Patent Application
20050128267
The present invention relates to an electronic device manufacturing method and a manufacturing apparatus therefor and, more particularly, to a manufacturing method for an electronic device by the step of applying, to a substrate, droplets of a liquid containing the formation material of a member which constitutes the electronic device, and a manufacturing apparatus therefor.
As a method of easily manufacturing a surface-conduction type electron-emitting element at low cost, there is conventionally proposed a method like the one disclosed in Japanese Laid-Open Patent Application No. 8-171850 in which droplets of a metal-containing solution are discharged onto a substrate using a droplet discharge unit to form element electrodes and a conductive film between them, thereby manufacturing an element, as shown in
An electron source substrate having electron-emitting elements arrayed in a matrix, and an image forming apparatus are formed on an insulating substrate.
As another example of manufacturing an electronic device other than the electron-emitting element and electron source by using an ink-jet method, Japanese Laid-Open Patent Application No. 8-327816 discloses a color filter manufacturing method using the ink-jet method.
However, forming the building component of the electronic device using the ink-jet method suffers the following problems. That is, discharge of a solution is inhibited by a gas dissolved in the solution when the solution containing a material for forming the building component of the electronic device contacts air, and by bubbles and the like mixed in injecting the solution into the droplet discharge unit. As a result, the droplet discharge amount may vary. The droplet discharge direction may be influenced by this state, and the landing position when a droplet lands on the insulating substrate may offset from a design value.
In addition, the temperature of the solution changes depending on the ambient temperature of the unit to change physical properties such as the viscosity of the solution. The droplet discharge amount may vary. The droplet discharge direction may be influenced by this state, and the landing position when a droplet lands on the insulating substrate may offset from a design value.
Hence, the yield in manufacturing an electronic device is difficult to increase, and the production cost increases. In the electron source, the uniformity of the conductive thin film of an electron-emitting element is impaired to decrease the yield of an electron source substrate.
It is, therefore, an object of the present invention to provide an electronic device manufacturing method and manufacturing apparatus which can discharge a solution to an accurate position on a substrate, and are excellent in reproducibility of the characteristics of a manufactured electronic device.
It is another object of the present invention to provide a manufacturing method and manufacturing apparatus which can discharge a solution to an accurate position on a substrate, for an electron source having a plurality of electron-emitting portions with uniform electron emission characteristics.
It is still another object of the present invention to provide a manufacturing method for a high-quality image forming apparatus having uniform emission luminance.
According to one aspect of the present invention, an electronic device manufacturing apparatus is characterized by comprising gas removal means for removing a gas dissolved in a liquid containing a formation material of a member constituting an electronic device, droplet discharge means for discharging droplets of the liquid, and means for controlling relative positions of the droplet discharge means and a substrate on which the electronic device is formed, wherein the droplets are applied to a predetermined position on the substrate.
In this invention, the gas removal means comprises a closed vessel filled with a membrane formed from a semi-transmitting film capable of transmitting a gas, and a vacuum unit for evacuating the closed vessel.
In this invention, the gas removal means comprises means for adjusting a flow rate of the liquid in the membrane.
In this invention, the gas removal means comprises means for detecting an amount of gas contained in the liquid.
In this invention, the gas removal means comprises a vacuum unit, and exposes a solution containing the liquid to vacuum.
In this invention, the vacuum unit has a variable exhaust speed.
In this invention, the gas removal means comprises means for detecting a vacuum degree of the vacuum unit.
In this invention, the droplet discharge means generates a bubble in the liquid using thermal energy, and discharges the liquid on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the liquid using kinematic energy.
According to another aspect of the present invention, an electronic device manufacturing apparatus comprises means for adjusting a temperature of a liquid containing a formation material of a member constituting the electronic device, droplet discharge means for discharging droplets of the liquid, and means for controlling relative positions of the droplet discharge means and a substrate on which the electronic device is formed, wherein the droplets are applied to a predetermined position on the substrate.
In this invention, the droplet discharge means generates a bubble in the liquid using thermal energy, and discharges the liquid on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the liquid using kinematic energy.
In this invention, the electronic device includes an electron source having a plurality of electron-emitting elements.
In this invention, each electron-emitting element includes an electron-emitting element having a pair of conductors arranged at a gap.
