The present invention relates to a method of manufacturing a chamfering wheel, a chamfering wheel, and a method of adjusting a chamfering wheel before use.
A chamfering wheel as disclosed by, for example, Jpn. Pat. Appin. KOKAI Publication No. 2006-116686 is attached to a rotary shaft part such as a spindle and rotates together with the rotary shaft part, and is thereby used to chamfer a workpiece such as glass or a silicon wafer with a grinding wheel portion on an outer peripheral surface. For example, when the workpiece is inserted into a groove of the grinding wheel portion formed in an annular shape on the outer peripheral surface of the chamfering wheel, the edge of the workpiece is chamfered into a groove shape.
A method of manufacturing a chamfering wheel includes: performing coaxial processing on: a reference surface serving as one of a pair of side surfaces of a disk; a fitting hole into which a rotary shaft part is fitted in the disk; a first surface of an annular centering groove, the first surface being provided on the reference surface and used when detecting a runout corresponding to a runout of an outer peripheral surface of the chamfering wheel when the chamfering wheel rotates to adjust a position of the disk; and a second surface of the centering groove, the second surface being provided on the reference surface, adjacent to the first surface, and used when detecting a runout of the reference surface when the chamfering wheel rotates to adjust the position of the disk, while maintaining a state of holding the disk with a machine tool to form the centering groove to be concentric with respect to a center axis of the fitting hole to secure accuracies of the first surface and the second surface; and forming an annular grinding wheel portion on an outer peripheral surface of the disk.
A chamfering wheel 10 according to an embodiment will be described with reference to
Note that it has been found that the life of the grinding wheel portion 14 of the chamfering wheel 10 depends on the geometrical accuracy of the chamfering wheel 10. Therefore, it is required to form a disk 12 serving as a base body of the chamfering wheel 10 with high accuracy.
As shown in
The disk 12 serves as a base body fixing the grinding wheel portion 14. The disk 12 is preferably made of, for example, an aluminum alloy. The disk 12 is preferably made of, among aluminum alloys, extra super duralumin (A7075 material according to JIS), which is excellent in workability and has abrasion resistance. The disk 12 may be made of various materials, not limited to an aluminum alloy, as long as the disk 12 has a rigidity required for the disk 12 of the chamfering wheel 10, can be processed into a desired condition, and has a desired dimensional stability.
The disk 12 includes a disk body 22 having the center axis C defined therein, a fitting hole 24 penetrating the center axis C of the disk body 22, and a recessed centering groove 26 formed around the center axis C.
The disk body 22 includes a boss 32 having a pair of flat surfaces 32a and 32b, an annular portion 34 having a pair of annular surfaces (recessed surfaces) 34a and 34b formed on the outer side of the boss 32, and an outer peripheral surface 36. The boss 32 forms the fitting hole 24. The flat surfaces 32a and 32b of the boss 32 protrude, for example, with respect to the pair of annular surfaces 34a and 34b, respectively. The flat surfaces 32a and 32b are formed as annular surfaces parallel to each other, and normals of the pair of flat surfaces 32a and 32b are directed in opposite directions. The one flat surface 32a is used as a reference surface serving as a reference for radial runout and side runout, which will be described later. The one annular surface 34a may be formed to be flush with the reference surface as the flat surface 32a of the boss 32. Hereinafter, for the sake of simplicity of description, the one flat surface 32a of the boss 32 and the annular surface 34a are assumed to be flush with each other, and this is referred to as one (first) side surface 38a. When the flat surface 32a and the annular surface 34a are flush with each other, the side surface 38a serves as the reference surface. That is, the reference surface may be the flat surface 32a of the boss 32 in the side surface 38a, or may be a region in which the flat surface 32a and the annular surface 34a are combined. The other annular surface 34b is used as a marking surface (hereinafter, appropriately denoted by reference sign 34b) on which, for example, indication such as a serial number or a manufacturer (not shown) is marked. The other annular surface 34b may be formed to be flush with the flat surface 32b of the boss 32. Hereinafter, the other flat surface 32b of the boss 32 and the annular surface 34b are assumed to be flush with each other, and this is referred to as the other (second) side surface 38b, and this is also referred to as a marking surface (provisional reference surface). In this case, the fitting hole 24 appears to penetrate the pair of side surfaces 38a and 38b.
