This invention relates to case hardening of metal or alloys and, more particularly, to case hardening with a nitrogen and metal or alloy solid solution.
For components formed of metals or alloys it is often desirable to form a hardened surface case on a core of the metal or alloy to enhance the performance of the component. The hardened surface case provides wear and corrosion resistance while the core provides toughness and impact resistance.
There are various conventional methods for forming a hardened surface case. One such typical method, nitriding, utilizes gas, salt bath, or plasma processing. The nitriding process introduces nitrogen to the metal or alloy surface at an elevated temperature. The nitrogen reacts with the metal or alloy to form hard nitride compounds on the metal or alloy surface. This conventional process provides the benefit of a hardened surface case, however, the nitride compounds may be brittle, friable, cause premature failure, or be otherwise undesirable.
The nitride compounds may include a variety of different compositions, such as the ε and γ′ compositions of iron and nitrogen, as well as various different compositions and crystal structures. The formation of nitride compound compositions introduces some volume fraction within the transformed surface region that possesses properties that are dissimilar to those of the substrate. While the microstructural and compositional transitions are gradual, the presence of nitride compounds having dissimilar properties can lead to deleterious performance in applications that involve contact stress, such as gears and bearings.
Accordingly, it is desirable to provide a method of case hardening that avoids an abrupt change in composition and crystal structure by forming a solid solution region having a gradual transition in nitrogen concentration between the case surface and the core.
The method of plasma nitriding according to the present invention includes transforming a surface region of a generally nitrogen-free metal or alloy into a nitrogen-containing solid solution surface region. A first heating process forms a nitrogen-charged surface portion on the surface region of the metal or alloy. The heating process includes heating the surface region for a time at a first temperature and in the presence of a nitrogen gas partial pressure. The first temperature is below a heat-treating temperature of the metal or alloy. A second heating process is used to transform the surface region into the nitrogen-containing solid solution surface region by diffusing nitrogen from the nitrogen-charged surface portion into the surface region of the metal or alloy. The temperature of the second heating process is approximately equal to or lower than the temperature of the first heating process to preserve the crystal structure of the surface region, nitrogen-containing solid solution surface region, and the core. An inert or reducing gas, such as argon or hydrogen, may be ionized and used as a diluent to favor the formation of preferred compound compositions and microstructures and/or to inhibit the formation of surface oxides. In addition, the presence of a diluting gas species may be used to sputter the nitrogen-charged surface portion, thereby removing the nitrogen-charged surface portion from the nitrogen-containing solid solution surface region. The nitrogen-containing solid solution surface region has a gradual transition in nitrogen concentration over a desired depth.
The method of plasma nitriding according to the present invention provides a method for case hardening a metal or alloy by forming a nitrogen-containing solid solution surface region having a gradual transition in nitrogen concentration between the case surface and the core.
The various features and advantages of this invention will become apparent to those skilled in the art from the following detailed description of the currently preferred embodiment. The drawings that accompany the detailed description can be briefly described as follows.
The core 12 and surface region 14 of the metal 10 have a generally equivalent tetragonal crystal structure 16 (
Preferably, the first temperature is between 400° F. and 1100° F. Even more preferably, the first temperature is below a heat-treating temperature of the metal 10. The tetragonal crystal structure 16, or other crystal structure, changes when the metal 10 is heated above the heat treating temperature, thereby undesirably changing the dimensions of the metal 10. The heating process may utilize a first temperature far below the heat treating temperature of the metal 10, however, a first temperature that is generally near the heat treating temperature without exceeding the heat treating temperature provides more rapid formation of the nitrogen-charged surface portion 22.
For non-heat-treatable metals or alloys, including those having face centered cubic and body centered cubic crystal structures, selecting a first temperature at the upper end of the 400° F. to 1100° F. range reduces the first time required to form the nitrogen-charged surface portion 22. Furthermore, a high range temperature may avoid formation of deleterious microstructural phases or significantly changing the properties of the core 12 or surface region 14. For example only, the first temperature may be as high as 1100° F. for a 300-series stainless steel, which has a face centered cubic structure.
During the first heating process, the nitrogen gas partial pressure is preferably maintained at about 75% by volume, or above, of a gas atmosphere pressure of about 2.7 torr at a gas flow rate of between 280-300 std·cm3·min−1. The gas atmosphere includes a generally inert and/or reducing gas or mixture of inert and/or reducing gases with the nitrogen gas.
The heating process is maintained for the first time. The first time is preferably between one and one hundred hours. The first time is a function of the first temperature. If the first temperature is near the heat-treating temperature of the metal 10, the heating process requires less time to form the nitrogen-charged surface portion 22 than if the temperature is far below the heat treating temperature.
As illustrated in
The second time of the second heating process is preferably between one and one-hundred hours and will vary according to the desired depth of interstitial diffusion into the surface region 14. Longer times result deeper diffusion depths. Preferably, the selected time results in a nitrogen diffusion depth of about 250 micrometers, although shorter times may be used if lesser depths are desired.
As illustrated in
As illustrated in
Although a preferred embodiment of this invention has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of this invention. For that reason, the following claims should be studied to determine the true scope and content of this invention.
This application is a divisional of U.S. patent application Ser. No. 10/870,489, which was filed Jun. 17, 2004.
Number | Date | Country | |
---|---|---|---|
Parent | 10870489 | Jun 2004 | US |
Child | 12479904 | US |