In this invention, the droplet discharge means includes means for discharging droplets of the liquid containing a formation material of the conductors.
In this invention, the electron source includes an electron source having a plurality of electron-emitting element arrays each formed by connecting a plurality of electron-emitting elements between a pair of wiring lines.
In this invention, the electron source includes an electron source constituted by connecting a plurality of electron-emitting elements in a matrix by a plurality of row-direction wiring lines and a plurality of column-direction wiring lines.
According to still another aspect of the present invention, an electron source substrate manufacturing apparatus for manufacturing an electron source substrate having a plurality of pairs of element electrodes formed on a substrate, conductive films each having an electron-emitting portion formed between each pair of element electrodes, and a voltage application terminal to each element electrode, is characterized by comprising gas removal means for removing a gas dissolved in a solution containing a metal element, droplet discharge means for discharging droplets of the solution containing the metal element, and means for controlling relative positions of the droplet discharge means and the substrate, wherein the droplets are applied to a predetermined position on the substrate.
In this invention, the gas removal means comprises a closed vessel filled with a membrane formed from a semi-transmitting film capable of transmitting a gas, and a vacuum unit for evacuating the closed vessel.
In this invention, the gas removal means comprises means for adjusting a flow rate of a metal solution in the membrane.
In this invention, the gas removal means comprises means for detecting an amount of gas contained in the solution.
In this invention, the gas removal means comprises a vacuum unit, and exposes a solution containing a metal solution to vacuum.
In this invention, the vacuum unit has a variable exhaust speed.
In this invention, the gas removal means comprises means for detecting a vacuum degree of the vacuum unit.
According to still another aspect of the present invention, an electron source substrate manufacturing apparatus for manufacturing an electron source substrate having a plurality of pairs of element electrodes formed on a substrate, conductive films each having an electron-emitting portion between each pair of element electrodes, and a voltage application terminal to each element electrode, is characterized by comprising means for adjusting a temperature of a solution containing a metal element, droplet discharge means for discharging droplets of the solution containing the metal element, and means for controlling relative positions of the droplet discharge means and the substrate, wherein the droplets are applied to a predetermined position on the substrate.
In this invention, the droplet discharge means generates a bubble in the solution using thermal energy, and discharges the solution on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the solution using kinematic energy.
In this invention, the solution containing the metal element contains a formation material of the conductive film in which the electron-emitting portion is formed.
According to still another aspect of the present invention, an electronic device manufacturing method is characterized by comprising the gas removal step of removing a gas dissolved in a liquid containing a formation material of a member constituting an electronic device, and the droplet discharge step of discharging droplets by droplet discharge means while controlling relative positions of the droplet discharge means for discharging droplets of the liquid and a substrate on which the electronic device is formed, thereby applying the droplets to a predetermined position on the substrate.
In this invention, the gas removal step comprises controlling a concentration of the gas dissolved in the liquid so as to be kept at a default value.
In this invention, the droplet discharge means generates a bubble in the liquid using thermal energy, and discharges a solution on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the liquid using kinematic energy.
According to still another aspect of the present invention, an electronic device manufacturing method is characterized by comprising the temperature adjusting step of adjusting a temperature of a liquid containing a formation material of a member constituting an electronic device, and the droplet discharge step of discharging droplets by droplet discharge means while controlling relative positions of the droplet discharge means for discharging droplets of the liquid and a substrate on which the electronic device is formed, thereby applying the droplets to a predetermined position on the substrate.
In this invention, the droplet discharge means generates a bubble in the liquid using thermal energy, and discharges the liquid on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the liquid using kinematic energy.
In this invention, the electronic device includes an electron source having a plurality of electron-emitting elements.
In this invention, each electron-emitting element includes an electron-emitting element having a pair of conductors arranged at a gap.
In this invention, the liquid includes a liquid containing a formation material of the conductors.
In this invention, the electron source includes an electron source having a plurality of electron-emitting element arrays each formed by connecting a plurality of electron-emitting elements between a pair of wiring lines.
In this invention, the electron source includes an electron source constituted by connecting a plurality of electron-emitting elements in a matrix by a plurality of row-direction wiring lines and a plurality of column-direction wiring lines.
