Patent Application
20180318897
The present invention relates to a technology that bonds metal wires of a band-shaped metal wire member together.
Patent Literature 1 discloses a technology that forms a portion to be swaged, the portion being formed on an end portion of a braided metal wire portion and having metal wires resistance welded together, and swages a barrel of a terminal fitting to the portion to be swaged.
The portion to be swaged is preferably formed in a shape and size that is approximately accommodated by the barrel. In order to achieve this, the end portion of the braided metal wire portion is preferably welded within a die.
However, when a braided wire having a band shape is used as the braided metal wire portion, arranging the band-shaped braided metal wire portion in the die stably is difficult. Therefore, there is an issue where the post-welding shape of the portion to be swaged may vary.
In view of the above, the present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die.
In order to resolve the above-noted issue, a first aspect is a method of manufacturing a band-shaped metal wire member that includes a bonded portion, the method including: (a) a step of preparing a die that includes a first die provided with a depression and a second die provided with a projection that can be arranged within the depression so as to close off a space above the depression, an inner surface of the depression including a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward, the central die surface being formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces; (b) a step of folding in two a bonding process portion that is on at least a portion of an extension direction of the band-shaped metal wire member; (c) a step of arranging the bonding process portion of the band-shaped metal wire member within the depression such that two side edge portions of the bonding process portion are oriented toward the interior of the depression; (d) a step of inserting the projection into the depression and pressing the bonding process portion within the depression; and (e) a step of bonding metal wires in the bonding process portion together between the projection and the depression.
A second aspect is the method of manufacturing the band-shaped metal wire member that includes the bonded portion according to the first aspect, in which the central die surface is set to a width dimension no more than two times a thickness dimension of the band-shaped metal wire member.
A third aspect is the method of manufacturing the band-shaped metal wire member that includes the bonded portion according to the first or second aspect, in which the central die surface is a flat surface.
A fourth aspect is a method of manufacturing a terminal-equipped band-shaped metal wire member including: (A) a step of manufacturing a band-shaped metal wire member that includes a bonded portion with the method of manufacturing a band-shaped metal wire member that includes a bonded portion according to any one of the first to third aspects; and (B) a step of crimping a terminal to the bonded portion in a state where a positioning member is inserted into a gap between two side portions of the band-shaped metal wire member, at a location on the band-shaped metal wire member adjacent to the bonded portion.
A fifth aspect is a die that bonds a plurality of metal wires together in at least a portion of an extension direction of a band-shaped metal wire member, the die including: a first die provided with a depression; and a second die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces.
A band-shaped metal wire member that includes a bonded portion according to a sixth aspect is a member in which the bonded portion is formed by bonding the plurality of metal wires together in at least a portion of an extension direction of the band-shaped metal wire member, which is assembled such that the plurality of metal wires form an elongated band shape. The bonded portion is formed by bonding the plurality of metal wires together in a state where two side portions of the band-shaped metal wire member are deformed such that two side edge portions of the band-shaped metal wire member face each other and the two side portions meet on one principal surface side at a width-direction center portion of the band-shaped metal wire member. An outer circumferential surface of the bonded portion includes a central surface formed at the portion where the two side edge portions of the band-shaped metal wire member face each other, and a pair of curved surfaces that are provided continuous with two sides of the central surface and are curved so as to project outward. The central surface is formed as a flat surface or as a surface that curves more gently than the pair of curved surfaces.
According to the first aspect, the bonding process portion of the band-shaped metal wire member is arranged within the depression such that the two side edge portions of the bonding process portion are oriented toward the interior of the depression, and the projection is inserted into the depression in this state, pressing the bonding process portion within the depression. The two side edge portions of the bonding process portion are then guided to the width-direction center portion of the base of the depression by the pair of curved guide die surfaces, and when the two side edge portions reach the central die surface, which curves gently or is a flat surface, the two side edge portions remain in a stable state. Therefore, the band-shaped metal wire member can be stably accommodated within the die. In addition, in this state, the metal wires in the bonding process portion are bonded together between the projection and the depression, enabling formation of a bonded portion having a stable shape.
