Claims
- 1. A method of producing a molded covering member for a light emitting diode, comprising the steps of:sand-blasting at least one surface of an upper mold and a lower mold to reduce a light variation on a surface of a to-be-molded covering member when the covering member is disposed on the light emitting diode; providing the upper mold and the lower mold adjacent to each other so that a space is formed therebetween; and injecting a silicon rubber material and a fluorescent substance into the space formed between the upper mold and the lower mold.
- 2. The method according to claim 1, wherein said step of sand-blasting includes sand-blasting an inner surface of the upper mold.
- 3. The method according to claim 1, wherein said step of sand-blasting includes sand-blasting an outer surface of the lower mold.
- 4. The method according to claim 1, wherein said step of sand-blasting includes sand-blasting an inner surface of the upper mold and an outer surface of the lower mold.
- 5. The method according to claim 1, wherein said step of sand-blasting step is performed with sand blasting materials of #100 level.
- 6. The method according to claim 1, wherein said step of injecting further includes injecting a light diffusion substance.
- 7. The method according to claim 6, wherein the light diffusion substance includes calcium carbonate.
- 8. The method according to claim 1, wherein the fluorescent substance includes a YAG fluophor.
- 9. The method according to claim 1, wherein said step of providing includes the space being a cap shaped space of substantially uniform thickness.
- 10. The method according to claim 1, wherein said step of providing includes the space being a flat shaped space having substantially a uniform thickness.
- 11. A method of producing a molded covering member for a light emitting diode as defined in claim 1, wherein said step of providing the upper mold and the lower mold includes providing a uniform thickness space therebetween.
- 12. A method of producing a molded covering member for a light emitting diode as defined in claim 1, further comprising the step of providing a projection on the lower mold so that an external shape of the projection is substantially similar to an outer surface of the light emitting diode.
- 13. A method of producing a molded covering member for a light emitting diode as defined in claim 1, further comprising the step of providing a plurality of projections on at least one of the upper mold and the lower mold.
- 14. A method of producing a molded covering member for a light emitting diode as defined in claim 1, further comprising providing a first set of projections on the lower mold and providing a second set of projections on the upper mold so that a size of the first set of projections is different from the second set of projections.
- 15. A method of producing a molded covering member for a light emitting diode, comprising the steps of:sand-blasting at least one of an inner surface of an upper mold and an outer surface of a lower mold to reduce a light variation on a surface of a to-be-molded covering member when the covering member is disposed on the light emitting diode, wherein the inner surface and the outer surface when disposed adjacent to each other during a molding process form a space therebetween corresponding to a shape of the to-be-molded covering member; providing a rubber material and a fluorescent substance together to form a material for the molded covering member to be injected in the space; injecting the material to the space formed between upper mold and the lower mold; and removing the molded covering member from the upper and lower molds.
Parent Case Info
This is a continuation-in-part application of U.S. patent application Ser. No. 09/499,345 filed on Feb. 8, 2000, now U.S. Pat. No. 6,319,425, which is a continuation-in-part application of U.S. patent application Ser. No. 09/110,973 filed on Jul. 7, 1998, now abandoned.
US Referenced Citations (17)
Foreign Referenced Citations (9)
Number |
Date |
Country |
38 04 293 |
Aug 1989 |
DE |
42 25 140 |
Feb 1994 |
DE |
58-196067 |
Nov 1983 |
JP |
63-280467 |
Nov 1988 |
JP |
2-94673 |
Apr 1990 |
JP |
7-176794 |
Jul 1995 |
JP |
7-193281 |
Jul 1995 |
JP |
9-27642 |
Jan 1997 |
JP |
WO 9750132 |
Dec 1997 |
WO |
Non-Patent Literature Citations (1)
Entry |
Sato Y. et al., “Full-Color Fluorescent Display Devices Using a Near-UV LED,” Japanese Journal of Applied Physics, vol. 35, No. 7A, pp. L838-L839, Jul. 1, 1996. |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09/499345 |
Feb 2000 |
US |
Child |
09/860427 |
|
US |
Parent |
09/110973 |
Jul 1998 |
US |
Child |
09/499345 |
|
US |