According to still another aspect of the present invention, an electron source substrate manufacturing method of manufacturing an electron source substrate having a plurality of pairs of element electrodes formed on a substrate, conductive films each having an electron-emitting portion formed between each pair of element electrodes, and a voltage application terminal to each element electrode, is characterized by comprising the gas removal step of removing a gas dissolved in a solution containing a metal element, and the droplet discharge step of discharging droplets by droplet discharge means while controlling relative positions of the substrate and the droplet discharge means for discharging droplets of the solution, thereby applying the droplets to a predetermined position on the substrate.
In this invention, the gas removal step comprises controlling a concentration of the gas dissolved in the solution so as to be kept at a default value.
In this invention, the droplet discharge means generates a bubble in the solution using thermal energy, and discharges the solution on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the solution using kinematic energy.
According to still another aspect of the present invention, an electron source substrate manufacturing method of manufacturing an electron source substrate having a plurality of pairs of element electrodes formed on a substrate, conductive films each having an electron-emitting portion formed between each pair of element electrodes, and a voltage application terminal to each element electrode, is characterized by comprising the temperature adjusting step of adjusting a temperature of a solution containing a metal element, and the droplet discharge step of discharging droplets by droplet discharge means while controlling relative positions of the substrate and the droplet discharge means for discharging droplets of the solution, thereby applying the droplets to a predetermined position on the substrate.
In this invention, the droplet discharge means generates a bubble in the solution using thermal energy, and discharges the solution on the basis of generation of the bubble.
In this invention, the droplet discharge means discharges the solution using kinematic energy.
In this invention, the solution containing the metal element contains a formation material of the conductive film in which the electron-emitting portion is formed.
According to still another aspect of the present invention, an image forming apparatus manufacturing method of manufacturing an image forming apparatus having an electron source substrate and a light-emitting member which emits light upon irradiation of electrons from the electron source substrate, is characterized in that the electron source substrate is manufactured by the electron source substrate manufacturing method described above.
In this case, the electronic device in the present invention includes a color filter for a liquid crystal display, a driving circuit for various displays such as a liquid crystal display, plasma display, and electron beam display, and an electron source substrate itself. The building member of the electronic device formed by the manufacturing method and manufacturing apparatus of the present invention includes a filter element particularly in the color filter, a conductor patterned on a circuit board or an insulator for insulating conductors in the driving circuit for various displays, and building members of a plurality of electron-emitting elements or conductors for connecting the electron-emitting elements to driving wiring lines in the electron source substrate.
By these apparatus and method, the present invention can discharge a solution to an accurate position on a substrate, and can manufacture an electronic device excellent in reproducibility of characteristics.
By these apparatus and method, the present invention can discharge a solution to an accurate position on a substrate, and can manufacture an electron source having a plurality of electron-emitting portions with uniform electron emission characteristics.
By these apparatus and method, the present invention can effectively prevent any color misregistration of the filter element in the color filter, and can prevent any unwanted short-circuiting between driving conductors in the driving circuit for various displays.
By these apparatus and method, the present invention can also realize a small number of steps, high yield, and low cost.
FIGS. 9(a) and 9(b) are a plan view and a sectional view, respectively, for explaining an example of an electron-emitting element according to the present invention;
FIGS. 10(a) and 10(b) are a plan view and a sectional view, respectively, for explaining another example of the electron-emitting element according to the present invention; and
FIGS. 11(a) and 11(b) are a plan view and a sectional view, respectively, showing a conventional electron-emitting element.
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
As another arrangement, as shown in FIGS. 10(a) and 10(b), films 4a of carbon or a carbon compound may be formed in the gap 5 and on the conductive films 4. The films of carbon or a carbon compound form a gap 5a narrower than the gap 5 to further increase the service life and electron emission efficiency.
This surface-conduction type electron-emitting element emits electrons from the conductive films 4 near the gap 5 or 5a by applying a voltage between the element electrodes 2 and 3.
As an embodiment of the present invention, a method of forming the conductive film 4 of the surface-conduction type electron-emitting element will be described.
The droplet discharge unit 8 is not limited to a particular unit as far as it can form an arbitrary droplet. The unit 8 can be an ink-jet type unit. The materials of the droplet 9 and solution 107 are not limited to a particular state as far as they can form droplets. The materials can be a solution, organic metal solution, or the like prepared by dispersing/dissolving a metal or the like serving as the component of the conductive thin film in water, a solvent, or the like.