The fitting hole 24 is perpendicular to the reference surface 38a (flat surface 32a) and formed as an annular surface (inner peripheral surface) in which the normal at each position is directed toward the center axis C. The rotary shaft part 80 or 90 such as a spindle or an arbor is fitted into the fitting hole 24.
The centering groove 26 is formed in the side surface 38a (annular surface 34a) on the inner side of the outer peripheral surface 36 of the disk body 22. The centering groove 26 includes a first surface 52, a second surface 54, and a third surface 56, each of which is annular and concentric with the center axis C. The first surface 52 and the second surface 54 are continuous (adjacent). The second surface 54 and the third surface 56 are continuous (adjacent).
The first surface 52 is orthogonal to the reference surface 38a (flat surface 32a), parallel to the fitting hole 24, and formed in an annular shape. The normal of the first surface 52 is directed toward the center axis C of the disk 12. The first surface 52 is used to detect runout corresponding to runout of the outer-side outer peripheral surface 42a or the inner-side outer peripheral surface 44 of the disk 12, or the outer peripheral surface 66 of the chamfering wheel 10 when the chamfering wheel 10 rotates. The second surface 54 is parallel to the reference surface 38a (flat surface 32a), orthogonal to the fitting hole 24, and formed in an annular shape. The second surface 54 is used to detect runout of the reference surface 38a when the chamfering wheel 10 rotates. The third surface 56 is formed in an annular shape, but is neither parallel nor perpendicular to the reference surface 38a (flat surface 32a) in the present embodiment. In the present embodiment, the third surface 56 has a linear cross section but may have a curved cross section.
The grinding wheel portion 14 is formed as an annular sintered body containing diamond powder, for example. The grinding wheel portion 14 has a pair of end surfaces 62a and 62b, an inner peripheral surface 64, and an outer peripheral surface 66. The one end surface 62a is brought into contact with the flange portion 42. The normal of the other end surface 62b is directed in the same normal direction as the marking surface 34b, for example. A plurality of annular chamfering grooves 68 are formed on the outer peripheral surface 66 of the grinding wheel portion 14. In the present embodiment, nine chamfering grooves 68 are formed along the axial direction of the center axis C at a predetermined pitch in the thickness direction of the chamfering wheel 10. The chamfering grooves 68 may not be made to have the same shape or grain size by appropriately providing a finishing process, depending on a shape or roughness of a chamfered surface of a workpiece.
Next, a method of manufacturing the chamfering wheel 10 will be described with reference to
As shown in
As shown in
As shown in
As shown in
Furthermore, the fitting hole 24 through which the rotary shaft part 80 or 90 passes is formed with the tool T6 attached to the machine tool so as to be coaxial with the reference surface 38a while maintaining a state of holding the outer peripheral surface 36 of the disk 12 from the marking surface 38b side. Furthermore, the annular centering groove 26 is formed in the reference surface 38a with the machine tool T7 attached to the machine tool so as to be coaxial with the reference surface 38a while maintaining a state of holding the outer peripheral surface 36 of the disk 12 from the marking surface 38b side.
That is, here, the reference surface 38a, the fitting hole 24, and the centering groove 26 are formed so as to be coaxial, with the tools T5, T6 and T7 attached to the given machine tool, in a state such that the outer peripheral surface 36 of the disk 12 is held from the marking surface 38b side as the other side of the pair of side surfaces 38a and 38b, and in a state such that the center axis C of the disk 12 is shared (process 4). By performing coaxial processing on the disk 12 while maintaining a state of holding the disk 12 by the same machine tool, the inner peripheral surface of the fitting hole 24 is formed in a state of being orthogonal to the reference surface 38a. Through this processing, the center axis C of the disk 12 is defined.
