Claims
- 1. A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of:
- coating an electrically insulative wafer with an electrically and thermally conductive coating on the top and bottom surfaces thereof;
- removing the conductive coating on the top surface of the coated wafer except on predetermined areas to form a number of prominences thereon, the number of said prominences being at least equal to the number of said cells;
- attaching said cells on said prominences, each cell being located on a different prominence;
- coating the surface of said panel with a coating to which it is easy to solder, said coating being thermally conductive;
- coating the panel coating with a soft solder capable of absorbing mechanical stresses due to thermally induced expansions, said solder being thermally conductive; and
- soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.
- 2. A method as in claim 1, wherein:
- said wafer is formed from beryllium oxide.
- 3. A method as in claim 1, wherein:
- said coating on said wafer surfaces is an inner layer of chromium and an outer layer of copper.
- 4. A method as in claim 1, wherein:
- said cells are soldered on said prominences.
- 5. A method as in claim 1, wherein:
- said coating on said panel surface is copper.
- 6. A method as in claim 1, wherein:
- said soft solder is an indium solder.
- 7. A method of mounting solar cells on a metallic panel to provide a direct thermal path between the cells and the panel comprising the steps of:
- coating a beryllia wafer first with chromium and then with copper on the top and bottom surfaces;
- removing the coating on the top surface of the wafer except on predetermined areas to form number of prominences thereon, the number of prominences being at least equal to the number of said cells;
- soldering said cells on said prominences, each cell being located on a different prominence;
- coating the surface of said panel with a copper coating;
- coating said panel coating with a soft indium solder; and
- soldering the bottom surface of said solar-cell-bearing wafer to the soft-solder surface of said panel.
Parent Case Info
This is a division, of application Ser. No. 228,593, filed Feb. 23, 1972, now U.S. Pat. No. 3,833,425.
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or for the Government of the United States for governmental purposes without the payment of any royalties thereon or therefor.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
228593 |
Feb 1972 |
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