1. Field of the Invention
The present invention relates to a method of manufacturing a liquid ejection head and a liquid ejection head.
2. Description of the Related Art
A liquid ejection recording apparatus configured to eject a liquid such as ink (hereinafter, referred to simply as a recording apparatus) is widely used and implemented in output apparatuses and the like relating to computers. In recent years, there has been a demand for a liquid ejection head (hereinafter, also referred to simply as a recording head or a head) having a longer printing width in order to output high quality images at higher speed.
Examples of widely known general recording apparatuses include a system of performing printing by scanning a recorded medium such as paper with the recording head while ejecting ink. Also known is a so-called full-line-type recording apparatus which is capable of performing high-speed printing by fixing a head having a long printing width corresponding to the length of the recorded medium above a conveyor belt that conveys the recorded medium and scanning the recorded medium therewith.
The proposed configuration of the full-line-type recording head described above is a configuration in which a plurality of liquid ejection devices having a suitable length (having a suitable number of nozzles) are arranged on a base member to realize a recording head having a long printing width as a whole described in Japanese Patent Laid-Open No. 2007-55071.
In the recording head in this configuration, a method of forming reference points on the base member to allow the liquid ejection devices to be bonded at predetermined positions on the base member and applying an adhesive agent or bonding the liquid ejection devices with respect to the reference points is employed.
However, if the length of the base member is increased to obtain a longer printing width, the base member may warp in the short side direction. In other words, the reference points formed on the base member are shifted in the short side direction, and if the adhesive agent is applied on the basis of the shifted reference points, there arises a problem that the adhesive agent may enter liquid supply port portions for supplying ink to the liquid ejection devices. As a countermeasure for such a situation, a method of detecting an amount of warping of the base member and changing positions where the adhesive agent is applied individually from one liquid supply port portion to another according to the amount of warping has been contemplated. However, with this method, the productivity of the heads is reduced.
A method of manufacturing a liquid ejection head including a base member having a liquid supply port row including a plurality of liquid supply port portions for supplying liquid formed in the longitudinal direction, and a plurality of liquid ejection devices arranged at positions corresponding to the liquid supply port portions and bonded to the base member with an adhesive agent, the method including: defining a first imaginary reference line along the longitudinal direction of the base member and measuring the distances between the first imaginary reference line and at least two liquid supply port portions of the liquid supply port row; defining a second imaginary reference line passing through the liquid supply port portion at the shortest distance from the first imaginary reference line and the liquid supply port portion at the longest distance from the first imaginary line respectively from among the at least two liquid supply port portions and defining the second imaginary reference line between two imaginary lines parallel to the first imaginary reference line; applying the adhesive agent on the base member on the basis of the second imaginary reference lines; and bonding the liquid ejection devices on the base member with the adhesive agent applied on the base member.
A method of manufacturing a liquid ejection head including a base member having a liquid supply port row including a plurality of liquid supply port portions for supplying liquid formed in the longitudinal direction, and a plurality of liquid ejection devices arranged at positions corresponding to the liquid supply port portions and bonded to the base member with an adhesive agent, the method including: defining a second imaginary reference line between a first imaginary reference line extending along the longitudinal direction of the base member and a reference point at the largest distance from the imaginary reference line from among a plurality of reference points formed along the longitudinal direction so as to extend along the first imaginary reference line; applying the adhesive agent on the base member on the basis of the second imaginary reference lines; and bonding the liquid ejection devices on the base member with the adhesive agent applied on the base member.
A liquid ejection head includes a base member having a liquid supply port row including a plurality of liquid supply port portions arranged in the longitudinal direction and liquid ejection devices arranged at positions corresponding to the liquid supply port portions and bonded to the base member with an adhesive agent formed around the liquid supply port portions, wherein the distance between a first opening end of a first liquid supply port portion formed at one end side in the direction of arrangement from among the plurality of liquid supply port portions in the direction of a first short side orthogonal to the longitudinal direction and an outer peripheral end of the adhesive agent formed outside the first opening end on the outer peripheral side is larger than the distance between a second opening end in a second short side direction opposite from the first short side direction and an end portion of the adhesive agent formed outside the second opening end, and the distance between a third opening end of a second liquid supply port portion formed at a center in the direction of arrangement from among the plurality of liquid supply port portions in the direction of the first short side and an end of the adhesive agent formed outside the third opening end on the outer peripheral side is smaller than the distance between a fourth opening end in the second short side direction and an outer peripheral end portion of the adhesive agent formed outside the fourth opening end.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Referring now to the drawings, embodiments will be described.
A liquid ejection head manufactured by a method of manufacturing according to a first embodiment includes a base member formed with a liquid supply port row having a plurality of liquid supply port portions arranged in a row in the longitudinal direction, and liquid ejection devices arranged at positions corresponding to the liquid supply port portions.