According to the second aspect, the central die surface is set to a width dimension no more than two times the thickness dimension of the band-shaped metal wire member, and therefore a state can be achieved where the two side edge portions of the bonding process portion are more reliably positioned at the width-direction center of the depression.
According to the third aspect, the central die surface is a flat surface, and therefore the two side edge portions of the bonding process portion are more stable in a state where the two side edge portions are in contact with the central die surface at the width-direction center of the depression.
According to the fourth aspect, the terminal can be crimped to the bonded portion in a state where the bonded portion has been positioned, and therefore the format of crimping the bonded portion and the terminal together is stabilized.
According to the fifth aspect, the bonding process portion of the band-shaped metal wire member can be arranged within the depression such that the two side edge portions of the bonding process portion are oriented toward the interior of the depression (for example, downward), and the projection can be inserted into the depression in this state, pressing the bonding process portion within the depression. The two side edge portions of the bonding process portion are then guided to the width-direction center portion of the base of the depression by the pair of curved guide die surfaces, and when the two side edge portions reach the central die surface, which curves gently or is a flat surface, the two side edge portions remain in a stable state. Therefore, the band-shaped metal wire member can be stably accommodated within the die. In addition, in this state, the metal wires in the bonding process portion are bonded together between the projection and the depression, enabling formation of a bonded portion having a stable shape.
According to the sixth aspect, the plurality of metal wires can be bonded together in a state where the two side edge portions of the bonding process portion are guided to the portion of the die forming the central surface by the portion of the die forming the pair of curved surfaces. Therefore, a bonded portion having a stable shape can be formed.
In the following, a method of manufacturing a band-shaped metal wire member that includes a bonded portion; a die; and a band-shaped metal wire member that includes a bonded portion according to an embodiment are described.
First, a terminal-equipped band-shaped metal wire member 10 that is the final manufactured product is described.
The terminal-equipped band-shaped metal wire member 10 includes the band-shaped metal wire member 20, which is a conductive member, and the terminal 16.
The band-shaped metal wire member 20 is formed by processing a band-shaped metal wire member 20B (see
The band-shaped metal wire member 20B is assembled such that a plurality of metal wires 15 form an elongated band shape. The metal wires 15 may, for example, be configured exclusively by metal strands, or may be wires having a metal strand provided with a plating layer of a different metal than the strand, or the like. Examples of the metal strands may include a copper strand or a copper alloy strand. An example of the metal plating layer may be tin plating. However, the metal strand and metal plating layer are not limited to these materials. The band-shaped metal wire member 20B may be a member in which a member where the plurality of metal wires 15 are woven to form a cylinder (cylindrical braid or the like) is bent so as to be flat, or may be a member in which the plurality of metal wires 15 are initially woven to form a band shape (sheet-shaped metallic cloth, mesh, or the like).
In portions of the band-shaped metal wire member 20 other than the portion where the bonded portion 12 is formed, the plurality of metal wires 15 are assembled in a state capable of relative displacement, and have a band shape. Therefore, portions of the band-shaped metal wire member 20 other than the portion where the bonded portion 12 is formed are pliant enough to flex readily.
The bonded portion 12 is formed on the portion of the band-shaped metal wire member 20 where the terminal 16 is to be crimped, the bonded portion 12 being formed by bonding the plurality of metal wires 15 together. Bonding the plurality of metal wires 15 together may be performed by heat welding, or by ultrasonic welding.
The terminal 16 is a member formed by processing a metal plate of copper or the like by pressing, for example, and includes a crimping portion 17 and a connection portion 18.
The crimping portion 17 has a pair of crimping tabs 17b formed on two side portions of a base 17a, and is formed so as to have an overall “U” shape in cross-section. In addition, the pair of crimping tabs 17b are swage deformed inward in a state where the bonded portion 12 is arranged within the crimping portion 17, whereby the crimping portion 17 is electrically and mechanically connected to the bonded portion 12 at an end portion of the band-shaped metal wire member 20.
In addition, the connection portion 18 is a portion capable of connecting to a mating member that is a connection mate to the terminal 16. In this example, the connection portion 18 is formed in a plate-like shape provided with 18h capable of being fastened by a bolt and fixated to the mating member.
