Claims
- 1. A method of manufacturing a surface acoustic wave module comprising the steps of:
- forming a conductive metallic film on a sheet of a surface acoustic wave transmitting substrate;
- forming electrodes for driving and receiving a surface acoustic wave on said conductive metallic film;
- cutting said sheet into a plurality of surface acoustic wave modules; and then
- treating said conductive metallic film so as to increase its resistivity to at least 10.sup.3 .OMEGA.cm.
- 2. A method of manufacturing a surface acoustic wave module comprising the steps of:
- forming electrodes for driving and receiving a surface acoustic wave on a sheet of a surface acoustic wave transmitting substrate;
- forming a conductive metallic film on said electrodes for driving and receiving a surface acoustic wave;
- cutting said sheet into a plurality of surface acoustic wave modules; and then
- treating said conductive metallic film so as to increase its resistivity to at least 10.sup.3 .OMEGA.cm.
- 3. The method of claim 1, wherein the conductive metallic film is 1-100 nm thick.
- 4. The method of claim 1, wherein the conductive metallic film is made of a metal or an alloy of metals selected from the group consisting of titanium (Ti), aluminum (Al), silicon (Si), boron (B) and lithium (Li).
- 5. The method of claim 1, wherein the conductive metallic film is treated with an oxidizing treatment or a nitriding treatment so as to increase its resistivity.
- 6. The method of claim 1, wherein the substrate is at least one piezoelectric substrate selected from the group consisting of LiTaO.sub.3, LiNbO.sub.3 and Li.sub.2 B.sub.4 O.sub.7.
- 7. The method of claim 2, wherein the conductive metallic film is 1-100 nm thick.
- 8. The method of claim 2, wherein the conductive metallic film is made of a metal or an alloy of metals selected from the group consisting of titanium (Ti), aluminum (Al), silicon (Si), boron (B) and lithium (Li).
- 9. The method of claim 2, wherein the conductive metallic film is treated with an oxidizing treatment or a nitriding treatment so as to increase its resistivity.
- 10. The method of claim 2, wherein the substrate is at least one piezoelectric substrate selected from the group consisting of LiTaO.sub.3, LiNbO.sub.3 and Li.sub.2 B.sub.4 O.sub.7.
Priority Claims (2)
Number |
Date |
Country |
Kind |
7-045187 |
Mar 1995 |
JPX |
|
7-112756 |
May 1995 |
JPX |
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Parent Case Info
This application is a Divisional of application Ser. No. 08/555,744, filed Nov. 9, 1995, now U.S. Pat. No. 5,815,900 application is incorporated herein by reference.
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Non-Patent Literature Citations (2)
Entry |
Oct. 1989, Greer et al., "Applications of Laser-Trimming for All Quartz Package, Surface Acoustic Wave Devices", 1989 Ultrasonics Symposium, Montral, pp. 179-184. |
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Divisions (1)
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Number |
Date |
Country |
Parent |
555744 |
Nov 1995 |
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