This solution 107 is applied as the droplets 9 to desired positions on the element electrodes 2 and 3 by the droplet discharge unit 6. When the solution 107 contacts outside air, a gas may be dissolved in the solution to increase the dissolved gas amount in the solution 107, or the gas may form bubbles 109, as shown in
If the bubbles 109 exist in the solution 107, the solution may not be sufficiently filled depending on the bubble size, and may be injected into the droplet discharge unit 6, failing to discharge the droplets 9. If the temperature of the solution changes depending on the temperature of outside air or the like, the physical properties (concentration, viscosity, and the like) of the solution 107 change to make the discharge amount of the droplet 9 nonuniform.
For this reason, droplets cannot be applied to designed positions, and the yield decreases. To prevent this, the present invention adopts the apparatus shown in
The solution 107 containing a gas is introduced into the unit 103 for removing a dissolved gas. The chamber 105 in the unit 103 selectively transmits the gas to the outside in accordance with the molecular size. In this case, the chamber 105 is formed from a semi-transmitting film. The exhaust speed of the vacuum pump 106 can be controlled by an external signal. The dissolved gas analyzer 104 measures the concentration of the gas dissolved in the solution 107 which has passed through the chamber 105, and can output the concentration.
The solution introduced into the unit 103 is supplied to the chamber 105. The chamber 105 is evacuated by the vacuum pump 106 to selectively exhaust and remove the gas dissolved in the solution 107 through the vacuum pump 106. The gas-removed solution is introduced into the dissolved gas analyzer 104 where the concentration of the gas in the solution is measured. Based on the measurement value, the exhaust speed of the vacuum pump 106 is adjusted to control the concentration of the gas dissolved in the solution 107 to a sufficiently small value.
After these steps, the solution 107 having passed through the dissolved-gas removing unit is controlled to a desired temperature by the temperature adjusting unit 102. As shown in
After these steps, the metal solution 107 kept at the temperature of the default value is introduced into the droplet discharge unit 8. The droplet discharge unit 8 discharges the droplets 9 in synchronism with scanning of the stage 15, and applies them to desired positions on the MTX substrate 101.
Then, the droplet-applied MTX substrate 101 is calcinated at 300° C. to 400° C. to form the conductive films 4.
A step, called the electrification forming step, of applying a voltage between the element electrodes 2 and 3 from a power supply (not shown) is performed to form a fissure (gap 5) in part of the conductive films 4, thereby forming electron-emitting portions in the conductive films 4. Processing called the activation step is performed for an element having undergone the electrification forming step to deposit the films 4a of carbon or a carbon compound on the conductive films (see
A method of manufacturing an image forming apparatus according to the present invention will be described below.
An electron source substrate used for the image forming apparatus is formed by arraying a plurality of surface-conduction type electron-emitting elements on a substrate.
As shown in
In
The wiring line is formed from a conductive metal or the like by vacuum evaporation, printing, sputtering, or the like. The m X-direction wiring lines 72 and n Y-direction wiring lines 73 are electrically isolated by interlevel insulating films (not shown), and constitute matrix wiring (m and n are positive integers). The interlevel insulating film (not shown) is formed from SiO2 or the like by vacuum evaporation, printing, sputtering, or the like. The X-direction wiring lines 72 and Y-direction wiring lines 73 are extracted as external terminals. The surface-conduction type electron-emitting elements 74 are electrically connected to each other by the m X-direction wiring lines 72, n Y-direction wiring lines 73, and connection lines 75.
In this arrangement, individual elements can be selected and independently driven only by simple matrix wiring.
The image forming apparatus using the manufactured electron source having the simple matrix layout will be explained with reference to
The glass substrate 93 is comprised of the face plate 96, support frame 92, and rear plate 91, as described above. Further, an atmospheric pressure resistant support member called a spacer is interposed between the face plate 96 and the rear plate 91 to obtain the envelope 98 highly resistant to the atmospheric pressure.
The envelope 98 is sealed after being evacuated through an exhaust pipe (not shown). To maintain the vacuum degree after the envelope 98 is sealed, getter processing is done. In the image forming apparatus manufactured in this way, voltages are applied to respective surface-conduction type electron-emitting elements via the external terminals D0x1 to D0xm and D0y1 to D0yn of the vessel to emit electrons. A high voltage is applied to the face plate via a high-voltage terminal Hv to accelerate the electron beam. The electron beam is collided against the fluorescent film 94 to excite the fluorescent film 94. The fluorescent film 94 emits light to display an image.
