Claims
- 1. A method of manufacturing an electrode substrate having a metal electrode layer comprising the steps of:forming a metal electrode layer on a first substrate; bonding said first substrate to a second substrate to form a combined body having a layered structure on said first substrate, said layered structure comprising said metal electrode layer, a low thermal expansion layer having a thermal expansion coefficient lower than said metal electrode layer, and a high thermal conduction layer having a thermal conductivity higher than said low thermal expansion layer; and peeling said first substrate off said metal electrode layer.
- 2. A method according to claim 1, whereinsaid metal electrode layer is made of one or more than one noble metals.
- 3. A method according to claim 2, whereinsaid metal electrode layer is made of a material selected from Au, Pt, Pd, Ir, Rh and Ru and alloys of any of them.
- 4. A method according to claim 1, wherein said low thermal expansion layer is made of a material selected from W, Ta, Mo, Cr, Ti and Zr and alloys of any of them as well as their compounds.
- 5. A method according to claim 1, wherein said high thermal conduction layer is made of a material selected from Au, Ag, Cu and Al and alloys of any of them.
- 6. A method according to claim 1, wherein said adherent layer of metal is made of a laminate film having two or more than two layers of noble metal and base metal.
- 7. A method according to claim 1, wherein said bonding step comprises pressurizing said combined body and conducting heat treatment.
- 8. A method of manufacturing an electrode substrate having a metal electrode layer, characterized by comprising steps of:forming a metal electrode layer on a first substrate; bonding said first substrate and a second substrate to form a combined body having a layered structure on said first substrate, said layered structure comprising said metal electrode layer, a first layer comprising at least one selected form W, Ta, Mo, Cr, Ti and Zr and alloys of any of them as well as their compounds, and a second layer comprising at least one selected from Au, Ag, Cu and Al and alloys of any of them; and peeling said first substrate off said metal electrode layer.
Priority Claims (3)
Number |
Date |
Country |
Kind |
9-155841 |
May 1997 |
JP |
|
9-161844 |
Jun 1997 |
JP |
|
9-176316 |
Jun 1997 |
JP |
|
Parent Case Info
This application is a division of application Ser. No. 09/086,459, filed May 29, 1998, now U.S. Pat. No. 6,168,873.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
5358795 |
Nakamura et al. |
Oct 1994 |
A |
5432379 |
Eguchi et al. |
Jul 1995 |
A |
5626943 |
Tenhover |
May 1997 |
A |
6308405 |
Takamatsu et al. |
Oct 2001 |
B1 |
Foreign Referenced Citations (1)
Number |
Date |
Country |
63-161552 |
Jul 1988 |
JP |
Non-Patent Literature Citations (1)
Entry |
G. Binning, et al.; “Surface Studies by Scanning Tunneling Microscopy”, Phys. Rev. Ltrs., vol. 49, No. 1, pp. 57-61, Jul. 1982. |