In this example, the band-shaped metal wire member 20B is a comparatively broad band-shaped member. In order to readily accommodate the end portion of such a broad band-shaped metal wire member 20B within the crimping tabs 17b, the end portion is preferably narrow. Therefore, the band-shaped metal wire member 20B is preferably folded so as to stack in a width direction thereof. In view of the above, the bonded portion 12 is formed on the band-shaped metal wire member 20B, forming the band-shaped metal wire member 20 that includes the bonded portion 12. More specifically, the band-shaped metal wire member 20B is folded at two places such that two side portions of the band-shaped metal wire member 20B are stacked on one principal surface side (see
An outer circumference of the bonded portion 12 has the following shape. Specifically, as noted above, the plurality of metal wires 15 are bonded together in a state where two side portions of the band-shaped metal wire member 20B are folded so as to stack onto a width-direction center portion of one primary surface (bottom surface in
A case can also be considered of a form, such as in a bonded portion 12D illustrated in
In other words, the bonded portions 12 and 12D can have a form where the two side edge portions of the band-shaped metal wire member 20B face each other and the two side portions of the band-shaped metal wire member 20C are deformed into an appropriate shape and meet on one principal surface side at the width-direction center portion.
A central surface 12a is formed at the width-direction center portion on one principal surface side of the outer circumferential surface of the bonded portion 12 (i.e., at the portion where the two side edge portions of the band-shaped metal wire member 20B face each other). In addition, a pair of curved surfaces 12b are formed at portions on one principal surface side of the outer circumferential surface of the bonded portion 12 and are continuous with the two side portions of the central surface 12a. The central surface 12a is formed as a flat surface, or as a surface that curves more gently than the curved surfaces 12b. In this example, the central surface 12a is formed as a flat surface. The central surface 12a is a surface that is parallel to the other principal surface side of the outer circumferential surface of the bonded portion 12 (parallel to the upper surface in
Furthermore, a pair of terminal placement surfaces 12c are each continuous with an outer side of the respective curved surface 12b of the pair of curved surfaces 12b. The pair of terminal placement surfaces 12c are formed in a shape that inclines such that as each terminal placement surface 12c advances outward on the two sides of the bonded portion 12, each terminal placement surface 12c approaches a surface on the opposite side from the central surface 12a. In other words, the pair of terminal placement surfaces 12c are formed so as to gradually grow broader from the one principal surface of the bonded portion 12 (bottom surface in
A method of manufacturing the terminal-equipped band-shaped metal wire member 10 is now described.
First, the band-shaped metal wire member 20 that includes the bonded portion 12 is produced (step (A)).
In step (A), the band-shaped metal wire member 20B is prepared, as illustrated in
Then, a die 50 (explained below) is prepared (step (a)). Step (a) of preparing the die may also be performed prior to step (b) described above.
As illustrated in
The inner surface of the depression 53 includes a central die surface 53a and a pair of curved guide die surfaces 53b. The central die surface 53a is formed at the width-direction center of the depression 53. The pair of curved guide die surfaces 53b are provided so as to be continuous with two sides of the central surface 12a.
The central die surface 53a is a die surface that forms the central surface 12a, and therefore, like the central surface 12a, the central die surface 53a is formed as a flat surface or as a surface that curves more gently than the curved guide die surfaces 53b. In this example, the central die surface 53a is formed as a flat surface. The central die surface 53a intersects orthogonally with a direction in which the top die 56 moves toward the bottom die 52. A width dimension L of the central die surface 53a (see
The pair of curved guide die surfaces 53b are die surfaces that form the pair of curved surfaces 12b, and therefore, like the pair of curved surfaces 12b, are formed in a shape that curves so as to project outward.
In this example, a pair of terminal placement surface formation die surfaces 53c are formed so as to be continuous with an outward side of the two side portions of each of the pair of curved guide die surfaces 53b. The pair of terminal placement surface formation die surfaces 53c are die surfaces that form the pair of terminal placement surfaces 12c, and are inclined so as to gradually open toward an upper opening of the depression 53. Formation of the terminal placement surfaces 12c is not strictly required.
