Claims
- 1. A method of placing a ceramic coating on an article of manufacture comprising a substrate formed of a nickel or cobalt-based superalloy, the method which comprises:
placing a bonding layer on the substrate; placing an anchoring layer chemically different from said bonding layer and comprising a nitride compound on the bonding layer; and placing the ceramic coating on the anchoring layer.
- 2. The method according to claim 1, wherein the step of placing the anchoring layer is performed by physical vapor deposition.
- 3. The method according to claim 1, wherein the step of placing the anchoring layer comprises:
establishing an atmosphere containing nitrogen around the substrate; creating the anchoring layer by subjecting the substrate and the atmosphere to an elevated temperature; placing at least one metal to a surface on the substrate; and reacting the metal with the nitrogen to form the nitride compound.
- 4. The method according to claim 3, wherein a plasma containing ionized nitrogen is formed around the substrate.
- 5. The method according to claim 1, wherein the metal is placed on the substrate by coating the substrate with the metal.
- 6. The method according to claim 1, wherein the metal is placed on the substrate by diffusing the metal out of the substrate.
- 7. The method according to claim 1, wherein the metal is placed on the substrate by diffusing the metal out of a bonding layer priorly placed on the substrate.
- 8. The method according to claim 1, wherein the metal is selected from the group consisting of aluminum and chromium.
- 9. The method according to claim 1, wherein a surface is prepared on the substrate, the surface having a surface roughness Ra, less than 2 μm, prior to placing the anchoring layer on the surface, and wherein the ceramic layer is placed with a columnar grained structure.
- 10. The method according to claim 9, wherein the surface is prepared by polishing.
- 11. The method according to claim 9, wherein the surface is prepared on the bonding layer.
- 12. The method according to claim 9, wherein the ceramic layer is placed by physical vapor deposition.
- 13. The method according to claim 1, wherein a surface is prepared on the substrate, the surface having a surface roughness Rz greater than 35 μm and a surface roughness Ra, greater than 6 μm, prior to placing the anchoring layer on the surface, and wherein the ceramic layer is placed with an equiaxial structure.
- 14. The method according to claim 13, wherein the surface is prepared by placing a bonding layer on the substrate by vacuum plasma spraying, establishing the surface on the bonding layer and leaving the surface without smoothing treatment.
- 15. The method according to claim 13, wherein the ceramic layer is placed by atmospheric plasma spraying.
Priority Claims (1)
Number |
Date |
Country |
Kind |
96 109 537.9 |
Jun 1996 |
EP |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. application Ser. No. 09/211,109, filed Dec. 14, 1998 which was a continuation of International application No. PCT/EP97/02861, filed Jun. 2, 1997, which designated the United States and which was published in English.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09211109 |
Dec 1998 |
US |
Child |
10281030 |
Oct 2002 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/EP97/02861 |
Jun 1997 |
US |
Child |
09211109 |
Dec 1998 |
US |