The arrangement of this apparatus, and an electron source substrate manufacturing method using this apparatus will be explained. In
A droplet discharge unit 8 for applying droplets is located above the MTX substrate 101. In the first embodiment, the droplet discharge unit 8 is fixed to the apparatus on the XY plane. The MTX substrate 101 is moved to an arbitrary position by the XY-direction scanning mechanism 15 to realize relative movement of the droplet discharge unit 8 and MTX substrate 101.
The system for supplying a metal solution to the droplet discharge unit will be explained with reference to
FIGS. 3(a) and 3(b) show details of the dissolved gas analyzer 104, and the unit 103 for removing a dissolved gas, and
Driving of the droplet discharge unit 6 is controlled by an ink-jet head control/driving unit 18 so as to discharge droplets from the droplet discharge unit 6 at an arbitrary timing. The ink-jet head control/driving unit is controlled by a control computer 19. As the droplet discharge unit 6, an ink-jet type unit can be adopted. This embodiment adopts a bubble-jet type unit.
A method of operating the electron source substrate manufacturing apparatus in the first embodiment will be explained with reference to FIGS. 1 to 3. As described above, the metal solution 107 is introduced into the droplet discharge unit 6, and applied as a droplet 9 to a predetermined position on the MTX substrate 101. The metal solution 107 contains a dissolved gas with an irregular concentration that dissolves from contact air, and bubbles 109 generated by shock or the like. If the metal solution is introduced into the droplet discharge unit 6 in this state, in discharging the droplet 9,
At the same time, the discharge direction also changes nonuniformly to impair the uniformity of the manufactured electron source substrate. Furthermore, the temperature of the solution changes depending on the temperature of outside air or the like, and the physical properties (concentration, viscosity, and the like) of the solution 107 change to make the discharge amount of the droplet 9 nonuniform.
This phenomenon occurs not only when the droplet discharge unit 6 is a bubble-jet type unit as in the first embodiment, but also when the droplet discharge unit 6 is a piezo-jet type unit. The uniformity of the electron source substrate 71 is difficult to maintain, which decreases the yield.
The apparatus of the first embodiment solves this problem by the following procedures, which will be explained with reference to FIGS. 1 to 3.
1. The metal solution 107 is introduced from the solution tank 108 to the chamber 105. At this time, the metal solution 107 contains a gas and the bubbles 109 at an irregular concentration that are generated when the metal solution 107 contacts outside air or shock is applied to the metal solution 107 in the manufacture or safekeeping.
2. The metal solution 107 introduced into the chamber 105 is injected into the membrane 112. By evacuating the chamber by the vacuum pump 106, small-size molecules in the gas and bubbles dissolved in the metal solution 107 transmit through the wall surface of the membrane, and are exhausted outside the chamber. Since the gas and bubbles 109 dissolved in the solution are mainly N2, O2, CO2, the gas in the metal solution can be selectively removed by this method.
3. The metal solution 107 from which the dissolved gas and bubbles 109 are removed in the chamber 105 in step 2 is introduced into the dissolved gas analyzer 104. The metal solution 107 is injected into the closed vessel 114, and the DO meter 113 is inserted into the closed vessel 114 to measure the concentration of the gas dissolved in the metal solution 107. The first embodiment pays attention to O2 among the components of the dissolved gas because the amount of O2 is relatively large and its dissolved amount can be measured at high precision. The dissolved amount of O2 is measured to determine an expected amount of dissolved gas. During measurement, the metal solution 107 is always stirred using a rotator 115 to increase the measurement precision.
4. The exhaust speed of the pump is controlled based on the dissolved O2 concentration measured in step 3 so as to set the dissolved O2 concentration to a proper value for the following purposes.
(i) The dissolved gas is exhausted to a value at which discharge of droplets from the droplet discharge unit 8 satisfactorily stabilizes.
(ii) If the vacuum degree in the chamber 105 excessively decreases, the main component (solvent and the like) of the metal solution 107 is exhausted to change the concentration. To prevent this, the dissolved gas amount must be prevented from excessively decreasing.