A pair of side surfaces 53d are formed on the depression 53, rising directly above and on an outward side of the pair of terminal placement surfaces 12c. Two side surfaces of the bonded portion 12 are formed by the pair of side surfaces 53d.
The projection 57 is formed in a shape having a width-dimension projection that is capable of fitting into the depression 53. A width-direction center portion of the foremost end of the projection 57 is further recessed than the two side edge portions thereof. Curved surfaces 57f that project outward are formed on an inner side of the two side edge portions. Two corner portions on the top of the bonded portion 12 are formed in a curved shape by the curved surfaces 57f.
After preparing the die 50 described above, the bonding process portion of the band-shaped metal wire member 20B is arranged within the depression 53 (step (c), see
Then, the top die 56 is moved toward the bottom die 52 by an air cylinder, hydraulic cylinder, or other actuator; the projection 57 is inserted into the depression 53; and the bonding process portion is pressed into the depression 53 by the foremost end of the depression 57 (step (d)). The fold peak of the band-shaped metal wire member 20B is then pushed downward and the band-shaped metal wire member 20B between the fold peak and the side edge portions is deformed so as to bulge outward. Then, a mode of folding is established where, in a state where a portion of the band-shaped metal wire member 20B between the fold peak and the side edge portions is folded in two, the two side portions of the band-shaped metal wire member 20B are stacked on one principal surface side of the band-shaped metal wire member 20B (see the two-dot-dashed line in
In this state, for example, the bonding process portion of the band-shaped metal wire member 20B is partially heated through the die 50, which is heated by a heater or the like; at least a portion of the plurality of metal wires 15 (for example, the plating layer portion) melts, bonding the plurality of metal wires 15 together; and a state is achieved where a fixed shape is maintained. In this way, the bonded portion 12 is formed. The plurality of metal wires 30 may also be ultrasonically bonded together, resistance welded together, or the like between the bottom die 52 and the top die 56.
A depression 153 is formed in a bottom die 152 of the die 150, the depression 153 having a square shape in lateral cross-section. In this case, the band-shaped metal wire member 20B is folded in two, similar to the above description, and is arranged inside the depression 153. When pressed by the top die 56, the position of the two side edge portions of the band-shaped metal wire member 20B does not stably occupy any location in the width direction of a flat bottom surface 153a of the depression 153. Therefore, a portion of the processed bonded portion where the two side edge portions face each other is unstable. As illustrated in
Alternatively, with a die 250 according to a second comparative example, illustrated in
Alternatively, with a die 350 according to a third comparative example, illustrated in
In any event, in each of the comparative examples described above, the two side edge portions of the band-shaped metal wire member 20B are arranged at positions offset from the width-direction centers of the depressions 153, 253, and 353, and as a result there may be instability in the shape of the bonded portion. In particular, it is clear that the positions of the two side edge portions of the band-shaped metal wire member 20 are not uniform.
In contrast, when the die 50 is used, the positions of the two side edge portions of the band-shaped metal wire member 20 are, more reliably positioned at the width-direction center of the bonded portion 12, and the shape of the bonded portion 12 can be stabilized.
After the band-shaped metal wire member 20 that includes the bonded portion 12 is produced as described above, the terminal 16 is crimped to the bonded portion 12 (step (B)). As illustrated in
Specifically, a terminal crimping device 60 includes a bottom terminal die 62 and a top terminal die 64. A bottom die surface 63 is formed in the bottom terminal die 62, the bottom die surface 63 having a recessed shape in which the crimping portion 17 of the terminal 16 can be placed as on a stage. In addition, a top die surface 65 is formed in the top terminal die 64, the top die surface 65 capable of being inserted to the bottom die surface 63 and causing the pair of crimping tabs 17b of the crimping portion 17 placed on the bottom die surface 63 to deform inward.