A method of manufacturing the base member 1 will be described with reference to
The base member 1 unified by being sintered in this manner is subjected to slight contraction at the time of sintering, and simultaneously is subjected to warping. The warping occurs both in the thickness direction of the base member 1 (mainly in the longitudinal direction of the base member) and in the in-plane direction (mainly in the short side direction of the base member). The warping in the thickness direction of the base member 1 (mainly in the longitudinal direction) may be reduced by grinding the base member 1, but there is no way to reduce the warping in the in-plane direction (mainly in the short side direction), and the warping that was generated at the time of sintering remains.
Subsequently, a process flow of the method of manufacturing of the first embodiment will be described.
First of all, a process of measuring the positions of the reference points 3 will be performed using a measuring device illustrated in
Subsequently, a process of defining the reference lines for applying the adhesive agent on the basis of the positions of the measured reference points is performed.
As illustrated in
Subsequently, a process of applying an adhesive agent 30 is performed. In this process, the adhesive agent 30 is applied to the base member 1 using an application needle 31 as illustrated in
Subsequently, a process of bonding the liquid ejection devices 4 to the base member 1 having the adhesive agent applied thereto is performed as described above. In this process, as illustrated in
In the liquid ejection head obtained in this manner, in addition to the capability of applying the adhesive agent to effective positions which inhibit entry of the adhesive agent into the liquid supply port portions, a large bonding surface area between the adhesive agent and the liquid ejection devices is secured. Therefore, a high bonding strength of the liquid ejection devices is obtained. In this case, the positions of the liquid ejection devices are different from one liquid ejection head to another, and hence it is to be noted that ink ejection timing needs to be controlled individually when mounting the heads on a main body.
The liquid ejection head obtained by the method of manufacturing described above has a form in which the relationship between an opening end and the adhesive agent satisfies the following relationship in the outermost (on end portion side in the direction of arrangement) first liquid supply port portion from among the plurality of liquid supply port portions. In other words, the distance between a first opening end and an outer end of the adhesive agent applied outside the first opening end which is determined in the direction orthogonal to the longitudinal direction of the base member is different from the distance between a second opening end opposite the first opening end and an outer end of the adhesive agent applied outside the second opening end. The magnitude relation of the distances is different from that in the case of the second liquid supply port portion in the vicinity of a center portion of the base member, and the difference between absolute values of the distances is equal to that in the case of the second liquid supply port portion.
In the first embodiment, the positions of the reference points 3 are measured instead of measuring the positions of the respective liquid supply port portions 2 of the liquid supply port row. However, the positions of the liquid supply port portions 2 may be measured directly. However, if the base member 1 is formed of a stacked member, and hence the liquid supply port portions are formed across the plurality of layers, there is a probability of erroneous detection of the positions of the liquid supply port portions due to the influence of inter-layer shifting occurring at the time of the image processing of the liquid supply port portions. Therefore, as in the first embodiment, the measurement of the positions of the reference points 3 is preferable. In this case, in order to avoid the erroneous detection of the positions of the reference points due to the inter-layer shifting, the reference point is preferably formed only on the first layer of the base member. In the first embodiment, five of the reference points are provided. However, only at least three of the reference points at both ends of the base member in the longitudinal direction and in the vicinity of the center portion have to be provided. The reference points at the both ends of the base member are preferably provided outside the liquid supply port portion located at the outermost position from among the plurality of liquid supply port portions. The arrangement of the reference points may be selected from any suitable shape as long as positions can be measured accurately.
A second embodiment is different from the first embodiment in that the liquid ejection devices bonded to the base member to conform with the reference line (second imaginary reference line) for applying the adhesive agent in the first embodiment are bonded to the reference points of the base member. In conjunction with this, the most desirable position of the second imaginary reference line is also changed. Other configurations are the same as the first embodiment. In the following description, only processes different from those in the first embodiment will be described, and description of other processes will be omitted.
Referring to
Subsequently, in the process of bonding the liquid ejection devices of the second embodiment to the base member, the liquid ejection devices 4 are bonded to the base member 1 on the inclined reference line 21 connecting the reference points at the both ends as illustrated in
In the liquid ejection head obtained in this manner, in addition to the reduction of probability of entry of the adhesive agent to the liquid supply port portions, definition of the positions of the liquid ejection devices by the positions from the imaginary line connecting the reference points at the both ends of the base member 1 with respect to all the base members. Therefore, according to the method of manufacturing of the second embodiment, mounting of other head components and ejection control at the time of mounting of the heads on the main body is facilitated.
A third embodiment is a mode of performing the method of bonding the liquid ejection devices of the first embodiment in a specific method. In other words, in this embodiment, after the bonding of the first liquid ejection device so as to conform to the position where the adhesive agent is applied, positioning of the second liquid ejection device is performed using the bonded liquid ejection device. In this manner, the liquid ejection device bonded previously is used for the positioning of the liquid ejection device to be bonded next to bond the liquid ejection devices in sequence. In this embodiment, the first liquid ejection device is bonded in conform to the positions where the adhesive agent is applied. However, the liquid ejection device may be bonded to conform with the reference point of the base member as in the second embodiment.
