Claims
- 1. A method of making a magnetic head assembly comprising the steps of:
- providing a slider with first and second surfaces, the first and second surfaces being bounded by leading and trailing edge surfaces and first and second side surfaces;
- forming a magnetic head adjacent the trailing edge surface of the slider, said magnetic head having at least one flux emanating and/or flux receiving a sensitive element at said first surface;
- forming a wear coating consisting of a single layer directly covering said first surface and the sensitive element for forming an air bearing surface; and
- said single layer being a layer of silicon or silicon-based material with a thickness in the range of 30 to 75 .ANG..
- 2. A method as claimed in claim 1 further including, after forming the single layer, patterning the first surface to provide the slider with at least one rail which is covered with at least a portion of the wear layer.
- 3. A method as claimed in claim 2 wherein the step of forming the single layer comprises sputtering silicon with a DC magnetron.
- 4. A method of making magnetic head assemblies comprising the steps of:
- providing a substrate of slider material;
- forming rows and columns of magnetic heads on said substrate;
- dicing the substrate and magnetic heads into rows of magnetic head assemblies on an elongated substrate portion of said substrate;
- lapping a row of magnetic heads on said elongated substrate portion to form a lapped surface which sizes one or more sensitive elements of each magnetic head;
- sputtering a single layer of substantially pure silicon directly onto the lapped surface;
- the single layer having a thickness in the range of 30-75 .ANG.; and
- dicing the row of magnetic assemblies into individual magnetic head assemblies each including a slider.
- 5. A method as claimed in claim 4 wherein the step of sputtering the single layer includes sputtering said substantially pure silicon on said sensitive elements.
- 6. A method as claimed in claim 5 wherein after the step of sputtering the single layer, patterning the lapped surface to provide each slider with at least one rail which is covered with a portion of said single layer.
- 7. A method as claimed in claim 6 wherein the step of sputtering the single layer comprises sputtering with a DC magnetron.
- 8. A method as claimed in claim 7 wherein the substrate is Al.sub.2 O.sub.3 TiC.
Parent Case Info
This application is a divisional application of Ser. No. 08/607,892, filed Feb. 27, 1996, now U.S. Pat. No. 5,808,832.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
607892 |
Feb 1996 |
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