The fitting hole 24 and the centering groove 26 are preferably formed through simultaneous processing in which they are simultaneously processed with the plurality of tools T6 and T7. The fitting hole 24 and the centering groove 26 may not be formed simultaneously but formed in a random order.
The first surface 52, the second surface 54, and the third surface 56 of the centering groove 26 shown in
For example, it is preferable to process the disk 12 by using the same machine tool from process 2 shown in
The holding state of the given machine tool is changed from the state where the outer peripheral surface 36 of the disk 12 is held from the marking surface 38b side to a state where the outer peripheral surface 36 of the disk 12 is held from the reference surface 38a side. That is, the outer side of the position that will become an outer-side outer peripheral surface 42a of the outer peripheral surface 36 of the disk 12 is held from the reference surface 38a side by the machine tool. Then, as shown in
As shown in
After the grinding wheel portion 14 is fixed to the inner-side outer peripheral surface 44 of the disk 12, as shown in
As shown in
In the centering operation, as shown in
When detecting radial runout and side runout of the chamfering wheel 10, the chamfering wheel 10 may be fixed and the distance detection sensors S1 and S2 may be moved in an annular manner. Therefore, when detecting the radial runout and the side runout of the chamfering wheel 10, it is preferable to move the distance detection sensor S1 relative to the first surface 52 of the centering groove 26 in the circumferential direction to adjust the position of the chamfering wheel 10 based on the runout (radial runout) of the chamfering wheel 10 with respect to the rotary shaft part 80, and to move the distance detection sensor S1 or another distance detection sensor S2 relative to the second surface 54 of the centering groove 26 in the circumferential direction to adjust the position of the chamfering wheel 10 based on the runout (side runout) of the reference surface 38a of the chamfering wheel 10 with respect to the rotary shaft part 80.
As shown in
As shown in
As shown in
As shown in
Lastly, the chamfering wheel 10 is removed from the rotary shaft part 80, and shipment inspection is performed. Here, the process shape inspection and the dimension inspection of the chamfering grooves (product grooves) 68 and the dimension inspection of the entire chamfering wheel 10 are performed.
In the above-described manner, the chamfering wheel 10 is manufactured and shipped to the user.
Hereinafter, a method of adjusting the chamfering wheel 10 shipped from a manufacturer before use, performed by the user, for example, will be described with reference to
For example, a user of the chamfering wheel 10 who wishes to chamfer the edge of the plate-like body fits a predetermined rotary shaft part 90 into the fitting hole 24 of the chamfering wheel 10. Then, the user performs centering operation between the rotary shaft part 90 and the chamfering wheel 10. The centering operation is performed using the distance detection sensors S1 and S2. While the dial gauges S1 and S2 are used as the distance detection sensors in the above example, optical sensors that can detect distances in a non-contact manner for the first surface 52 and the second surface 54 of the centering groove 26 may be used.
As shown in
Even in this case, after the adjustment of the attachment state of the chamfering wheel 10 to the rotary shaft part 90, before using the chamfering wheel 10, the user detects the runout of the first surface 52 and the runout of the second surface 54 again, and checks whether or not there is a problem in the attachment state. Alternatively, without moving the chamfering wheel 10 slightly with respect to the rotary shaft part 90, the user detaches the chamfering wheel 10 from the rotary shaft part 90 and attaches the chamfering wheel 10 to the rotary shaft part 90 again, detects the runout of the first surface 52 and the runout of the second surface 54 again, and checks whether or not there is a problem in the attachment state again. If detection results of the runout of the first surface 52 and the runout of the second surface 54 are within the above-described threshold range, for example, the chamfering wheel 10 is used as it is, and if the detection results of the runout of the first surface 52 and the runout of the second surface 54 are outside the above-described threshold range, the attachment state of the rotary shaft part 90 and the chamfering wheel 10 is adjusted again.