In the liquid ejection head obtained in this manner, the entry of the adhesive agent into the liquid supply port portions may be reduced. In addition, since the adjacent liquid ejection device may be positioned with high degree of accuracy, deterioration of a printed image at the joint portions between the liquid ejection devices is effectively reduced.
A liquid ejection head manufactured by a method of manufacturing according to a fourth embodiment includes a base member formed with a liquid supply port row having a plurality of liquid supply port portions arranged in a plurality of rows in the short side direction, and liquid ejection devices arranged at positions corresponding to the liquid supply port portions.
Subsequently, a process flow of the method of manufacturing of the fourth embodiment will be described.
First of all, in the same manner as the first embodiment, the process of measuring the positions of the reference points will be performed using the measuring device illustrated in
Subsequently, a process of defining the reference lines (second imaginary reference lines) for applying the adhesive agent on the basis of the positions of the measured reference points.
As illustrated in
Subsequently, a process of applying the adhesive agent 30 is performed. In this process, the adhesive agent 30 is applied to the base member 1 as illustrated in
Subsequently, a process of bonding the liquid ejection device 4 to the base member 1 having the adhesive agent applied thereto is performed as described above. In this process, as illustrated in
In the liquid ejection head obtained in this manner, since the adhesive agent is applied to the most effective positions in all the liquid supply port rows, the entry of the adhesive agent into the liquid supply port portions may be reduced. In addition, a larger bonding surface area is obtained between the adhesive agent and the liquid ejection devices, and hence the higher bonding strength of the liquid ejection devices may be obtained. In this embodiment as well, since the positions of the liquid ejection devices are different from head to head, the ink ejection timing is needed to be controlled individually to accommodate such difference at the time of mounting the head on the main body in the same manner as the first embodiment.
A fifth embodiment is a modification of the fourth embodiment in which the position of the second imaginary reference line is changed. More specifically, the reference line (second imaginary reference line) for applying the adhesive agent is defined for one of the liquid supply port rows in the same manner as the fourth embodiment, and the position of the reference line for the other liquid supply port row is determined on the basis of the prescribed second imaginary reference line. Other configurations are the same as the fourth embodiment. In the following description, only processes different from those in the fourth embodiment will be described, and description of other processes will be omitted.
Referring now to
In this embodiment, the second imaginary reference line 60 is defined in the method illustrated in the third embodiment with respect to the plots 20a and 20e for the liquid supply port row for the lower level. The shift amount B from the inclined reference line 50 for the lower level of the second imaginary reference line 60 for the lower level is most preferably defined to be half the distance c from the farthest plot 20c. Then, an imaginary line obtained by translating the second imaginary reference line 60 for the lower level in parallel by a pitch of the liquid supply port row is defined as a second imaginary reference line 62 for the upper level.
After the definition of the second imaginary reference line, the process of applying the adhesive agent and the process of bonding the liquid ejection device are performed in the same manner as in the fourth embodiment, whereby the liquid ejection head illustrated in
With the liquid ejection head in this configuration, application of the adhesive agent to the positions most effective for the reduction of entry of the adhesive agent into the liquid supply port portions is enabled for the liquid supply port row on the lower level. As regards the liquid supply port row on the upper level, entry of the adhesive agent into the liquid supply port portions may be reduced. Since the pitches between rows of the liquid ejection devices may be equalized, ejection control at the time of mounting the head on the main body is facilitated.
In a sixth embodiment, the liquid ejection devices are bonded in conformity with the inclination reference line in the same manner as in the second embodiment after determination of the positions of the respective second imaginary reference lines in the manner described in the fifth embodiment.
The liquid ejection head obtained in the sixth embodiment is subjected to deviation between the positions where the adhesive agent is applied and the positions of the liquid ejection devices as in the second embodiment. Therefore, the preferable mode in the fifth embodiment is as follows. In other words, the second imaginary reference lines are defined by using the liquid supply port row having the smallest positional displacements of the respective reference points with respect to the imaginary line (inclination reference line) connecting the reference points at the both ends of the liquid supply port row from among the plurality of liquid supply port rows. Then, as regards other liquid supply port rows, the lines obtained by translating the second imaginary reference line in parallel defined as described above by a pitch of the liquid supply port row is defined as the second imaginary reference lines of other liquid supply port rows.
In the liquid ejection head obtained in this manner, the distances between the imaginary lines connecting the reference points at the both ends of the respective liquid supply port rows and the adhesive agent in all the liquid supply port rows may be set to half the distance or smaller from the imaginary line to the reference point farthest from the imaginary line. Accordingly, the entry of the ink to the liquid supply port rows in all of the liquid supply port rows may be reduced, and the influence of the positional displacement between the adhesive agent and the liquid ejection devices on the movement of the liquid ejection devices may be reduced.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2011-231749 filed Oct. 21, 2011, which is hereby incorporated by reference herein in its entirety.
Number | Date | Country | Kind |
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2011-231749 | Oct 2011 | JP | national |