Claims
- 1. A method of optimizing polymer systems used modulators devices comprising
measuring the conductivity of a first layer by applying a voltage and determining the current; measuring the conductivity of at least one additional layer by applying a voltage and determining the current; and comparing the conductivity whereby polymers may be optimized by selecting the highest conductivity.
- 2. A method of optimizing polymer layers used in modulators comprising
forming a single polymer film between two cladding layers and measuring the conductivity of the single polymer film whereby polymers may be optimized by selected the highest conductivity.
- 3. The method of claim 2 whereby the polymer film between two cladding layers is support substrate.
- 4. The method of claim 3 whereby the support substrate is a silicon wafer.
- 5. The method of claim 1 whereby the polymer system is heated to the poling temperature.
- 6. The method of claim 2 whereby the single polymer between two cladding layers is heated to the poling temperture.
Parent Case Info
[0001] This application is based on Provisional Application No. 60/282,476 filed Apr. 10, 2001.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60282476 |
Apr 2001 |
US |