Method of Manufacturing Organic Device Element

Abstract

An organic device element including a high-quality protective film is manufactured. In a step of forming a protective film on an organic device substrate on which an organic device is formed, an electroconductive rear plate provided on a rear side of the organic device substrate is divided into a peripheral portion which is in contact with a substrate circumference portion and a central portion which is in contact with a substrate central portion. A bias voltage of −10 V is applied to the central portion and a bias voltage of −5 V is applied to the peripheral portion. Therefore, an electric field intensity of a surface of the organic device substrate caused by a discharge unit is made uniform over the entire substrate to reduce a film thickness distribution of the formed protective film to ±2%.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram for an example of the present invention.

FIG. 2 is an explanatory diagram for a comparative example.

FIG. 3 is a graph illustrating a difference between film thickness distributions of protective films in the example of the present invention and the comparative example.

FIG. 4 is a cross sectional photograph of the protective film formed in the example of the present invention.

FIG. 5 is a cross sectional photograph of the protective film formed in the comparative example.

Claims

1. A method of manufacturing an organic device element comprising a substrate, an organic device, and a protective film covering the organic device, the organic device comprising a pair of electrodes and an organic compound layer provided between the pair of electrodes, the method comprising forming the protective film on the organic device provided on the substrate,wherein the protective film is formed on the organic device provided on the substrate while separate bias voltages are applied to a central region overlapped with the substrate and a peripheral region corresponding to a peripheral portion of the central region, of an electroconductive member provided on a rear side of the substrate.