Claims
- 1. A process for fabricating a patterned light emitting diode (LED) device comprising:forming a layer of an active material over one of either an anode or a cathode; placing a mold in contact with the layer of active material, wherein the mold includes a surface with a patterned recessed portion therein; causing the layer of active material to flow into the patterned recessed portion thereby forming a layer of patterned active material with a first portion having a first thickness and a second portion having a second thickness, the portion having the second thickness corresponding to a pattern defined by the patterned recessed portion in the mold surface; removing the mold from contact with the layer of patterned active material; and forming the other of an anode or a cathode over the layer of patterned active material such that the layer of patterned active material is between the anode and the cathode.
- 2. The process of claim 1 wherein the first thickness of the layer of patterned active material is selected to provide a first area of the light emitting diode device associated with the first thickness that is visually distinct from a second area of the light emitting diode device associated with the second thickness.
- 3. The process of claim 1 wherein the layer of patterned active material is selected from the group consisting of a light-emitting material, a hole transport material, an electron transport material, and combinations thereof.
- 4. The process of claim 1 wherein the anode is formed on a substrate.
- 5. The process of claim 4 wherein the anode and the substrate on which the anode is formed are transparent to light emitted by the layer of patterned active material.
- 6. The process of claim 1 wherein the mold is made of an elastomeric material.
- 7. The process of claim 1 wherein the layer of active material is a light-emitting material that is soluble in an organic solvent and wherein the process further comprises wetting the mold surface with an organic solvent prior to contact between the mold surface and the light-emitting material.
Parent Case Info
The present invention is a divisional of application Ser. No. 09/095,236, U.S. Pat. No. 6,252,253, of Zhenan Bao, et al., filed on Jun. 10, 1998 entitled “Patterned Light Emitting Diode Devices”. This reference is commonly assigned with the present invention.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5936347 |
Isaka et al. |
Aug 1999 |
A |
6080030 |
Isaka et al. |
Jun 2000 |
A |