Then, in a state where the crimping portion 17 of the terminal 16 is placed on the bottom die surface 63 and the bonded portion 12 of the band-shaped metal wire member 20 is arranged within the crimping portion 17, the top terminal die 64 is pressed toward the bottom terminal die 62 by an air cylinder, hydraulic cylinder, or other actuator, thereby deforming the pair of crimping tabs 17b inward and crimping the crimping portion 17 to the bonded portion 12.
When the band-shaped metal wire member 20 is arranged within the crimping portion 17, and after so arranging the band-shaped metal wire member 20, the bonded portion 12 is preferably placed in the crimping portion 17 in a fixed orientation and posture, and that state is preferably maintained.
Given this, the positioning member 70 is provided to a portion adjacent to the bottom terminal die 62 and below a portion of the band-shaped metal wire member 20 that is adjacent to the bonded portion 12.
The positioning member 70 includes a plate-shaped portion 72. The plate-shaped portion 72 stands upright in a posture that follows the extension direction of the band-shaped metal wire member 20, extending from the bonded portion 12 which is placed in the crimping portion 17.
Then, when the bonded portion 12 is accommodated within the crimping portion 17 that is placed in the bottom terminal die 62, the gap between the two side edge portions of the band-shaped metal wire member 20 is arranged facing the plate-shaped portion 72 of the positioning member 70. Accordingly, the foremost end of the plate-shaped portion 72 is inserted into the gap between the two side edge portions of the band-shaped metal wire member 20 (see
In this state, the crimping portion 17 of the terminal 16 is crimped to the bonded portion 12 between the bottom terminal die 62 and the top terminal die 64, producing the terminal-equipped band-shaped metal wire member 10.
According to the present embodiment as noted above, the inner surface of the depression 53 of the bottom die 52 includes the central die surface 53a and the pair of curved guide die surfaces 53b. Also, the bonding process portion of the band-shaped metal wire member 20B is arranged within the depression 53 such that the two side edge portions of the bonding process portion are oriented toward the interior of the depression 53, and the projection 57 is inserted into the depression 53 in this state, pressing the bonding process portion within the depression 53. The two side edge portions of the bonding process portion are then guided to the width-direction center of the base of the depression 53 by the pair of curved guide die surfaces 53b, and when the two side edge portions reach the central die surface 53a, which curves gently or is a flat surface, the two side edge portions remain in a stable state. Therefore, the band-shaped metal wire member 20B can be stably accommodated within the die. In addition, in this state, the metal wires 15 in the bonding process portion are bonded together between the projection 57 and the depression 53, and this enables formation of a bonded portion 12 having a stable shape.
In particular, when the width dimension L of the central die surface 53a is set to a width dimension no more than two times the thickness dimension D of the band-shaped metal wire member 20B, a state can be achieved where the two side edge portions of the bonding process portion are more reliably positioned at the width-direction center of the depression 53, and a bonded portion 12 having a more stabilized shape can be formed.
In addition, when the central die surface 53a is a flat surface, the two side edge portions of the bonding process portion can more stably remain in a state where the two side edge portions reach the central die surface 53a, and a bonded portion 12 having a more stabilized shape can be formed.
In addition, with the bonded portion 12 formed as described above, the gap in the two side edge portions of the band-shaped metal wire member 20 is stably formed at the width-direction center position of the band-shaped metal wire member 20. Given this, the terminal 16 is crimped to the bonded portion 12 in a state where the positioning member 70 is inserted into the gap in the two side edge portions of the band-shaped metal wire member 20 at the bonded portion 12, and this enables the format of crimping the bonded portion 12 and the terminal 16 together to be stabilized.
Modifications
In the embodiment described above, an example was given of forming the bonded portion 12 on an end portion of the band-shaped metal wire member 20. However, a bonded portion may also be formed at a portion of an extension-direction central portion of a band-shaped metal wire member, or along the entire extension direction of the band-shaped metal wire member.
The configurations described in the above embodiment and modifications can be combined as appropriate so long as they do not contradict each other.
In the above, the present invention is described in detail. However, the above description is, in all aspects, for exemplary purposes and the present invention is not limited by the description. Numerous modifications not given as examples are understood to be conceivable without departing from the scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-221810 | Nov 2015 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2016/082756 | 11/4/2016 | WO | 00 |
