Claims
- 1. A method of manufacturing a laminated ferrite chip inductor array, comprising steps of:printing, on individual ferrite sheets having electrically communicating through holes, U-shaped conductor patterns disposed 180° to one another on each ferrite sheet; piling the ferrite sheets together; and sintering the piled ferrite sheets to form the laminated ferrite chip inductor array with each U-shaped conductor pattern opposed adjacent to one another on each of said individual ferrite sheets.
- 2. The method of claim 1, wherein the step of piling comprises the step of:interposing an air gap between at least one part of the U-shaped conductors and the ferrite sheets.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-356813 |
Dec 1998 |
JP |
|
Parent Case Info
This application is a Division of application Ser. No. 09/460,420 Filed on Dec. 14, 1999 now U.S. Pat. No. 6,249,206.
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