordance with claim 1, wherein marks are formed on said first magnetic plate for guiding the cutting of said laminated body in said step (f).
- 5. A method of manufacturing a chip transformer in accordance with claim 2, wherein said first and second pluralities of patterned electrodes are formed by photolithography.
- 6. A method of manufacturing a chip transformer in accordance with claim 1, wherein said third insulating sheet is made of an adhesive resin and adheres said second magnetic plate onto said second plurality of patterned electrodes.
- 7. A method of manufacturing a chip transformer in accordance with claim 2, wherein said third insulating sheet is made of an adhesive resin and adheres said second magnetic plate onto said second plurality of patterned electrodes.
- 8. A method of manufacturing a chip transformer in accordance with claim 3, wherein said third insulating sheet is made of an adhesive resin and adheres said second magnetic plate onto said second plurality of patterned electrodes.
- 9. A method of manufacturing a chip transformer in accordance with claim 5, wherein said third insulating sheet is made of an adhesive resin and adheres said second magnetic plate onto said second plurality of patterned electrodes.
- 10. A method of manufacturing a chip transformer in accordance with claim 1, wherein said first and second magnetic plates are fired prior to said preparing and laminating steps (a) and (e).
- 11. A method of manufacturing a chip transformer in accordance with claim 2, wherein said first and second magnetic plates are fired prior to said preparing and laminating steps (a) and (e).
- 12. A method of manufacturing a chip transformer in accordance with claim 3, wherein said first and second magnetic plates are fired prior to said preparing and laminating steps (a) and (e).
- 13. A method of manufacturing a chip transformer in accordance with claim 5, wherein said first and second magnetic plates are fired prior to said preparing and laminating steps (a) and (e).
- 14. A method of manufacturing a chip transformer in accordance with claim 6, wherein said first and second magnetic plates are fired prior to said preparing and laminating steps (a) and (e).
Priority Claims (1)
Number |
Date |
Country |
Kind |
5-347460 |
Dec 1993 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 08/359,609, filed Dec. 20, 1994, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3765082 |
Zyetz |
Oct 1973 |
|
5197170 |
Senda et al. |
Mar 1993 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
404354309A |
Dec 1992 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
359609 |
Dec 1994 |
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