The adjustment to be performed as necessary can be appropriately performed by a so-called person skilled in the art such as a user of the chamfering wheel 10. For example, when chamfering the edge of various plate-like members, the chamfering wheel 10 needs to exhibit a desired performance. As one of the determination criteria for adjusting the attachment state of the chamfering wheel 10 with respect to the rotary shaft part 90, the user can use, for example, the degree of dimensional accuracy required for chamfering a workpiece such as a glass or a silicon wafer to be chamfered and whether or not the dimensional accuracy is secured in the current attachment state. Therefore, for example, when the user of the chamfering wheel 10 sets a certain threshold for each of the runout of the first surface 52 and the runout of the second surface 54 and the runout is within a range of the certain threshold, adjustment of the attachment state of the chamfering wheel 10 with respect to the rotary shaft part 90 is not required. On the other hand, if the runout of the first surface 52 and the runout of the second surface 54 are outside the range of the certain threshold, adjustment of the attachment state of the chamfering wheel 90 with respect to the rotary shaft part 90 is required.
Such adjustment of the attachment state is performed not only when the chamfering wheel 10 is attached to the rotary shaft part 90 but also when the chamfering wheel 10 is attached to the rotary shaft part 80.
In this manner, the centering operation for adjusting the attachment state of the rotating shaft part 90 and the chamfering wheel 10 secures the coaxiality of the center axis C between the rotary shaft part 90 and the chamfering wheel 10, the perpendicularity of the center axis of the rotary shaft part 90 with respect to the reference surface 38a of the chamfering wheel 10, and the perpendicularity of the inner peripheral surface of the fitting hole 24 with respect to the outer peripheral surface of the rotary shaft part 90.
By using the chamfering wheel 10 adjusted in this manner, the user chamfers an edge of each plate-like body. When the plate-like body is, for example, a wafer, chamfering can be performed on an edge of an orientation flat by relatively moving the chamfering wheel 10 and the wafer. Furthermore, chamfering can be performed on an edge of a wafer having a notch.
The grinding wheel portion 14 is maintained, for example, after being used an appropriate number of times, or after a predetermined period of time has elapsed. At the time of maintenance, the chamfering wheel 10 is returned from the shipping destination to, for example, the manufacturer of the chamfering wheel 10.
As an example, the grinding wheel portion 14 is removed from the disk 12, and a new grinding wheel portion 14 is bonded and fixed to the inner-side outer peripheral surface 44 of the disk 12. Thereafter, processes 7 to 12 are performed in order, and the chamfering wheel 10 is shipped again to the same user, for example. In this manner, the disk 12 of the chamfering wheel 10 is reusable. The shape of the chamfering grooves 68 may be changed from that before maintenance based on an instruction from a customer during maintenance.
The reference surface 38a (flat surface 32a), the fitting hole 24, and the centering groove 26 of the disk body 22 of the chamfering wheel 10 manufactured according to the present embodiment are formed to be coaxial in a state of holding the disk body 22 by a given machine tool. When the reference surface 38a (flat surface 32a), the fitting hole 24, and the centering groove 26 are formed, the holding state of the outer peripheral surface 36 of the disk body 22 is not changed even once. Therefore, the inner peripheral surface of the fitting hole 24 and the first surface 52 and the second surface 54 of the centering groove 26 can achieve a desired coaxiality and roundness depending on a machine tool.
When the chamfering wheel 10 is rotated, the outer peripheral surface 66 of the grinding wheel portion 14 does not become a perfect circle due to projection of the abrasive grains. Therefore, even when the outer peripheral surface 66 of the grinding wheel portion 14 is measured by a dial gauge or the like, the measurement is easily affected by variation in measurement. In the present embodiment, the first surface 52 of the centering groove 26 is used to measure the radial runout. At this time, since the first surface 52 is formed so as to secure the coaxiality with the inner peripheral surface of the fitting hole 24, the measurement accuracy of the radial runout can be much higher than in the case where the outer peripheral surface 66 of the grinding wheel portion 14 is measured. Therefore, according to the present embodiment, with the centering groove 26 having the first surface 52 orthogonal to the reference surface 38a (flat surface 32a) and the second surface 54 parallel to the reference surface 38a (flat surface 32a), the centering operation can be performed with a much higher accuracy than in the case where the centering groove 26 is not provided.
