Claims
- 1. A method for treating silicon carbide particles wherein after said treatment said silicon carbide particles are dispersed in an electrolytic bath for both composite electroplating and electroless plating of metals, said treatment comprising steps of:
- 1) washing silicon carbide particles with an organic solvent;
- 2) washing said silicon carbide particles of step (1) with an organic acid;
- 3) grinding said silicon carbide particles of step (2) and
- 4) heating the ground silicon carbide particles of step (3) in a nickel-containing solution to boiling for a predetermined period of time.
- 2. The method according to claim 1 wherein said silicon carbide particles of Step (2) are ground for 10 to 120 hours with a grinding medium formed of silicon carbide particles, said silicon carbide particles of said grinding medium having a particle diameter of 2 to 10 mm.
- 3. The method according to claim 2 wherein the silicon carbide particles of Step (2) are ground to have an average diameter of 1.2 to 1.3 .mu.m.
- 4. The method according to claim 1 wherein said ground silicon carbide particles of step (3) are heated in nickel sulfate solution of a concentration of 0.2 to 0.5 mole/l to boiling for 1 to 3 hours.
Parent Case Info
This is a continuation of application Ser. No. 07/941,559, filed Aug. 31, 1992, now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2110328 |
Feb 1971 |
DEX |
57-71812 |
May 1982 |
JPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
941559 |
Aug 1992 |
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