Claims
- 1. A method of manufacturing an aluminum-stabilized superconducting wire, comprising the step of hot-extrusion-coating an entirety or a part of an outer circumference of a superconducting wire which includes a superconducting filament embedded in a copper or copper-alloy matrix, with a stabilizer made of a precipitation-type aluminum alloy, wherein the precipitation-type aluminum alloy is an Al—Ni alloy containing 100 to 25000 ppm of Ni, and the stabilizer made of the precipitation-type aluminum alloy is subjected prior to the hot extrusion coating step, to an aging-heat treatment in which it is heated at a temperature of 250° C. to 500° C. for 10 minutes or more.
- 2. A manufacturing method according to claim 1, wherein the aging-heat treatment is carried out at a temperature of 250° C. or more and or less.
- 3. A manufacturing method according to claim 1, wherein the precipitation-type aluminum alloy is an Al—Ni alloy containing at least one selected from the group consisting of As, Bi, Ca, Cd, Cu, Ga, Mg, Pb, Sc, Si, Sn and Zn.
- 4. A manufacturing method according to claim 1, wherein the superconducting wire is made of a plurality number of superconducting filaments embedded in a copper or copper alloy matrix, and an outer circumference thereof is coated with a stabilizer made of a high purity aluminum.
- 5. A manufacturing method according to claim 1, further comprising the step of coating an entirety or a part of the circumference of the superconducting wire coated with the stabilizer, made of high purity aluminum or copper, after the hot extrusion coating step.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-268288 |
Sep 1998 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
This is a continuation of Application No. PCT/JP99/05163, filed Sep. 21, 1999.
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 10-268288, filed Sep. 22, 1998, the entire contents of which are incorporated herein by reference.
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JP |
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JP |
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Entry |
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Continuations (1)
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Number |
Date |
Country |
Parent |
PCT/JP99/05163 |
Sep 1999 |
US |
Child |
09/574503 |
|
US |