When the chamfering wheel 10 is rotated, the end surface 62b of the outer peripheral surface 66 of the grinding wheel portion 14 is not flat due to projection of the abrasive grains. Therefore, even when the side runout (flatness) of the end surface 62b of the outer peripheral surface 66 of the grinding wheel portion 14 is measured by a dial gauge or the like, the measurement is easily affected by variation in measurement. In the present embodiment, the second surface 54 of the centering groove 26 is used to measure the side runout. At this time, since the second surface 54 of the centering groove 26 is formed so as to secure the perpendicularity with the inner peripheral surface of the fitting hole 24, the measurement accuracy of the side runout can be much higher than in the case where the end surface 62b portion of the outer peripheral surface 66 of the grinding wheel portion 14 is measured. Therefore, according to the present embodiment, with the centering groove 26 having the first surface 52 orthogonal to the reference surface 38a (flat surface 32a) and the second surface 54 parallel to the reference surface 38a (flat surface 32a), the centering operation can be performed with a much higher accuracy than in the case where the centering groove 26 is not provided.
In the present embodiment, as shown in
In the chamfering wheel 10 of the present embodiment, as shown in
By performing a centering operation before forming the chamfering grooves 68 of the chamfering wheel 10, a desired coaxiality and roundness are obtained between the rotary shaft part 80 and the disk 12 of the chamfering wheel 10 and between the electric discharge machining electrode 76 and the chamfering grooves 68 of the chamfering wheel 10. Therefore, the electric discharge machining electrode 76 is brought into good contact with the chamfering grooves 68 of the chamfering wheel 10, and as a result, the life of the chamfering wheel 10 can be extended, and chipping of the chamfering grooves 68 can be suppressed.
In the chamfering wheel 10 of the present embodiment, as shown in
When the centering groove 26 is formed by using the method of manufacturing the chamfering wheel 10 according to the present embodiment, there is no need to introduce a machine tool capable of performing machining with a higher accuracy. Therefore, it is possible to provide a chamfering wheel 10 whose life can be extended while suppressing the manufacturing cost.
In the present embodiment, the first surface 52, the second surface 54, and the third surface 56 are arranged in this order from a position distal to the center axis C of the disk 12 toward a position proximal to the center axis C of the disk 12, but the order may be reversed. In the present embodiment, the example in which the normal of the first surface 52 is directed toward the center axis C, that is, directed radially inward with respect to the center axis C has been described. For example, the normal of the third surface 56 may be formed so as to be directed outward in the radial direction with respect to the center axis C. In this case, the third surface 56 may be used as a radial runout measurement surface. When the third surface 56 is used as the radial runout measurement surface, the first surface 52 may be formed as a surface that is neither parallel nor perpendicular to the flat surface 32a serving as the reference surface.
According to the present embodiment, it is possible to provide a method of manufacturing a chamfering wheel 10 formed with higher accuracy, a chamfering wheel 10, and a method of adjusting the chamfering wheel 10 before use.
The present invention is not limited to the above-described embodiments, and can be modified in various manners in practice, without departing from the gist of the invention. Moreover, the embodiments can be suitably combined; in such case, combined advantages are obtained. Furthermore, the above-described embodiments include various inventions, and various inventions can be extracted by a combination selected from structural elements disclosed herein. For example, if the problem can be solved and the effects can be attained even after some of the structural elements are deleted from all the structural elements disclosed in the embodiment, the structure made up of the resultant structural elements may be extracted as an invention.
Number | Date | Country | Kind |
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2021-153110 | Sep 2021 | JP | national |
This application is a Continuation Application of PCT Application No. PCT/JP2022/010352, filed Mar. 9, 2022 and based upon and claiming the benefit of priority from Japanese Patent Application No. 2021-153110, filed Sep. 21, 2021, the entire contents of all of which are incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP2022/010352 | Mar 2022 | WO |
Child | 18609180 | US |