5. The metal solution 107 after steps 2 to 4 is introduced into the temperature adjusting unit 102. In the temperature adjusting unit 102, the circulator 120 circulates through the tube 123 a liquid kept at a temperature of 20° C.±0.2° C. to keep the temperature of the metal solution 107 in the constant-temperature bath 121 constant. The structure of the temperature adjusting unit (the volume of the constant-temperature bath 121, the shape of the fluid passage of the tube 123, and the like) is designed to set the temperature of the metal solution 107 in use to 20° C.±0.3° C. The first embodiment assumes application of droplets at a discharge amount of 50 pl per operation and a discharge frequency of 1 kHz. The volume of the constant-temperature bath is designed to 15 ml.
After the temperature of the metal solution is controlled to a predetermined value by this method, the metal solution is introduced into the droplet discharge unit 6.
In this manner, the droplets 9 containing a conductive film formation material are applied four times. The resultant substrate is heated at 300° C. for 10 min to form thin films from palladium oxide (PdO) at a film thickness of 100 Å as conductive films. A voltage is applied between the pair of electrodes 2 and 3, and electrification processing (electrification forming processing) is performed for the conductive films 4 to form a gap 5 between the conductive films 4.
The manufactured electron source substrate is used to constitute an envelope 98 by a face plate 96, support frame 92, and rear plate 91, as shown in
An electron-emitting element manufactured by the manufacturing method of the first embodiment exhibits good characteristics, and the conductive thin film can be uniformly implemented on the substrate with high quality. The present invention can obtain at high yield a high-quality image forming apparatus almost free from variations in element characteristics at the same degree as element characteristics attained by photolithography.
A method of manufacturing an image forming apparatus having a surface-conduction type electron-emitting element according to the second embodiment of the present invention will be described with reference to
When the exhaust speed of a vacuum pump 106 is set constant, the concentration of the gas dissolved in the metal solution 107 depends on the stay time in a chamber 105. In the second embodiment, the three-way valve 117 is interposed between the chamber 105 and a dissolved gas analyzer 104. The opening degree of the three-way valve 117 is controlled based on a dissolved O2 concentration detected by a DO meter 113, and part of the metal solution 107 is exhausted to the outside. This changes the stay time in the chamber 105 so as to keep the concentration of the gas dissolved in the metal solution 117 constant.
This method can also control the concentration of the gas dissolved in the metal solution 107 to a predetermined value or less, and can increase the yield of the electron source substrate, similar to the first embodiment. The second embodiment realizes the control method using the opening degree of the valve, and thus can simplify the apparatus.
A method of manufacturing an image forming apparatus having a surface-conduction type electron-emitting element according to the third embodiment of the present invention will be described with reference to
When discharge of droplets 9 from a droplet discharge unit 6 is maintained at a predetermined speed in manufacturing an electron source substrate, the stay time of the metal solution 107 in the chamber 105 is constant. At this time, the concentration of the gas dissolved in the metal solution 107 depends on the vacuum degree in the chamber 105. From this, as shown in
This method can also control the concentration of the gas dissolved in the metal solution 107 to a predetermined value or less, and can increase the yield of the electron source substrate, similar to the first embodiment. The third embodiment uses the pressure gauge 119 as a method of obtaining the concentration of the dissolved gas, and thus can simplify the apparatus.
The present invention can provide an electronic device manufacturing method and manufacturing apparatus which can discharge a solution to an accurate position on a substrate, and are excellent in reproducibility of the characteristics of a manufactured electronic device.
The present invention can provide a manufacturing method and manufacturing apparatus which can discharge a solution to an accurate position on a substrate, for an electron source having a plurality of electron-emitting portions with uniform electron emission characteristics.
The present invention can provide a manufacturing method for a high-quality image forming apparatus having uniform emission luminance.
An electron source substrate manufactured by these apparatus and method can realize a smaller number of steps, higher yield, and lower cost, compared to the conventional manufacturing method.
| Number | Date | Country | Kind |
|---|---|---|---|
| 11-047095 | Feb 1999 | JP | national |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 09694268 | Oct 2000 | US |
| Child | 11038277 | Jan 2005 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP00/01024 | Feb 2000 | US |
| Child | 09694268 | Oct 2000 | US |
