Method of manufacturing substrate for superconducting cable

Information

  • Patent Application
  • 20070173411
  • Publication Number
    20070173411
  • Date Filed
    December 27, 2006
    17 years ago
  • Date Published
    July 26, 2007
    17 years ago
Abstract
A method of manufacturing a substrate for a superconducting cable has steps of rolling Hastelloy C-276 or stainless steel with a rolling roll having a surface roughness of 10 nm of less which is a value of a root mean square (RMS), thereby forming a substrate; immersing the rolled substrate in an electrolytic polishing solution to electrolytically polish it; and vapor-depositing a superconducting layer on the electrolytically polished substrate. According to the method, it is possible to reduce the time of electrolytic polishing of the substrate, thereby improving the productivity thereof. In addition, it is possible to make the number of cracks per a unit area and the horizontal level favorable.
Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:



FIG. 1 is a flow chart showing a method of manufacturing a substrate for a superconducting cable according to an embodiment of the invention.


Claims
  • 1. A method of manufacturing a substrate for a superconducting cable, the method comprising steps of: rolling Hastelloy C-276 or stainless steel with a rolling roll having a surface roughness of 10 nm of less which is a value of a root mean square (RMS), thereby forming a substrate;immersing the rolled substrate in an electrolytic polishing solution to electrolytically polish it; andvapor-depositing a superconducting layer on the electrolytically polished substrate.
  • 2. The method according to claim 1, wherein a thickness of the substrate formed in the rolling step is preferably 0.05˜0.1 mm.
  • 3. The method according to claim 1, wherein the superconducting layer consists of ReBCO.
  • 4. The method according to claim 1, further comprising a step of forming a buffer layer of a metal between the substrate and the superconducting layer so as to preventing a diffusion therebetween.
  • 5. The method according to claim 1, further comprising a step of forming a protective layer of a metal on the superconducting layer so as to protect the superconducting layer.
Priority Claims (1)
Number Date Country Kind
10-2006-0008178 Jan 2006 KR national