Claims
- 1. A method of preparing a laminated packaging material, comprising the steps of:
- forming a thin-film layer on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties;
- laminating a heat buffer layer on said thin-film layer in such a way that the substrate undergoes no expansion and constriction during the lamination step; and
- forming an extruded coating layer on said heat buffer layer.
- 2. The method of claim 1, wherein said heat buffer layer is laminated to the thin-film layer by dry lamination or non-solvent lamination.
- 3. The method of claim 1, wherein said heat buffer layer is selected from the group consisting of a polyester film, a polyethylene film, a polypropylene film and a polyamide film.
- 4. The method of claim 1, wherein said thin-film layer is transparent.
- 5. The method of claim 4, wherein said thin-film layer comprises silicon oxide.
- 6. The method of claim 1, wherein an extruded coating layer of a thermoadhesive resin is further formed on the substrate on its side on which said thin-film layer is not formed.
- 7. A method of preparing a laminated packaging material, comprising the steps of:
- forming a thin-film layer on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties;
- laminating a heat buffer layer on said thin-film layer in such a way that the substrate undergoes no expansion and constriction during the lamination step;
- forming an anchor coat layer on said heat buffer layer; and
- forming an extruded coating layer on said anchor coat layer.
- 8. The method of claim 7, wherein said heat buffer layer is laminated to the thin-film layer by dry lamination or non-solvent lamination.
- 9. The method of claim 7, wherein said heat buffer layer is selected from the group consisting of a polyester film, a polyethylene film, a polypropylene film and a polyamide film.
- 10. The method of claim 7, wherein said thin-film layer is transparent.
- 11. The method of claim 10, wherein said thin-film layer comprises silicon oxide.
- 12. The method of claim 7, wherein an extruded coating layer of a thermoadhesive resin is further formed on the substrate on its side on which said thin-film layer is not formed.
- 13. The method of claim 1, wherein said step of forming said extruded coating layer includes a substep of extruding said extruded coating layer onto said heat buffer layer at an extrusion temperature higher than 250.degree. C.
- 14. The method of claim 7, wherein said step of forming said extruded coating layer includes a substep of extruding said extruded coating layer onto said anchor coat layer at an extrusion temperature higher than 250.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-244538 |
Sep 1990 |
JPX |
|
Parent Case Info
This application is a continuation of U.S. patent application Ser. No. 07/757,569, filed Sep. 11, 1991, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4424256 |
Christensen et al. |
Jan 1984 |
|
4488924 |
Krieg |
Dec 1984 |
|
4894291 |
Ofstein |
Jan 1990 |
|
Foreign Referenced Citations (10)
Number |
Date |
Country |
0187512 |
Mar 1990 |
EPX |
48-14663 |
May 1973 |
JPX |
49-034984 |
Mar 1974 |
JPX |
51-48511 |
Dec 1976 |
JPX |
53-42310 |
Oct 1978 |
JPX |
63-64638 |
Apr 1988 |
JPX |
1-62032 |
Apr 1989 |
JPX |
1-62033 |
Apr 1989 |
JPX |
1202436 |
Aug 1989 |
JPX |
30615304 |
Mar 1991 |
JPX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
757569 |
Sep 1991 |
|